公开(公告)号：US20240292514A1

公开(公告)日：2024-08-29

申请号：US18572369

申请日：2022-06-30

Applicant: Lisa Dräxlmaier GmbH

Inventor： Andreas Brinkmann

IPC: H05K1/02 ,  B23K1/00 ,  B23K101/42 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K1/0204 ,  B23K1/0016 ,  H05K1/0209 ,  H05K3/3421 ,  H05K3/3452 ,  H05K3/3485 ,  B23K2101/42 ,  H05K1/181 ,  H05K2201/0305 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10689 ,  H05K2203/0557 ,  H05K2203/1178

Abstract: The present disclosure relates to a method for the process-reliable soldering of a chip package onto a printed circuit board for the process-reliable soldering of a chip package. The printed circuit board has a metallic cooling surface, a plurality of metallic contact surfaces surrounding the cooling surface, and, on a side opposite the cooling surface, a rear metallic mating surface, the mating surface being connected to the cooling surface by open vias, and lanes of solder resist being arranged on the cooling surface, which lanes both divide the cooling surface into a plurality of partial surfaces and enclose the vias.