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公开(公告)号：US20080296606A1
公开(公告)日：2008-12-04
申请号：US11887049
申请日：2006-03-17
CPC分类号： G06K19/07749 , G06K19/0728 , G06K19/07703 , G06K19/07733 , G06K19/07743 , G06K19/07745 , H01L24/45 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48111 , H01L2224/73265 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The invention generally relates to devices comprising semiconductor chips. More specifically, the invention relates to an electronic module (1) comprising at least one integrated circuit chip (10) which is connected to the conductor tracks of an insulating support and at least one light-emitting diode (16). According to one aspect of the invention, the assembly formed by the integrated circuit (10) and the light-emitting diode (16) is coated with a translucent resin (32), thereby forming an element for the mechanical protection of the assembly and for the transmission of the light emitted by the diode (16). According to another aspect of the invention, the coated assembly comprises at least one indicator light (LED) and a radio-frequency coil (preferably in the module).
摘要翻译： 本发明一般涉及包括半导体芯片的器件。 更具体地，本发明涉及一种电子模块（1），包括至少一个集成电路芯片（10），其连接到绝缘支撑件的导体轨道和至少一个发光二极管（16）。 根据本发明的一个方面，由集成电路（10）和发光二极管（16）形成的组件涂覆有半透明树脂（32），从而形成用于组件的机械保护的元件 由二极管（16）发射的光的透射。 根据本发明的另一方面，涂覆组件包括至少一个指示灯（LED）和射频线圈（优选地在模块中）。
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2.发明申请公开(公告)号：US20080156871A1
公开(公告)日：2008-07-03
申请号：US11666753
申请日：2005-10-24
申请人： Jean-Christophe Fidalgo , Jean-Charles Biremont , Lucile Dossetto , Thierry Karlisch , Remi Garnier , Laurent Valette
发明人： Jean-Christophe Fidalgo , Jean-Charles Biremont , Lucile Dossetto , Thierry Karlisch , Remi Garnier , Laurent Valette
IPC分类号： G06K5/00
CPC分类号： G06K19/07732 , G06K19/077 , G06K19/07733 , Y10T29/49124
摘要： The invention concerns a USB-key type electronic device (73) comprising an electronic circuit mounted on a support (60), a gripping element showing a graphic print and/or customization (p), a protective case (70) arranged at the element so as to cause the graphic print and/or customization to be visible through the case. The invention is characterized in that the graphic print and/or customization is produced on the support (60) bearing the electronic circuit, and in that the case covers directly said support (60). The invention also concerns a method including the following steps: producing an electronic circuit support in the form of a printed smart card with contacts in conformity with the USB standard, producing a graphic customization on a support surface, protecting said graphic customization with a transparent protective shell.
摘要翻译： 本发明涉及一种USB键型电子设备（73），其包括安装在支撑件（60）上的电子电路，示出图形印刷和/或定制（p）的夹紧元件，布置在元件上的保护壳体 以便通过案例使图形打印和/或定制可见。 本发明的特征在于，图形印刷和/或定制在承载电子电路的支撑件（60）上产生，并且壳体直接覆盖所述支撑件（60）。 本发明还涉及一种包括以下步骤的方法：制造具有符合USB标准的触点的印刷智能卡形式的电子电路支架，在支撑表面上产生图形定制，用透明保护来保护所述图形定制 贝壳。
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公开(公告)号：US09355348B2
公开(公告)日：2016-05-31
申请号：US14387222
申请日：2013-03-21
IPC分类号： G06K19/077 , H05K3/30
CPC分类号： G06K19/07703 , G06K19/077 , G06K19/0772 , G06K19/07745 , H01L2224/48091 , H01L2224/48228 , H05K3/30 , H01L2924/00014
摘要： The present invention relates to a smart card comprising a card body and an electronic module placed within a recess of the card body and further comprising at least one colored layer placed between the electronic module and the bottom of the recess of the card body.
