公开(公告)号：US20140091344A1

公开(公告)日：2014-04-03

申请号：US13775824

申请日：2013-02-25

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Kuan-Chieh Wang ,  Cheng-Hung Yang

IPC: H01L33/64

CPC classification number: H01L33/64 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

Abstract: An illumination component package includes a substrate, at least one illumination component, a dam and an encapsulating glue. The illumination component is mounted on the substrate. The dam surrounds the illumination component to form a accommodating space. The inner wall of the dam includes a plurality of glue adhering microstructures. The encapsulating glue is filled in the accommodating space.

Abstract translation: 照明部件封装包括基板，至少一个照明部件，坝和封装胶。 照明部件安装在基板上。 大坝围绕照明部件以形成容纳空间。 坝的内壁包括多个胶粘附微结构。 封装胶填充在容纳空间中。

公开(公告)号：US20150214442A1

公开(公告)日：2015-07-30

申请号：US14294214

申请日：2014-06-03

Applicant: Lextar Electronics Corporation

Inventor： Ching-Chi Chiang ,  Yung-Yi Liao ,  Wei-Yi Hsu ,  Cheng-Hung Yang

IPC: H01L33/50 ,  H01L33/00 ,  H01L33/56 ,  H01L27/15

CPC classification number: H01L33/0095 ,  H01L33/507 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A light emitting diode (LED) package structure is provided. The LED package structure comprises a substrate, at least one LED chip, an encapsulating compound and a curing material. The substrate has a first surface and a second surface opposite to the first surface. The LED chip is disposed on the first surface. The encapsulating compound covers the LED chip. The encapsulating compound has a plurality of particulate phosphors therein. The phosphors are centralized near a side of the encapsulating compound away from the substrate. The curing material is adhered to the side of the encapsulating compound away from the substrate.

Abstract translation: 提供了一种发光二极管（LED）封装结构。 LED封装结构包括衬底，至少一个LED芯片，封装化合物和固化材料。 基板具有与第一表面相对的第一表面和第二表面。 LED芯片设置在第一表面上。 封装化合物覆盖LED芯片。 封装化合物在其中具有多个颗粒状荧光体。 荧光体集中在封装化合物的远离衬底的一侧。 固化材料粘附到封装化合物的远离基底的一侧。