公开(公告)号：US10811396B2

公开(公告)日：2020-10-20

申请号：US16252690

申请日：2019-01-20

Applicant: Lextar Electronics Corporation

Inventor： Cheng-Yu Tsai ,  Jian-Chin Liang ,  Jo-Hsiang Chen

IPC: H01J1/62 ,  H01J63/04 ,  G02B5/02 ,  G02F1/1335 ,  G02B5/30 ,  H01L25/075 ,  G02B1/11 ,  H01L33/58 ,  H01L33/48

Abstract: A display device includes a substrate, a light-emitting member, and an anti-reflective glass layer. The light-emitting member is on the substrate. The anti-reflective glass layer is over the light-emitting member, and the anti-reflective glass layer has a transmittance of 40-95%. The anti-reflective glass layer includes a glass layer and a light-absorbing layer. The glass layer has a rough top surface and a haze of 70-80%. The light-absorbing layer is on the rough top surface of glass layer.

公开(公告)号：US11778845B2

公开(公告)日：2023-10-03

申请号：US17663431

申请日：2022-05-15

Applicant: Lextar Electronics Corporation

Inventor： Hui-Ru Wu ,  Jian-Chin Liang ,  Jo-Hsiang Chen ,  Lung-Kuan Lai ,  Cheng-Yu Tsai ,  Hsin-Lun Su ,  Ting-Kai Chen

IPC: H10K50/125 ,  H01L33/60 ,  H10K50/856 ,  H10K50/86 ,  H10K50/80

CPC classification number: H10K50/125 ,  H01L33/60 ,  H10K50/856 ,  H10K50/865 ,  H10K50/868

Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.

公开(公告)号：US11367849B2

公开(公告)日：2022-06-21

申请号：US16232041

申请日：2018-12-25

Applicant: Lextar Electronics Corporation

Inventor： Hui-Ru Wu ,  Jian-Chin Liang ,  Jo-Hsiang Chen ,  Lung-Kuan Lai ,  Cheng-Yu Tsai ,  Hsin-Lun Su ,  Ting-Kai Chen

IPC: H01L51/50 ,  H01L51/52 ,  H01L33/60

Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.