摘要翻译： 智能卡技术领域本发明涉及一种智能卡，其包括放置在卡体的凹槽内的卡体和电子模块，还包括放置在电子模块与卡体凹部的底部之间的至少一个着色层。
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公开(公告)号：US09165236B2
公开(公告)日：2015-10-20
申请号：US14365281
申请日：2012-12-07
申请人： Stephane Ottobon , Lucile Dossetto
发明人： Stephane Ottobon , Lucile Dossetto
IPC分类号： G06K7/08 , G06K19/02 , G06K19/06 , G06K19/077 , H01L21/56
CPC分类号： G06K19/07728 , G06K19/077 , G06K19/07722 , G06K19/07743 , G06K19/07745 , H01L21/56 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/48228 , H01L2924/00011 , H01L2924/19107 , H01L2924/01005 , H01L2924/00014
摘要： This invention relates to a smart card (1) manufacturing method that makes it possible to reduce the thickness of the said smart card and directly obtain a final 3FF or 4FF format. The smart card manufacturing method comprises steps for depositing resin forming a first protective coat (11) over the electronic element assembly with a surface greater than the required smart card format and depositing a second protective coat with a format larger than the required card format on the first protective coat. The second protective coat is fixed to the first protective coat by curing the first protective coat, and then the assembly obtained in that way is cut to the required format.
摘要翻译： 智能卡（1）制造方法技术领域本发明涉及一种智能卡（1）的制造方法，其能够减小所述智能卡的厚度并直接获得最终的3FF或4FF格式。 智能卡制造方法包括以下步骤：在电子元件组件上形成第一保护涂层（11）的树脂，其表面大于所需的智能卡格式，并将尺寸大于所需卡格式的第二保护涂层沉积在 第一防护外套。 通过固化第一保护涂层将第二保护涂层固定到第一保护涂层，然后将以该方式获得的组件切割成所需格式。
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5.发明授权公开(公告)号：US07975915B2
公开(公告)日：2011-07-12
申请号：US11666753
申请日：2005-10-24
申请人： Jean-Christophe Fidalgo , Jean-Charles Biremont , Lucile Dossetto , Thierry Karlisch , Remi Garnier , Laurent Valette
发明人： Jean-Christophe Fidalgo , Jean-Charles Biremont , Lucile Dossetto , Thierry Karlisch , Remi Garnier , Laurent Valette
IPC分类号： G06K5/00
CPC分类号： G06K19/07732 , G06K19/077 , G06K19/07733 , Y10T29/49124
摘要： The invention concerns a USB-key type electronic device (73) comprising an electronic circuit mounted on a support (60), a gripping element showing a graphic print and/or customization (p), a protective case (70) arranged at the element so as to cause the graphic print and/or customization to be visible through the case. The invention is characterized in that the graphic print and/or customization is produced on the support (60) bearing the electronic circuit, and in that the case covers directly said support (60). The invention also concerns a method including the following steps: producing an electronic circuit support in the form of a printed smart card with contacts in conformity with the USB standard, producing a graphic customization on a support surface, protecting said graphic customization with a transparent protective shell.
摘要翻译： 本发明涉及一种USB键型电子设备（73），其包括安装在支撑件（60）上的电子电路，示出图形印刷和/或定制（p）的夹紧元件，布置在元件上的保护壳体 以便通过案例使图形打印和/或定制可见。 本发明的特征在于，图形印刷和/或定制在承载电子电路的支撑件（60）上产生，并且壳体直接覆盖所述支撑件（60）。 本发明还涉及一种包括以下步骤的方法：制造具有符合USB标准的触点的印刷智能卡形式的电子电路支架，在支撑表面上产生图形定制，用透明保护来保护所述图形定制 贝壳。
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公开(公告)号：US20150129661A1
公开(公告)日：2015-05-14
申请号：US14387222
申请日：2013-03-21
IPC分类号： G06K19/077 , H05K3/30
CPC分类号： G06K19/07703 , G06K19/077 , G06K19/0772 , G06K19/07745 , H01L2224/48091 , H01L2224/48228 , H05K3/30 , H01L2924/00014
摘要： The present invention relates to a smart card comprising a card body and an electronic module placed within a recess of the card body and further comprising at least one coloured layer placed between the electronic module and the bottom of the recess of the card body.
摘要翻译： 智能卡技术领域本发明涉及一种智能卡，其包括放置在卡体的凹槽内的卡体和电子模块，还包括放置在电子模块与卡体凹部的底部之间的至少一个着色层。
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7.发明授权Integrated circuit card comprising an interface terminal strip and method for making same 失效集成电路卡，其包括接口端子条及其制造方法公开(公告)号：US06548888B1
公开(公告)日：2003-04-15
申请号：US09700392
申请日：2000-11-14
IPC分类号： H01L2302
CPC分类号： G06K19/07745 , G06K19/07743 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2924/01057 , H01L2924/01079 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit card includes a card body having an integrated circuit electrically connected to contact pads formed by electrically conductive ink. An interface terminal strip provided with a series of terminals is electrically connected to the integrated circuit contacts. The contact pads are formed on the card body upper surface such that each pad comprises a portion which covers, at least partially, a terminal of the interface terminal strip.
