公开(公告)号：US11296269B2

公开(公告)日：2022-04-05

申请号：US16944131

申请日：2020-07-30

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao Lin ,  Jo-Hsiang Chen ,  Shih-Lun Lai ,  Min-Che Tsai ,  Jian-Chin Liang

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/00

Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, a micro light emitting element, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting element is disposed on the first adhesive layer. The micro light emitting element has a first surface facing to the first adhesive layer and a second surface opposite to the first surface. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting element and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A total thickness of the flexible substrate, the first adhesive layer, the redistribution layer, and the electrode pad is less than 200 um.

公开(公告)号：US10386629B2

公开(公告)日：2019-08-20

申请号：US15729649

申请日：2017-10-10

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao Lin ,  Hui-Ru Wu ,  Jo-Hsiang Chen ,  Tzong-Liang Tsai

IPC: F21V9/30 ,  G02B5/26 ,  G02B5/28 ,  G02B26/00 ,  F21Y115/10

Abstract: A light-enhancement device includes a wavelength conversion member and a wavelength controlling element. The wavelength conversion member includes a light-transmissive substrate and wavelength conversion material which is disposed within the light-transmissive substrate for converting a portion of light with a first wavelength into another light with a second wavelength. The wavelength controlling element is disposed on a surface of the light-transmissive substrate for reflecting another portion of the light with the first wavelength into the light-transmissive substrate and enabling the portion of the light with the second wavelength to pass through the wavelength controlling element. A roughness of the surface of the light-transmissive substrate facing towards the wavelength controlling element is configured to be 0-1 μm.

公开(公告)号：US11778845B2

公开(公告)日：2023-10-03

申请号：US17663431

申请日：2022-05-15

Applicant: Lextar Electronics Corporation

Inventor： Hui-Ru Wu ,  Jian-Chin Liang ,  Jo-Hsiang Chen ,  Lung-Kuan Lai ,  Cheng-Yu Tsai ,  Hsin-Lun Su ,  Ting-Kai Chen

IPC: H10K50/125 ,  H01L33/60 ,  H10K50/856 ,  H10K50/86 ,  H10K50/80

CPC classification number: H10K50/125 ,  H01L33/60 ,  H10K50/856 ,  H10K50/865 ,  H10K50/868

Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.

公开(公告)号：US11664483B2

公开(公告)日：2023-05-30

申请号：US17078098

申请日：2020-10-23

Applicant: Lextar Electronics Corporation

Inventor： Shiou-Yi Kuo ,  Jian-Chin Liang ,  Jo-Hsiang Chen ,  Chih-Hao Lin

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/54 ,  H01L25/075 ,  H01L25/16 ,  H01L33/50 ,  H01L33/38 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L33/005 ,  H01L33/54 ,  H01L2933/005 ,  H01L2933/0066

Abstract: A light-emitting device includes a micro light-emitting diode chip (micro LED chip), a first electrical connecting layer, a second electrical connecting layer and a housing layer. The micro LED chip includes a light exit surface, a bottom surface opposite to the light exit surface and first and second electrodes located on the bottom surface. The first and second electrical connecting layers respectively connect to the first and second electrodes and extend along two opposite sidewalls to two sides of a perimeter of the light exit surface. The housing layer encloses the micro LED chip and the first and second electrical connecting layer. The light exit surface of the micro LED chip and top surfaces of the first and second electrical connecting layers are not enclosed by the housing layer.

公开(公告)号：US11610875B2

公开(公告)日：2023-03-21

申请号：US17100933

申请日：2020-11-22

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao Lin ,  Jian-Chin Liang ,  Chien-Nan Yeh ,  Shih-Lun Lai ,  Jo-Hsiang Chen

IPC: H01L29/205 ,  H01L33/00 ,  H01L25/16 ,  H01L33/62 ,  H01L33/60

Abstract: Disclosed is a light-emitting array structure having a substrate, a plurality of light-emitting pixel units, a plurality of first signal wires, a plurality of second signal wires, and an encapsulating layer. The light-emitting pixel units are arranged in array on the substrate. Each light-emitting pixel unit includes a driving chip, a first flat layer, a first redistribution layer, a second flat layer, a second redistribution layer, and a light-emitting diode. Each first signal wire is electrically connected to a corresponding one of the first redistribution layers and extends in a first direction. The second signal wires extend in a level different from the first signal wires. Each second signal wire is electrically connected to a corresponding one of the second redistribution layers and extends in a second direction different from the first direction. The encapsulating layer covers the light-emitting pixel units, the first and second signal wires, and the substrate.

