公开(公告)号：US09054277B2

公开(公告)日：2015-06-09

申请号：US14248461

申请日：2014-04-09

Applicant: Lextar Electronics Corporation

Inventor： Chia-En Lee ,  Cheng-Hung Chen ,  Li-Chuan Lin

IPC: H01L33/62 ,  H01L33/42 ,  H01L33/38 ,  H01L23/00 ,  H01L33/20

CPC classification number: H01L33/42 ,  H01L24/13 ,  H01L33/20 ,  H01L33/385 ,  H01L33/62 ,  H01L2224/13027 ,  H01L2224/13101 ,  H01L2224/13339 ,  H01L2224/16227 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

Abstract: A light-emitting diode (LED) with a bump structure on a sidewall is provided. The LED comprises a substrate, an epitaxial structure, a first conductive bump, a second conductive bump, a first extended electrode and a second extended electrode. The substrate has a top surface, a first side surface and an inclined surface between the top surface and the first side surface. The epitaxial structure is disposed on the top surface of the substrate, and comprises a N-type semiconductor layer, a light-emitting layer, a P-type semiconductor layer, a transparent conductive layer, a P-electrode and a N-electrode. The first extended electrode and the second extended electrode connect the P-electrode and the N-electrode, extend through the inclined surface, and are electrically connected to the first and the second conductive bumps, respectively. A mounting structure comprises said LED, a sub-mount and a connector mounting the LED onto the sub-mount.

Abstract translation: 提供了一种在侧壁上具有凸块结构的发光二极管（LED）。 LED包括衬底，外延结构，第一导电凸块，第二导电凸块，第一延伸电极和第二延伸电极。 基板具有顶表面，第一侧表面和在顶表面和第一侧表面之间的倾斜表面。 外延结构设置在衬底的顶表面上，并且包括N型半导体层，发光层，P型半导体层，透明导电层，P电极和N电极。 第一延伸电极和第二延伸电极连接P电极和N电极，延伸穿过倾斜表面，并分别电连接到第一和第二导电凸块。 安装结构包括所述LED，子安装座和将LED安装到子座上的连接器。