Near-Field Transducers For Focusing Light
    2.
    发明申请
    Near-Field Transducers For Focusing Light 有权
    用于聚焦光的近场传感器

    公开(公告)号:US20100123965A1

    公开(公告)日:2010-05-20

    申请号:US12272984

    申请日:2008-11-18

    IPC分类号: G11B5/02

    摘要: An apparatus includes a waveguide shaped to direct light to a focal point, and a near-field transducer positioned adjacent to the focal point, wherein the near-field transducer includes a dielectric component and a metallic component positioned adjacent to at least a portion of the dielectric component. An apparatus includes a waveguide shaped to direct light to a focal point, and a near-field transducer positioned adjacent to the focal point, wherein the near-field transducer includes a first metallic component, a first dielectric layer positioned adjacent to at least a portion of the first metallic component, and a second metallic component positioned adjacent to at least a portion of the first dielectric component.

    摘要翻译: 一种装置包括成形为将光引导到焦点的波导和邻近焦点定位的近场换能器,其中近场换能器包括介电部件和金属部件,该金属部件邻近至少一部分 介电元件。 一种装置包括成形为将光引导到焦点的波导和邻近焦点定位的近场换能器,其中近场换能器包括第一金属部件,第一介电层位于与至少一部分 的第一金属部件和与第一介电部件的至少一部分相邻定位的第二金属部件。

    Near-Field Transducers for Focusing Light
    3.
    发明申请
    Near-Field Transducers for Focusing Light 有权
    用于聚焦光的近场传感器

    公开(公告)号:US20120314549A1

    公开(公告)日:2012-12-13

    申请号:US13590214

    申请日:2012-08-21

    IPC分类号: G11B11/00

    摘要: An apparatus includes a waveguide shaped to direct light to a focal point, and a near-field transducer positioned adjacent to the focal point, wherein the near-field transducer includes a dielectric component and a metallic component positioned adjacent to at least a portion of the dielectric component. An apparatus includes a waveguide shaped to direct light to a focal point, and a near-field transducer positioned adjacent to the focal point, wherein the near-field transducer includes a first metallic component, a first dielectric layer positioned adjacent to at least a portion of the first metallic component, and a second metallic component positioned adjacent to at least a portion of the first dielectric component.

    摘要翻译: 一种装置包括成形为将光引导到焦点的波导和邻近焦点定位的近场换能器,其中近场换能器包括介电部件和金属部件,该金属部件邻近至少一部分 介电元件。 一种装置包括成形为将光引导到焦点的波导和邻近焦点定位的近场换能器,其中近场换能器包括第一金属部件,第一介电层位于与至少一部分 的第一金属部件和与第一介电部件的至少一部分相邻定位的第二金属部件。

    Near-field transducers for focusing light
    4.
    发明授权
    Near-field transducers for focusing light 有权
    用于聚焦光的近场换能器

    公开(公告)号:US08248891B2

    公开(公告)日:2012-08-21

    申请号:US12272984

    申请日:2008-11-18

    IPC分类号: G11B11/00

    摘要: An apparatus includes a waveguide shaped to direct light to a focal point, and a near-field transducer positioned adjacent to the focal point, wherein the near-field transducer includes a dielectric component and a metallic component positioned adjacent to at least a portion of the dielectric component. An apparatus includes a waveguide shaped to direct light to a focal point, and a near-field transducer positioned adjacent to the focal point, wherein the near-field transducer includes a first metallic component, a first dielectric layer positioned adjacent to at least a portion of the first metallic component, and a second metallic component positioned adjacent to at least a portion of the first dielectric component.

    摘要翻译: 一种装置包括成形为将光引导到焦点的波导和邻近焦点定位的近场换能器,其中近场换能器包括介电部件和金属部件,该金属部件邻近至少一部分 介电元件。 一种装置包括成形为将光引导到焦点的波导和邻近焦点定位的近场换能器,其中近场换能器包括第一金属部件,第一介电层位于与至少一部分 的第一金属部件和与第一介电部件的至少一部分相邻定位的第二金属部件。

    Gate etch process
    7.
    发明授权
    Gate etch process 有权
    门蚀刻工艺

    公开(公告)号:US06699795B1

    公开(公告)日:2004-03-02

    申请号:US10099841

    申请日:2002-03-15

    IPC分类号: H01L21302

    摘要: A method of making a semiconductor structure includes etching an anti-reflective coating layer at a pressure of 10 millitorr or less; etching a nitride layer with a first nitride etch plasma having a first F:C ratio; and etching the nitride layer with a second nitride etch plasma having a second F:C ratio. The first F:C ratio is greater than the second F:C ratio.

    摘要翻译: 制造半导体结构的方法包括在10毫托或更低的压力下蚀刻抗反射涂层; 用具有第一F:C比率的第一氮化物蚀刻等离子体蚀刻氮化物层; 并用具有第二F:C比率的第二氮化物蚀刻等离子体蚀刻氮化物层。 第一F:C比大于第二F:C比。

    Tubular fitment for lavatory facility
    8.
    发明申请
    Tubular fitment for lavatory facility 审中-公开
    盥洗室设施的管状配件

    公开(公告)号:US20060237072A1

    公开(公告)日:2006-10-26

    申请号:US11034998

    申请日:2005-01-12

    申请人: Lien Lee

    发明人: Lien Lee

    IPC分类号: F16K21/00

    摘要: A lavatory facility includes a faucet for attaching to a lavatory member and having a base member for engaging onto the lavatory member, and a tubular fitment for attaching the faucet to the lavatory member. The tubular fitment includes a shank having one end for engaging into the faucet, and a peripheral rib for engaging with and for anchoring the shank to the faucet. The shank includes a peripheral flange for engaging with the base member of the faucet, and for anchoring the shank to the faucet and the lavatory member. A pipe includes a bore for receiving the shank, and includes an inner thread for threading with an outer thread of the shank, and for securing the pipe to the shank, and for securing the faucet to the lavatory member having different heights or thicknesses or depths.

    摘要翻译: 盥洗室设施包括用于附接到盥洗室构件并具有用于接合到盥洗室构件上的基座构件的水龙头和用于将水龙头连接到盥洗室构件的管状配件。 管状配件包括具有用于接合到龙头中的一端的柄,以及用于与柄头接合并将柄锚固到龙头的外围肋。 柄部包括用于与龙头的基部构件接合的外围法兰,并且用于将柄锚固到龙头和盥洗室构件。 管道包括用于接收柄部的孔,并且包括用于与柄的外螺纹螺纹连接的内螺纹,并且用于将管固定到柄上,并且用于将龙头固定到具有不同高度或厚度或深度的盥洗部件 。

    Gate etch process
    9.
    发明授权
    Gate etch process 有权
    门蚀刻工艺

    公开(公告)号:US07112834B1

    公开(公告)日:2006-09-26

    申请号:US10791657

    申请日:2004-03-02

    IPC分类号: H01L29/76

    摘要: A method of making a semiconductor structure includes etching an anti-reflective coating layer at a pressure of 10 millitorr or less; etching a nitride layer with a first nitride etch plasma having a first F:C ratio; and etching the nitride layer with a second nitride etch plasma having a second F:C ratio. The first F:C ratio is greater than the second F:C ratio.

    摘要翻译: 制造半导体结构的方法包括在10毫托或更低的压力下蚀刻抗反射涂层; 用具有第一F:C比率的第一氮化物蚀刻等离子体蚀刻氮化物层; 并用具有第二F:C比率的第二氮化物蚀刻等离子体蚀刻氮化物层。 第一F:C比大于第二F:C比。