公开(公告)号：US09818915B2

公开(公告)日：2017-11-14

申请号：US15281229

申请日：2016-09-30

Applicant: Lextar Electronics Corporation

Inventor： Chia-En Lee ,  Chia-Hung Hou

IPC: H01L27/15 ,  H01L33/50 ,  H01L25/075 ,  H01L21/683 ,  H01L33/08 ,  H01L33/56 ,  H01L33/00

CPC classification number: H01L33/502 ,  H01L21/6835 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/0079 ,  H01L33/08 ,  H01L33/504 ,  H01L33/56 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

Abstract: A manufacturing method of a LED display is provided. A temporary substrate is provided, wherein the temporary substrate has a first adhesive layer and a plurality of first, second and third LED chips mounted on the first adhesive layer. A first transparent substrate is provided, the transparent substrate has a plurality of pixels disposed thereon, and each of the pixels comprises a first sub-pixel, a second sub-pixel and a third sub-pixel respectively surrounded by a light-insulating structure. Then, the temporary substrate and the first transparent substrate are bonded together, such that each of the first, second and third LED chips is correspondingly mounted in each of the first sub-pixels, the second sub-pixels and the third sub-pixels. After that, the temporary substrate is removed. A LED display manufactured by said method is also provided.

公开(公告)号：US20170018691A1

公开(公告)日：2017-01-19

申请号：US15281229

申请日：2016-09-30

Applicant: Lextar Electronics Corporation

Inventor： Chia-En Lee ,  Chia-Hung Hou

IPC: H01L33/50 ,  H01L33/56 ,  H01L25/075 ,  H01L33/08

CPC classification number: H01L33/502 ,  H01L21/6835 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/0079 ,  H01L33/08 ,  H01L33/504 ,  H01L33/56 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

Abstract: A manufacturing method of a LED display is provided. A temporary substrate is provided, wherein the temporary substrate has a first adhesive layer and a plurality of first, second and third LED chips mounted on the first adhesive layer. A first transparent substrate is provided, the transparent substrate has a plurality of pixels disposed thereon, and each of the pixels comprises a first sub-pixel, a second sub-pixel and a third sub-pixel respectively surrounded by a light-insulating structure. Then, the temporary substrate and the first transparent substrate are bonded together, such that each of the first, second and third LED chips is correspondingly mounted in each of the first sub-pixels, the second sub-pixels and the third sub-pixels. After that, the temporary substrate is removed. A LED display manufactured by said method is also provided.

Abstract translation: 提供了一种LED显示器的制造方法。 提供了一种临时衬底，其中临时衬底具有第一粘合剂层和安装在第一粘合剂层上的多个第一，第二和第三LED芯片。 提供第一透明衬底，透明衬底具有设置在其上的多个像素，并且每个像素包括分别由光隔离结构包围的第一子像素，第二子像素和第三子像素。 然后，将临时基板和第一透明基板接合在一起，使得第一，第二和第三LED芯片中的每一个相应地安装在每个第一子像素，第二子像素和第三子像素中。 之后，移除临时衬底。 还提供了通过所述方法制造的LED显示器。

公开(公告)号：US20140312368A1

公开(公告)日：2014-10-23

申请号：US14219035

申请日：2014-03-19

Applicant: Lextar Electronics Corporation

Inventor： Chia-En Lee ,  Chia-Hung Hou

IPC: H01L33/00 ,  H01L33/50 ,  H01L27/15

CPC classification number: H01L33/502 ,  H01L21/6835 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/0079 ,  H01L33/08 ,  H01L33/504 ,  H01L33/56 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

Abstract: A manufacturing method of a LED display is provided. A temporary substrate is provided, wherein the temporary substrate has a first adhesive layer and a plurality of first, second and third LED chips mounted on the first adhesive layer. A first transparent substrate is provided, the transparent substrate has a plurality of pixels disposed thereon, and each of the pixels comprises a first sub-pixel, a second sub-pixel and a third sub-pixel respectively surrounded by a light-insulating structure. Then, the temporary substrate and the first transparent substrate are bonded together, such that each of the first, second and third LED chips is correspondingly mounted in each of the first sub-pixels, the second sub-pixels and the third sub-pixels. After that, the temporary substrate is removed. A LED display manufactured by said method is also provided.