公开(公告)号：US11949056B2

公开(公告)日：2024-04-02

申请号：US18303578

申请日：2023-04-20

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao Lin ,  Jo-Hsiang Chen ,  Shih-Lun Lai ,  Min-Che Tsai ,  Jian-Chin Liang

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/58

CPC classification number: H01L33/62 ,  H01L33/0095 ,  H01L33/58 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, micro light emitting elements, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting elements are disposed on the first adhesive layer and have a first surface facing to the first adhesive layer and an opposing second surface. The micro light emitting elements include a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting elements and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A thickness of the flexible substrate is less than 100 um.

公开(公告)号：US11948497B2

公开(公告)日：2024-04-02

申请号：US17446459

申请日：2021-08-30

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao Lin ,  Chien-Nan Yeh ,  Jo-Hsiang Chen ,  Shih-Lun Lai

IPC: G09G3/20 ,  C09K11/02 ,  G09G3/32 ,  H10K59/35 ,  H10K59/38

CPC classification number: G09G3/32 ,  G09G3/2014 ,  G09G3/2074 ,  G09G2320/0242 ,  G09G2330/12

Abstract: A display device includes a plurality of sub-pixels. The sub-pixels include a first sub-pixel and a second sub-pixel. The first sub-pixel includes a first light emitting element and a first control circuit. The first control circuit is configured to provide a first driving current to the first light emitting element. The second sub-pixel includes a second light emitting element and a second control circuit. The second control circuit is configured to provide a second driving current to the second light emitting element. The first control circuit and the second control circuit are configured to differently control pulse amplitude of the first driving current and pulse amplitude of the second driving current, such that both of the first light emitting element and the second light emitting element emit at a target wavelength or a color point range (e.g. +/−1.5˜2 nm).

公开(公告)号：US09732940B2

公开(公告)日：2017-08-15

申请号：US14337648

申请日：2014-07-22

Applicant: Lextar Electronics Corporation

Inventor： Kuang-Neng Yang ,  Kun-Hua Wu ,  Jo-Hsiang Chen ,  Tai-Hua Ho ,  Tzong-Liang Tsai ,  Chih-Hao Lin

IPC: F21V9/16 ,  F21K9/20 ,  F21K9/64 ,  F21Y103/00 ,  F21Y115/10

CPC classification number: F21V9/30 ,  F21K9/20 ,  F21K9/64 ,  F21Y2103/00 ,  F21Y2115/10

Abstract: A lighting apparatus includes a wavelength converting apparatus. The wavelength converting apparatus includes a hollow tube and a wavelength converting material. The hollow tube has an accommodating chamber. The wavelength converting material is positioned in the accommodating chamber.

公开(公告)号：US12206059B2

公开(公告)日：2025-01-21

申请号：US17666513

申请日：2022-02-07

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao Lin ,  Wei-Yuan Ma ,  Jo-Hsiang Chen

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/00 ,  H01L33/54

Abstract: A light emitting element package includes a first substrate, at least one light emitting element, an encapsulation layer, and a plurality of conductive pads. The first substrate has an upper surface and a lower surface opposite to each other, in which an edge of the lower surface has a notch. The at least one light emitting element is disposed on the upper surface of the first substrate, in which the light emitting element has a positive electrode and a negative electrode. The encapsulation layer covers the light emitting element. The plurality of conductive pads are disposed on the lower surface of the first substrate and electrically connected to the positive electrode and the negative electrode of the light emitting element, respectively.

公开(公告)号：US12094861B2

公开(公告)日：2024-09-17

申请号：US17313023

申请日：2021-05-06

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao Lin ,  Jian-Chin Liang ,  Chien-Nan Yeh ,  Shih-Lun Lai ,  Jo-Hsiang Chen

IPC: H01L29/205 ,  H01L23/00 ,  H01L25/16 ,  H01L33/00 ,  H01L33/60

CPC classification number: H01L25/167 ,  H01L24/24 ,  H01L24/25 ,  H01L25/162 ,  H01L33/60 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/25174 ,  H01L2924/12041 ,  H01L2924/1426

Abstract: Disclosed is a light-emitting array structure having a substrate, a plurality of light-emitting pixel units, a plurality of first and second signal wires, and an encapsulating layer. The light-emitting pixel units are arranged in array on the substrate. Each light-emitting pixel unit includes a driving chip, a first flat layer, a first redistribution layer, a second flat layer, a second redistribution layer, and a light-emitting diode. Each first signal wire is electrically connected to a corresponding one of the first redistribution layers and extends in a first direction. The second signal wires extend in a level different from the first signal wires. Each second signal wire is electrically connected to a corresponding one of the second redistribution layers and extends in a second direction different from the first direction. The encapsulating layer covers the light-emitting pixel units, the first and second signal wires, and the substrate.