Light emitting diode module
    1.
    外观设计

    公开(公告)号:USD995454S1

    公开(公告)日:2023-08-15

    申请号:US29755332

    申请日:2020-10-20

    Abstract: FIG. 1 is a front, top, right perspective view of a light emitting diode module showing a first embodiment of our new design;
    FIG. 2 is a front elevational view thereof;
    FIG. 3 is a rear elevational view thereof;
    FIG. 4 is a left side elevational view thereof;
    FIG. 5 is a right side elevational view thereof;
    FIG. 6 is a top plan view thereof;
    FIG. 7 is a bottom plan view thereof;
    FIG. 8 is a partial enlarged view thereof, as labeled with symbol 8 in FIG. 1;
    FIG. 9 is a partial enlarged view thereof, as labeled with symbol 9 in FIG. 2;
    FIG. 10 is a front, top, right perspective view of a light emitting diode module showing a second embodiment of our new design;
    FIG. 11 is a front elevational view thereof;
    FIG. 12 is a rear elevational view thereof;
    FIG. 13 is a left side elevational view thereof;
    FIG. 14 is a right side elevational view thereof;
    FIG. 15 is a top plan view thereof;
    FIG. 16 is a bottom plan view thereof;
    FIG. 17 is a partial enlarged view thereof, as labeled with symbol 17 in FIG. 10;
    FIG. 18 is a partial enlarged view thereof, as labeled with symbol 18 in FIG. 11;
    FIG. 19 is a front, top, right perspective view of a light emitting diode module showing a third embodiment of our new design;
    FIG. 20 is a front elevational view thereof;
    FIG. 21 is a rear elevational view thereof;
    FIG. 22 is a left side elevational view thereof;
    FIG. 23 is a right side elevational view thereof;
    FIG. 24 is a top plan view thereof;
    FIG. 25 is a bottom plan view thereof;
    FIG. 26 is a partial enlarged view thereof, as labeled with symbol 26 in FIG. 19; and,
    FIG. 27 is a partial enlarged view thereof, as labeled with symbol 27 in FIG. 20.

    Pixel array package structure and display panel

    公开(公告)号:US11367849B2

    公开(公告)日:2022-06-21

    申请号:US16232041

    申请日:2018-12-25

    Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.

    Light emitting device and light emitting module

    公开(公告)号:US11271371B2

    公开(公告)日:2022-03-08

    申请号:US16984176

    申请日:2020-08-04

    Abstract: A light emitting device includes an edge emitting laser chip and a reflecting mirror. The edge emitting laser chip has light emitting ports arranged in parallel in a first direction. The light emitting ports emit light beams in a second direction. The reflecting mirror includes a reflecting surface used to reflect the light beams to a third direction. The first, second and third direction are perpendicular to each other. The light beams are emitted to the reflecting surface through the virtual incident plane and project first light spots on the reflecting surface. Each projected light spot has a first axis length in the first direction and a third axis length in the third direction. An interval between two immediately-adjacent light emitting ports is greater than the first axis length of one of the two projected light spots aligned with the two immediately-adjacent light emitting ports.

Patent Agency Ranking