摘要翻译： 集成电路卡包括具有电连接到由导电油墨形成的接触垫的集成电路的卡体。 设置有一系列端子的接口端子条电连接到集成电路触点。 接触垫形成在卡体上表面上，使得每个垫包括至少部分地覆盖接口端子带的端子的部分。
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8.发明授权Method for the production of a portable integrated circuit electronic device comprising a low-cost dielectric 失效用于生产包括低成本电介质的便携式集成电路电子设备的方法公开(公告)号：US06521985B1
公开(公告)日：2003-02-18
申请号：US09979601
申请日：2001-11-26
申请人： Lucile Dossetto
发明人： Lucile Dossetto
IPC分类号： H01L2302
CPC分类号： G06K19/07745 , G06K19/07743 , H01L2224/05568 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/00014 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H01L2924/00012 , H01L2224/05599
摘要： In a method for the production of a portable integrated circuit electronic device, an integrated circuit chip is transferred onto a dielectric support and connected to a metal grid comprising contact pads and connection pads. A housing is created for the chip on a metal grid by arching the grid. The dimensions of the housing enable the housing to accommodate the thickness of the card and the contact pads thereof. The grid is laminated on the dielectric support, whereby each contact pad of the card can be placed opposite to and in contact with the connection pads of the grid.
摘要翻译： 在制造便携式集成电路电子器件的方法中，将集成电路芯片转移到电介质支架上并连接到包括接触焊盘和连接焊盘的金属栅格。 通过拱形栅格为金属网格上的芯片创建一个外壳。 壳体的尺寸使得壳体能够适应卡的厚度及其接触垫。 网格层压在电介质支撑件上，由此卡的每个接触垫可以放置在栅格的连接垫的相对并与其接触的位置。
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公开(公告)号：US20140152511A1
公开(公告)日：2014-06-05
申请号：US14130260
申请日：2012-06-22
申请人： Lionel Merlin , Nizar Lahoui , Arek Buyukkalender , Lucile Dossetto , Laurence Robertet , Catherine Brondino , Frédérick Seban
发明人： Lionel Merlin , Nizar Lahoui , Arek Buyukkalender , Lucile Dossetto , Laurence Robertet , Catherine Brondino , Frédérick Seban
IPC分类号： H01Q1/22
CPC分类号： H01Q1/22 , G06K19/077 , G06K19/07749 , G06Q20/10 , G06Q20/105 , H01L35/00 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49109 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a portable electronic device comprising a supporting member receiving on one side conductive contact lands or tracks extending substantially as far as the edge of the side and connecting an electronic microcircuit, the conductive contact lands or tracks comprising a plurality of perforations. The device is noteworthy in that the interior of the perforations is free, or intended to be kept free, of metal.
摘要翻译： 便携式电子设备本发明涉及一种便携式电子设备，该便携式电子设备包括一个支撑构件，该支撑构件在一侧接收导电接触平台或基本上延伸至该边缘边缘的轨道，并且连接电子微电路，导电接地平台或轨道包括多个穿孔。 该装置是值得注意的，因为穿孔的内部是免费的，或者意图保持为金属。
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公开(公告)号：US06617672B1
公开(公告)日：2003-09-09
申请号：US09979709
申请日：2001-11-26
申请人： Lucile Dossetto
发明人： Lucile Dossetto
IPC分类号： H01L23495
CPC分类号： G06K19/07743 , G06K19/07745 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/00014 , H01L2924/01039 , H01L2924/01079 , H01L2224/0401
摘要： In a method for manufacturing a contact chip card, a dielectric support film is provided in the form of a strip. A metal grid which defines contact pads on the upper surface thereof and connection pads on the lower surface thereof is created. The dielectric support film is irremovably fixed on the upper surface of the metal grid in such a way that the contact pads of the grid are free. The chip is glued and connected to the connection pads of the grid, and the metal grid is cut to obtain a micromodule to be inserted in the cavity of a body of the card. In one particular embodiment, the grid is arched in order to encase the thickness of the dielectric.
摘要翻译： 在接触芯片卡的制造方法中，电介质支撑膜以带状的形式提供。 产生了限定其上表面上的接触垫和其下表面上的连接垫的金属栅格。 电介质支撑膜不可拆卸地固定在金属栅格的上表面上，使栅格的接触垫是自由的。 芯片被胶合并连接到网格的连接焊盘，并且切割金属网格以获得插入卡的主体的空腔中的微型模块。 在一个特定实施例中，栅格是拱形的，以便包住电介质的厚度。
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