Abstract translation: 提供了一种LED显示器的制造方法。 提供了一种临时衬底，其中临时衬底具有第一粘合剂层和安装在第一粘合剂层上的多个第一，第二和第三LED芯片。 提供第一透明衬底，透明衬底具有设置在其上的多个像素，并且每个像素包括分别由光隔离结构包围的第一子像素，第二子像素和第三子像素。 然后，将临时基板和第一透明基板接合在一起，使得第一，第二和第三LED芯片中的每一个相应地安装在每个第一子像素，第二子像素和第三子像素中。 之后，移除临时衬底。 还提供了通过所述方法制造的LED显示器。

公开(公告)号：US09472733B2

公开(公告)日：2016-10-18

申请号：US14219035

申请日：2014-03-19

Applicant: Lextar Electronics Corporation

Inventor： Chia-En Lee ,  Chia-Hung Hou

IPC: H01L27/15 ,  H01L33/50 ,  H01L21/683 ,  H01L25/075 ,  H01L33/00

CPC classification number: H01L33/502 ,  H01L21/6835 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/0079 ,  H01L33/08 ,  H01L33/504 ,  H01L33/56 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

Abstract: A manufacturing method of a LED display is provided. A temporary substrate is provided, wherein the temporary substrate has a first adhesive layer and a plurality of first, second and third LED chips mounted on the first adhesive layer. A first transparent substrate is provided, the transparent substrate has a plurality of pixels disposed thereon, and each of the pixels comprises a first sub-pixel, a second sub-pixel and a third sub-pixel respectively surrounded by a light-insulating structure. Then, the temporary substrate and the first transparent substrate are bonded together, such that each of the first, second and third LED chips is correspondingly mounted in each of the first sub-pixels, the second sub-pixels and the third sub-pixels. After that, the temporary substrate is removed. A LED display manufactured by said method is also provided.

Abstract translation: 提供了一种LED显示器的制造方法。 提供了一种临时衬底，其中临时衬底具有第一粘合剂层和安装在第一粘合剂层上的多个第一，第二和第三LED芯片。 提供第一透明衬底，透明衬底具有设置在其上的多个像素，并且每个像素包括分别由光隔离结构包围的第一子像素，第二子像素和第三子像素。 然后，将临时基板和第一透明基板接合在一起，使得第一，第二和第三LED芯片中的每一个相应地安装在每个第一子像素，第二子像素和第三子像素中。 之后，移除临时衬底。 还提供了通过所述方法制造的LED显示器。

公开(公告)号：US09484506B2

公开(公告)日：2016-11-01

申请号：US14959026

申请日：2015-12-04

Applicant: Lextar Electronics Corporation

Inventor： Chia-En Lee ,  Chia-Hung Hou

IPC: H01L33/00 ,  H01L33/50 ,  H01L21/683 ,  H01L27/15 ,  H01L25/075

CPC classification number: H01L33/502 ,  H01L21/6835 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/0079 ,  H01L33/08 ,  H01L33/504 ,  H01L33/56 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

Abstract: A manufacturing method of a LED display is provided. A temporary substrate is provided, wherein the temporary substrate has a first adhesive layer and a plurality of first, second and third LED chips mounted on the first adhesive layer. A first transparent substrate is provided, the transparent substrate has a plurality of pixels disposed thereon, and each of the pixels comprises a first sub-pixel, a second sub-pixel and a third sub-pixel respectively surrounded by a light-insulating structure. Then, the temporary substrate and the first transparent substrate are bonded together, such that each of the first, second and third LED chips is correspondingly mounted in each of the first sub-pixels, the second sub-pixels and the third sub-pixels. After that, the temporary substrate is removed. A LED display manufactured by said method is also provided.

公开(公告)号：US20160087165A1

公开(公告)日：2016-03-24

申请号：US14959026

申请日：2015-12-04

Applicant: Lextar Electronics Corporation

Inventor： Chia-En Lee ,  Chia-Hung Hou

IPC: H01L33/50 ,  H01L27/15

CPC classification number: H01L33/502 ,  H01L21/6835 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/0079 ,  H01L33/08 ,  H01L33/504 ,  H01L33/56 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

Abstract: A manufacturing method of a LED display is provided. A temporary substrate is provided, wherein the temporary substrate has a first adhesive layer and a plurality of first, second and third LED chips mounted on the first adhesive layer. A first transparent substrate is provided, the transparent substrate has a plurality of pixels disposed thereon, and each of the pixels comprises a first sub-pixel, a second sub-pixel and a third sub-pixel respectively surrounded by a light-insulating structure. Then, the temporary substrate and the first transparent substrate are bonded together, such that each of the first, second and third LED chips is correspondingly mounted in each of the first sub-pixels, the second sub-pixels and the third sub-pixels. After that, the temporary substrate is removed. A LED display manufactured by said method is also provided.

Abstract translation: 提供了一种LED显示器的制造方法。 提供了一种临时衬底，其中临时衬底具有第一粘合剂层和安装在第一粘合剂层上的多个第一，第二和第三LED芯片。 提供第一透明衬底，透明衬底具有设置在其上的多个像素，并且每个像素包括分别由光隔离结构包围的第一子像素，第二子像素和第三子像素。 然后，将临时基板和第一透明基板接合在一起，使得第一，第二和第三LED芯片中的每一个相应地安装在每个第一子像素，第二子像素和第三子像素中。 之后，移除临时衬底。 还提供了通过所述方法制造的LED显示器。