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公开(公告)号:USD995454S1
公开(公告)日:2023-08-15
申请号:US29755332
申请日:2020-10-20
Applicant: Lextar Electronics Corporation
Designer: Ting-Kai Chen , Lung-Kuan Lai
Abstract: FIG. 1 is a front, top, right perspective view of a light emitting diode module showing a first embodiment of our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a partial enlarged view thereof, as labeled with symbol 8 in FIG. 1;
FIG. 9 is a partial enlarged view thereof, as labeled with symbol 9 in FIG. 2;
FIG. 10 is a front, top, right perspective view of a light emitting diode module showing a second embodiment of our new design;
FIG. 11 is a front elevational view thereof;
FIG. 12 is a rear elevational view thereof;
FIG. 13 is a left side elevational view thereof;
FIG. 14 is a right side elevational view thereof;
FIG. 15 is a top plan view thereof;
FIG. 16 is a bottom plan view thereof;
FIG. 17 is a partial enlarged view thereof, as labeled with symbol 17 in FIG. 10;
FIG. 18 is a partial enlarged view thereof, as labeled with symbol 18 in FIG. 11;
FIG. 19 is a front, top, right perspective view of a light emitting diode module showing a third embodiment of our new design;
FIG. 20 is a front elevational view thereof;
FIG. 21 is a rear elevational view thereof;
FIG. 22 is a left side elevational view thereof;
FIG. 23 is a right side elevational view thereof;
FIG. 24 is a top plan view thereof;
FIG. 25 is a bottom plan view thereof;
FIG. 26 is a partial enlarged view thereof, as labeled with symbol 26 in FIG. 19; and,
FIG. 27 is a partial enlarged view thereof, as labeled with symbol 27 in FIG. 20.-
公开(公告)号:US11656497B2
公开(公告)日:2023-05-23
申请号:US17329140
申请日:2021-05-25
Applicant: Lextar Electronics Corporation
Inventor: Lung-Kuan Lai , Ting-Kai Chen , Jiun-Hong Lin
IPC: G02F1/1335 , G02F1/13357
CPC classification number: G02F1/133607 , G02F1/133603 , G02F1/133611
Abstract: An optical lens includes an optical transparent body which has an upper surface, a lower surface, a lateral surface and a lower concave portion. The upper surface includes a central upper concave portion, an outwardly-concave curved surface continuous from the central upper concave portion, and an inwardly-concave curved surface continuous from the outwardly-concave curved surface. The lateral surface is connected between the inwardly-concave curved surface and the lower surface. The lower concave portion is recessed from the lower surface.
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公开(公告)号:US11367849B2
公开(公告)日:2022-06-21
申请号:US16232041
申请日:2018-12-25
Applicant: Lextar Electronics Corporation
Inventor: Hui-Ru Wu , Jian-Chin Liang , Jo-Hsiang Chen , Lung-Kuan Lai , Cheng-Yu Tsai , Hsin-Lun Su , Ting-Kai Chen
Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.
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公开(公告)号:US11778845B2
公开(公告)日:2023-10-03
申请号:US17663431
申请日:2022-05-15
Applicant: Lextar Electronics Corporation
Inventor: Hui-Ru Wu , Jian-Chin Liang , Jo-Hsiang Chen , Lung-Kuan Lai , Cheng-Yu Tsai , Hsin-Lun Su , Ting-Kai Chen
IPC: H10K50/125 , H01L33/60 , H10K50/856 , H10K50/86 , H10K50/80
CPC classification number: H10K50/125 , H01L33/60 , H10K50/856 , H10K50/865 , H10K50/868
Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.
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公开(公告)号:US11271371B2
公开(公告)日:2022-03-08
申请号:US16984176
申请日:2020-08-04
Applicant: Lextar Electronics Corporation
Inventor: Ting-Kai Chen , Lung-Kuan Lai , Jian-Chin Liang
IPC: H01S5/40 , H01S5/02255 , H01S5/02257
Abstract: A light emitting device includes an edge emitting laser chip and a reflecting mirror. The edge emitting laser chip has light emitting ports arranged in parallel in a first direction. The light emitting ports emit light beams in a second direction. The reflecting mirror includes a reflecting surface used to reflect the light beams to a third direction. The first, second and third direction are perpendicular to each other. The light beams are emitted to the reflecting surface through the virtual incident plane and project first light spots on the reflecting surface. Each projected light spot has a first axis length in the first direction and a third axis length in the third direction. An interval between two immediately-adjacent light emitting ports is greater than the first axis length of one of the two projected light spots aligned with the two immediately-adjacent light emitting ports.
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