公开(公告)号：US20230154883A1

公开(公告)日：2023-05-18

申请号：US17990230

申请日：2022-11-18

申请人： NEXPERIA B.V.

发明人： Ricardo Yandoc ,  Adam Brown ,  Haibo Fan

IPC分类号： H01L23/00

CPC分类号： H01L24/40 ,  H01L24/37 ,  H01L24/05 ,  H01L24/84 ,  H01L2224/04034 ,  H01L2224/40225 ,  H01L2224/37005 ,  H01L2924/13063 ,  H01L2924/13064 ,  H01L2224/84

摘要： A semiconductor package including a semiconductor die having multiple bond pads is provided. The package further includes an electrically conducting clip including, at a first side thereof, at least one pin for mounting the package to an external board and includes, at a second side opposite to the first side, a connecting portion connecting the clip to at least two bond pads of the multiple bond pads. The connection portion includes at least two elongated connecting strips spaced apart from each other at a distance in such a manner that each strip extends over at least one of the at least two bond pads and is connected thereto.

公开(公告)号：US09673118B2

公开(公告)日：2017-06-06

申请号：US15038590

申请日：2014-07-31

申请人： MITSUBISHI ELECTRIC CORPORATION

发明人： Masaki Taya

IPC分类号： H01L23/02 ,  H01L23/053 ,  H01L25/07 ,  H01L25/18 ,  H01L23/373 ,  H01L23/498 ,  H01L21/48 ,  H01L23/29 ,  H01L23/31 ,  H01L23/535 ,  H01L23/24 ,  H01L23/00

CPC分类号： H01L23/053 ,  H01L21/4853 ,  H01L23/24 ,  H01L23/293 ,  H01L23/3142 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49844 ,  H01L23/535 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/84 ,  H01L25/07 ,  H01L25/18 ,  H01L2224/04026 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/291 ,  H01L2224/32227 ,  H01L2224/35847 ,  H01L2224/37005 ,  H01L2224/37011 ,  H01L2224/37012 ,  H01L2224/37032 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/4007 ,  H01L2224/40137 ,  H01L2224/40245 ,  H01L2224/4046 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48245 ,  H01L2224/73263 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84205 ,  H01L2224/84447 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/35121 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/207 ,  H01L2924/2076

摘要： A power module providing an improved manufacture yield and having an ensured stable joint strength and accordingly improved reliability is provided. The power module includes: a base portion having one surface on which an electrode portion is formed; a conductor portion disposed to face the one surface of the base portion on which the electrode portion is formed, for making electrical connection with the outside; and an interconnect portion connected to the electrode portion formed on the one surface of the base portion and to the surface of the conductor portion facing the one surface of the base portion for electrically connecting the electrode portion to the conductor portion.

公开(公告)号：US11769748B2

公开(公告)日：2023-09-26

申请号：US18073090

申请日：2022-12-01

申请人： Infineon Technologies AG

发明人： Thomas Stoek ,  Michael Stadler ,  Mohd Hasrul Zulkifli

IPC分类号： H01L23/00 ,  H01L23/495

CPC分类号： H01L24/37 ,  H01L23/49524 ,  H01L24/84 ,  H01L2224/37005 ,  H01L2224/84815

摘要： A semiconductor device includes a semiconductor die attached to a substrate and a metal clip attached to a side of the semiconductor die facing away from the substrate by a soldered joint. The metal clip has a plurality of slots dimensioned so as to take up at least 10% of a solder paste that reflowed to form the soldered joint. Corresponding methods of production are also described.

公开(公告)号：US11652078B2

公开(公告)日：2023-05-16

申请号：US17234964

申请日：2021-04-20

申请人： Infineon Technologies AG

发明人： Edmund Sales Cabatbat ,  Thai Kee Gan ,  Kean Ming Koe ,  Ke Yan Tean

IPC分类号： H01L23/00 ,  H01L25/065 ,  H01L23/31 ,  H01L23/495 ,  H01L23/14 ,  H01L23/13

CPC分类号： H01L24/40 ,  H01L23/13 ,  H01L23/14 ,  H01L23/3157 ,  H01L23/49548 ,  H01L24/37 ,  H01L25/0655 ,  H01L2224/37005 ,  H01L2224/37012 ,  H01L2224/4023 ,  H01L2924/182 ,  H01L2924/1815 ,  H01L2924/381

