公开(公告)号：US20150162510A1

公开(公告)日：2015-06-11

申请号：US14256991

申请日：2014-04-20

Applicant: Lextar Electronics Corporation

Inventor： Tsai-Yu CHEN ,  Chun-Wei Wang

IPC: H01L33/58 ,  H01L33/62 ,  H01L33/60 ,  H01L27/15 ,  H01L33/50

CPC classification number: H01L33/56 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/46 ,  H01L33/50 ,  H01L33/52 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting diode module includes a lead frame, a first light emitting diode chip, a second light emitting diode chip, an encapsulant, and a lens structure. The lead frame has a die-bonding surface and a side wall together defining an accommodating recess. The encapsulant is filled in the accommodating recess, and covers the first and the second light emitting diode chips. The lens structure disposed on the lead frame has a bottom surface, a reflective surface, a first, a second, a third, and a fourth light emitting curved surface. The light emitting curved surfaces are respectively disposed opposite to the bottom surface. An adjacent position among the light emitting curved surfaces is a lowest point nearest to the bottom surface. The first and the second light emitting diode chips are disposed at the projections of the first and the second light emitting curved surface on the die-bonding surface.

Abstract translation: 发光二极管模块包括引线框架，第一发光二极管芯片，第二发光二极管芯片，密封剂和透镜结构。 引线框架具有芯片接合表面和侧壁，共同限定了容纳凹部。 密封剂填充在容纳凹部中，并且覆盖第一和第二发光二极管芯片。 设置在引线框架上的透镜结构具有底表面，反射表面，第一，第二，第三和第四发光弯曲表面。 发光曲面分别设置为与底面相对。 发光曲面中的相邻位置是最靠近底面的最低点。 第一和第二发光二极管芯片设置在芯片接合表面上的第一和第二发光弯曲表面的突起处。