公开(公告)号：US11670749B2

公开(公告)日：2023-06-06

申请号：US17653462

申请日：2022-03-03

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao Lin ,  Jo-Hsiang Chen ,  Shih-Lun Lai ,  Min-Che Tsai ,  Jian-Chin Liang

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/00

CPC classification number: H01L33/62 ,  H01L33/0095 ,  H01L33/58 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A method for manufacturing a light emitting diode packaging structure includes the operations below. A flexible substrate having a first surface and a second surface is provided. A carrier substrate is formed on the first surface. An adhesive layer is formed on the second surface. A micro light emitting element is formed on the adhesive layer. The micro light emitting element has a conductive pad thereon opposite to the adhesive layer. A redistribution layer is formed and covers the micro light emitting element and the adhesive layer, wherein the redistribution layer includes a circuit layer electrically connecting to the conductive pad and an insulating layer covering the circuit layer. An electrode pad is formed on the redistribution layer and electrically connected to the circuit layer, wherein a total thickness of the flexible substrate, the adhesive layer, the redistribution layer, and the electrode pad is less than 200 um.

公开(公告)号：US11296269B2

公开(公告)日：2022-04-05

申请号：US16944131

申请日：2020-07-30

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao Lin ,  Jo-Hsiang Chen ,  Shih-Lun Lai ,  Min-Che Tsai ,  Jian-Chin Liang

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/00

Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, a micro light emitting element, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting element is disposed on the first adhesive layer. The micro light emitting element has a first surface facing to the first adhesive layer and a second surface opposite to the first surface. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting element and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A total thickness of the flexible substrate, the first adhesive layer, the redistribution layer, and the electrode pad is less than 200 um.

公开(公告)号：US11949056B2

公开(公告)日：2024-04-02

申请号：US18303578

申请日：2023-04-20

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao Lin ,  Jo-Hsiang Chen ,  Shih-Lun Lai ,  Min-Che Tsai ,  Jian-Chin Liang

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/58

CPC classification number: H01L33/62 ,  H01L33/0095 ,  H01L33/58 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, micro light emitting elements, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting elements are disposed on the first adhesive layer and have a first surface facing to the first adhesive layer and an opposing second surface. The micro light emitting elements include a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting elements and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A thickness of the flexible substrate is less than 100 um.