摘要： A semiconductor package includes a die pad, a semiconductor die mounted on the die pad and comprising a first terminal facing away from the die pad and a second terminal facing and electrically connected to the die pad, an interconnect clip electrically connected to the first terminal, an encapsulant body of electrically insulating material that encapsulates the semiconductor die and the interconnect clip, and a first opening in the encapsulant body that exposes a surface of the interconnect clip, the encapsulant body comprises a lower surface, an upper surface opposite from the lower surface, and a first outer edge side extending between the lower surface and the upper surface, and the first opening is laterally offset from the first outer edge side.

公开(公告)号：US09337129B2

公开(公告)日：2016-05-10

申请号：US14226280

申请日：2014-03-26

申请人： ROHM CO., LTD.

发明人： Koji Yasunaga ,  Shingo Takaki

IPC分类号： H01L21/00 ,  H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L23/49541 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49562 ,  H01L24/37 ,  H01L24/40 ,  H01L24/83 ,  H01L24/84 ,  H01L2224/04034 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/37005 ,  H01L2224/37012 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40106 ,  H01L2224/40245 ,  H01L2224/40496 ,  H01L2224/40499 ,  H01L2224/73263 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/84047 ,  H01L2224/84801 ,  H01L2224/92246 ,  H01L2924/181 ,  H01L2924/3841 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor device includes: a semiconductor element having an electrode facing a first direction; a first lead having a conductive distal end surface facing the electrode, and a rising portion which is connected to the distal end surface to extend away from the electrode; a conductive bonding material bonding the electrode of the semiconductor element to the distal end surface of the first lead; and a sealing resin covering the semiconductor element, at least a portion of the first lead, and the conductive bonding material.

摘要翻译： 半导体器件包括：具有面向第一方向的电极的半导体元件; 具有面向电极的导电性远端面的第一引线和与远端面连接以远离电极延伸的上升部; 将所述半导体元件的电极与所述第一引线的前端面接合的导电性接合材料; 以及覆盖半导体元件的密封树脂，第一引线的至少一部分和导电接合材料。

公开(公告)号：US20240312880A1

公开(公告)日：2024-09-19

申请号：US18539036

申请日：2023-12-13

申请人： Mitsubishi Electric Corporation

发明人： Yusuke KUSAKABE ,  Yoshihisa UCHIDA ,  Tatsunori YANAGIMOTO ,  Kazutaka IKEDA

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L23/053

CPC分类号： H01L23/49544 ,  H01L23/053 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L2224/37005 ,  H01L2224/40225 ,  H01L2224/40491 ,  H01L2224/84007 ,  H01L2224/84897

摘要： Provided is a semiconductor device having a structure of directly bonding a lead electrode to a semiconductor element through a bonding layer, in which whether the bonding layer has a predetermined thickness can be checked through a visual inspection. The semiconductor device includes: a semiconductor element mounted on an insulating substrate or a lead frame; a bonding layer on the semiconductor element; and a lead electrode including a main body plate electrically connected to an external electrode, and a cantilevered plate having one end being connected to the main body plate as a connection part, and being cut from the main body plate, wherein the cantilevered plate is bent in a direction of the semiconductor element with respect to the main body plate, and has an other end embedded in the bonding layer, and the bonding layer covers at least a part of an upper surface of the cantilevered plate.

公开(公告)号：US20240213208A1

公开(公告)日：2024-06-27

申请号：US18396035

申请日：2023-12-26

申请人： POWER MASTER SEMICONDUCTOR CO., LTD.

发明人： Taekkeun LEE ,  In-Suk KIM ,  Ki-Myung YOON ,  Jooyaung EOM ,  Soonho KWON

IPC分类号： H01L23/00 ,  H01L23/373 ,  H01L25/07

CPC分类号： H01L24/37 ,  H01L23/3735 ,  H01L24/40 ,  H01L25/072 ,  H01L2224/37005 ,  H01L2224/40139 ,  H01L2224/40225

摘要： Provided is a semiconductor device. A semiconductor device is implemented as a semiconductor module package for driving an inverter, the semiconductor device may include: a first upper metal layer in which a plurality of semiconductor chips implementing a right phase switching pattern are disposed along a first direction to form a first row; a second upper metal layer in which a plurality of semiconductor chips implementing a left phase switching pattern are disposed along the first direction to form a second row; a first connection, in the first upper metal layer, connecting a plurality of semiconductor chips disposed along the first row to each other in series and to the second upper metal layer in parallel; and a second connection, in the second upper metal layer, connecting a plurality of semiconductor chips disposed along the second row to each other in series.

