公开(公告)号：US09212790B2

公开(公告)日：2015-12-15

申请号：US14336420

申请日：2014-07-21

Applicant: Lextar Electronics Corporation

Inventor： Ching-Chi Chiang ,  Kun-Hsiung Wang ,  Chien-Hsin Tu

IPC: H01R33/06 ,  F21K99/00 ,  F21V17/00 ,  F21Y101/02 ,  H01R33/09

CPC classification number: F21K9/1355 ,  F21K9/23 ,  F21V17/002 ,  F21Y2101/00 ,  H01R33/06 ,  H01R33/09

Abstract: A light-emitting diode includes an electrical connecting base, a lamp holder, a power driving module, an adapter plate and a lamp plate. One end of the lamp holder is connected to the electrical connecting base and the other end of the lamp holder is configured to be a supporting surface. The electrical connecting base and the lamp holder form an accommodation space which accommodates the power driving module. The adapter plate has a first surface and a second surface opposite to each other. The first surface is contacted with the supporting surface and the second surface includes a first connector which has a plugging direction parallel to the second surface. The lamp plate has a second connector which is detachably plugged to the first connector, so as to be disposed on the adapter plate.

Abstract translation: 发光二极管包括电连接基座，灯座，电源驱动模块，适配器板和灯板。 灯座的一端连接到电连接基座，并且灯座的另一端构造为支撑表面。 电连接基座和灯座形成容纳动力驱动模块的容置空间。 适配板具有彼此相对的第一表面和第二表面。 第一表面与支撑表面接触，并且第二表面包括具有平行于第二表面的堵塞方向的第一连接器。 灯板具有可拆卸地插入第一连接器的第二连接器，以便设置在适配器板上。

公开(公告)号：US20150214442A1

公开(公告)日：2015-07-30

申请号：US14294214

申请日：2014-06-03

Applicant: Lextar Electronics Corporation

Inventor： Ching-Chi Chiang ,  Yung-Yi Liao ,  Wei-Yi Hsu ,  Cheng-Hung Yang

IPC: H01L33/50 ,  H01L33/00 ,  H01L33/56 ,  H01L27/15

CPC classification number: H01L33/0095 ,  H01L33/507 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A light emitting diode (LED) package structure is provided. The LED package structure comprises a substrate, at least one LED chip, an encapsulating compound and a curing material. The substrate has a first surface and a second surface opposite to the first surface. The LED chip is disposed on the first surface. The encapsulating compound covers the LED chip. The encapsulating compound has a plurality of particulate phosphors therein. The phosphors are centralized near a side of the encapsulating compound away from the substrate. The curing material is adhered to the side of the encapsulating compound away from the substrate.

Abstract translation: 提供了一种发光二极管（LED）封装结构。 LED封装结构包括衬底，至少一个LED芯片，封装化合物和固化材料。 基板具有与第一表面相对的第一表面和第二表面。 LED芯片设置在第一表面上。 封装化合物覆盖LED芯片。 封装化合物在其中具有多个颗粒状荧光体。 荧光体集中在封装化合物的远离衬底的一侧。 固化材料粘附到封装化合物的远离基底的一侧。

公开(公告)号：US12038156B2

公开(公告)日：2024-07-16

申请号：US18203984

申请日：2023-05-31

Applicant: Lextar Electronics Corporation

Inventor： Shu-Wei Chen ,  Jia-Jhang Kuo ,  Ching-Chi Chiang

IPC: F21V19/00 ,  F21V3/02 ,  F21V7/00 ,  F21V17/10

CPC classification number: F21V19/0065 ,  F21V3/02 ,  F21V7/0058 ,  F21V17/101

Abstract: A light source module is provided. The light source module includes a lead frame, a light source, a cup part, and a reflector. The light source is disposed on the lead frame, wherein the light source provides a light. The cup part is disposed on the lead frame, wherein the cup part includes an opening, a plurality of thick-wall portions and a plurality of thin-wall portions. The thick-wall portions and the thin-wall portions surround the light source and define a space. The reflector covers the opening. At least a portion of the light is reflected by the reflector, and is emitted through the thick-wall portions and the thin-wall portions.