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11 条记录 (耗时 0.032 秒)

    Personalized Usb-Key Type Electronic Device and Method for Making Same
    3.
    发明申请
    Personalized Usb-Key Type Electronic Device and Method for Making Same 有权
    个性化Usb键型电子设备及其制作方法

    公开(公告)号：US20080156871A1

    公开(公告)日：2008-07-03

    申请号：US11666753

    申请日：2005-10-24

    申请人： Jean-Christophe Fidalgo ,  Jean-Charles Biremont ,  Lucile Dossetto ,  Thierry Karlisch ,  Remi Garnier ,  Laurent Valette

    发明人： Jean-Christophe Fidalgo ,  Jean-Charles Biremont ,  Lucile Dossetto ,  Thierry Karlisch ,  Remi Garnier ,  Laurent Valette

    IPC分类号： G06K5/00

    CPC分类号： G06K19/07732 ,  G06K19/077 ,  G06K19/07733 ,  Y10T29/49124

    摘要： The invention concerns a USB-key type electronic device (73) comprising an electronic circuit mounted on a support (60), a gripping element showing a graphic print and/or customization (p), a protective case (70) arranged at the element so as to cause the graphic print and/or customization to be visible through the case. The invention is characterized in that the graphic print and/or customization is produced on the support (60) bearing the electronic circuit, and in that the case covers directly said support (60). The invention also concerns a method including the following steps: producing an electronic circuit support in the form of a printed smart card with contacts in conformity with the USB standard, producing a graphic customization on a support surface, protecting said graphic customization with a transparent protective shell.

    摘要翻译： 本发明涉及一种USB键型电子设备（73），其包括安装在支撑件（60）上的电子电路，示出图形印刷和/或定制（p）的夹紧元件，布置在元件上的保护壳体 以便通过案例使图形打印和/或定制可见。 本发明的特征在于，图形印刷和/或定制在承载电子电路的支撑件（60）上产生，并且壳体直接覆盖所述支撑件（60）。 本发明还涉及一种包括以下步骤的方法：制造具有符合USB标准的触点的印刷智能卡形式的电子电路支架，在支撑表面上产生图形定制，用透明保护来保护所述图形定制 贝壳。

    Method for producing contact chip cards with a low-cost dielectric
    8.
    发明授权
    Method for producing contact chip cards with a low-cost dielectric 失效
    用低成本电介质制造接触式芯片卡的方法

    公开(公告)号：US06617672B1

    公开(公告)日：2003-09-09

    申请号：US09979709

    申请日：2001-11-26

    申请人： Lucile Dossetto

    发明人： Lucile Dossetto

    IPC分类号： H01L23495

    CPC分类号： G06K19/07743 ,  G06K19/07745 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2224/0401

    摘要： In a method for manufacturing a contact chip card, a dielectric support film is provided in the form of a strip. A metal grid which defines contact pads on the upper surface thereof and connection pads on the lower surface thereof is created. The dielectric support film is irremovably fixed on the upper surface of the metal grid in such a way that the contact pads of the grid are free. The chip is glued and connected to the connection pads of the grid, and the metal grid is cut to obtain a micromodule to be inserted in the cavity of a body of the card. In one particular embodiment, the grid is arched in order to encase the thickness of the dielectric.

    摘要翻译： 在接触芯片卡的制造方法中，电介质支撑膜以带状的形式提供。 产生了限定其上表面上的接触垫和其下表面上的连接垫的金属栅格。 电介质支撑膜不可拆卸地固定在金属栅格的上表面上，使栅格的接触垫是自由的。 芯片被胶合并连接到网格的连接焊盘，并且切割金属网格以获得插入卡的主体的空腔中的微型模块。 在一个特定实施例中，栅格是拱形的，以便包住电介质的厚度。

    Method for manufacturing smart cards
    9.
    发明授权
    Method for manufacturing smart cards 有权
    制造智能卡的方法

    公开(公告)号：US09165236B2

    公开(公告)日：2015-10-20

    申请号：US14365281

    申请日：2012-12-07

    申请人： Stephane Ottobon ,  Lucile Dossetto

    发明人： Stephane Ottobon ,  Lucile Dossetto

    IPC分类号： G06K7/08 ,  G06K19/02 ,  G06K19/06 ,  G06K19/077 ,  H01L21/56

    CPC分类号： G06K19/07728 ,  G06K19/077 ,  G06K19/07722 ,  G06K19/07743 ,  G06K19/07745 ,  H01L21/56 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48228 ,  H01L2924/00011 ,  H01L2924/19107 ,  H01L2924/01005 ,  H01L2924/00014

    摘要： This invention relates to a smart card (1) manufacturing method that makes it possible to reduce the thickness of the said smart card and directly obtain a final 3FF or 4FF format. The smart card manufacturing method comprises steps for depositing resin forming a first protective coat (11) over the electronic element assembly with a surface greater than the required smart card format and depositing a second protective coat with a format larger than the required card format on the first protective coat. The second protective coat is fixed to the first protective coat by curing the first protective coat, and then the assembly obtained in that way is cut to the required format.

    摘要翻译： 智能卡（1）制造方法技术领域本发明涉及一种智能卡（1）的制造方法，其能够减小所述智能卡的厚度并直接获得最终的3FF或4FF格式。 智能卡制造方法包括以下步骤：在电子元件组件上形成第一保护涂层（11）的树脂，其表面大于所需的智能卡格式，并将尺寸大于所需卡格式的第二保护涂层沉积在 第一防护外套。 通过固化第一保护涂层将第二保护涂层固定到第一保护涂层，然后将以该方式获得的组件切割成所需格式。