公开(公告)号：US20240153904A1

公开(公告)日：2024-05-09

申请号：US18475997

申请日：2023-09-27

申请人： FUJI ELECTRIC CO., LTD.

发明人： Norihiro NASHIDA

IPC分类号： H01L23/00

CPC分类号： H01L24/40 ,  H01L24/37 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/37005 ,  H01L2224/40245 ,  H01L2224/404 ,  H01L2224/73263

摘要： A semiconductor module includes a first semiconductor chip including a first main electrode, a second semiconductor chip including a second main electrode, and a conductive pattern. The wiring member includes a connection portion, a first portion, a second portion, and a coupling portion. The coupling portion couples the connection portion, the first portion, and the second portion to one another. A connecting protrusion is formed on a connection surface of the connection portion. A first protrusion is formed on a first connection surface of the first portion. A second protrusion is formed on a second connection surface of the first portion. The conductive pattern and the connection surface are joined to each other by a joining material. The first main electrode and the first connection surface are joined to each other by a first joining material. The second main electrode and the second connection surface are joined to each other by a second joining material.

公开(公告)号：US20240021568A1

公开(公告)日：2024-01-18

申请号：US17864881

申请日：2022-07-14

申请人： Littelfuse, Inc.

发明人： Tiburcio A. Maldo ,  Rhodri Hughes ,  Robert Ebido ,  Jeff Grozen ,  Josef Colquin A. Chua ,  Domingo Atienza, JR.

IPC分类号： H01L23/00 ,  H01L23/14 ,  H01L23/15

CPC分类号： H01L24/37 ,  H01L24/40 ,  H01L23/142 ,  H01L23/15 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/73263 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/37005 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/3702 ,  H01L2224/37026 ,  H01L2224/40225 ,  H01L2224/40245 ,  H01L2924/3511

摘要： A substrate assembly may include a power substrate, a chip, a clip, and a trimetal. The power substrate has a first direct copper bonded (DCB) surface connected to a ceramic tile. The chip is soldered onto the first DCB surface. The clip is attached to the power substrate and has a foot at one end and a recessed area at the other, opposite end. The foot is connected to the power substrate. The trimetal has a base, a trapezoid structure, and a clip portion. The base is soldered to the chip. The trapezoid structure is located above the base. The clip portion is located above the trapezoid structure and includes a projecting area. The recessed area of the clip fits into the projecting area of the trimetal.

公开(公告)号：US20140291828A1

公开(公告)日：2014-10-02

申请号：US14226280

申请日：2014-03-26

申请人： ROHM CO., LTD.

发明人： Koji YASUNAGA ,  Shingo TAKAKI

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L23/49541 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49562 ,  H01L24/37 ,  H01L24/40 ,  H01L24/83 ,  H01L24/84 ,  H01L2224/04034 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/37005 ,  H01L2224/37012 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40106 ,  H01L2224/40245 ,  H01L2224/40496 ,  H01L2224/40499 ,  H01L2224/73263 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/84047 ,  H01L2224/84801 ,  H01L2224/92246 ,  H01L2924/181 ,  H01L2924/3841 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor device includes: a semiconductor element having an electrode facing a first direction; a first lead having a conductive distal end surface facing the electrode, and a rising portion which is connected to the distal end surface to extend away from the electrode; a conductive bonding material bonding the electrode of the semiconductor element to the distal end surface of the first lead; and a sealing resin covering the semiconductor element, at least a portion of the first lead, and the conductive bonding material

摘要翻译： 半导体器件包括：具有面向第一方向的电极的半导体元件; 具有面向电极的导电性远端面的第一引线和与远端面连接以远离电极延伸的上升部; 将所述半导体元件的电极与所述第一引线的前端面接合的导电性接合材料; 以及覆盖半导体元件的密封树脂，第一引线的至少一部分和导电接合材料