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公开(公告)号：US06822374B1
公开(公告)日：2004-11-23
申请号：US09712687
申请日：2000-11-15
IPC分类号： H01L4108
摘要： An ultrasound transducer element incorporates material of low dielectric constant to confine the electric field of a stack of piezoelectric ceramic layers. Edge segments made of material having a low dielectric constant and extending in the thickness direction are formed at opposing ends of the multilayer structure. These regions of low dielectric constant material confine the electric field to the piezoelectric ceramic material of high dielectric constant, where it remains directed vertically. In this way, when a voltage is applied between the electrodes, the piezoelectrically induced strains are almost entirely vertical. Spurious modes are therefore substantially reduced.
摘要翻译： 超声换能器元件结合了低介电常数的材料，以限制一叠压电陶瓷层的电场。 在多层结构的相对端形成由具有低介电常数并在厚度方向上延伸的材料制成的边缘段。 低介电常数材料的这些区域将电场限制在高介电常数的压电陶瓷材料上，并保持垂直方向。 以这种方式，当在电极之间施加电压时，压电诱发的应变几乎完全垂直。 因此，杂散模式大大减少。
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公开(公告)号：US5704105A
公开(公告)日：1998-01-06
申请号：US707678
申请日：1996-09-04
摘要： A method for fabricating "1.5D" and "2D" multilayer ultrasonic transducer arrays employs dicing saw kerfs, which provide acoustic isolation between rows. The kerfs are metallized to provide electrical connection between surface electrode layers and buried internal electrode layers. A multilayer piezoceramic transducer element for a "1.5D" or "2D" array produced by this method has higher capacitance, and accordingly provides better transducer sensitivity, in comparison to a single layer element.
摘要翻译： 用于制造“1.5D”和“2D”多层超声波换能器阵列的方法采用切割锯切割，其提供行之间的隔音。 切口被金属化以提供表面电极层和埋入的内部电极层之间的电连接。 通过该方法制造的用于“1.5D”或“2D”阵列的多层压电陶瓷换能器元件具有较高的电容，因此与单层元件相比提供更好的换能器灵敏度。
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公开(公告)号：US5834880A
公开(公告)日：1998-11-10
申请号：US931338
申请日：1997-09-16
摘要： A method for fabricating "1.5D" and "2D" multilayer ultrasonic transducer arrays employs dicing saw kerfs, which provide acoustic isolation between rows. The kerfs are metallized to provide electrical connection between surface electrode layers and buried internal electrode layers. A multilayer piezoceramic transducer element for a "1.5D" or "2D" array produced by this method has higher capacitance, and accordingly provides better transducer sensitivity, in comparison to a single layer element.
摘要翻译： 用于制造“1.5D”和“2D”多层超声波换能器阵列的方法采用切割锯切割，其提供行之间的隔音。 切口被金属化以提供表面电极层和埋入的内部电极层之间的电连接。 通过该方法制造的用于“1.5D”或“2D”阵列的多层压电陶瓷换能器元件具有较高的电容，因此与单层元件相比提供更好的换能器灵敏度。
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4.发明申请公开(公告)号：US20080296708A1
公开(公告)日：2008-12-04
申请号：US11809165
申请日：2007-05-31
申请人： Robert Gideon Wodnicki , Wei-Cheng Tian , Kevin Matthew Durocher , Charles Gerard Woychik , Rayette Ann Fisher , Stacey Joy Kennerly , Lowell Scott Smith , Douglas Glenn Wildes
发明人： Robert Gideon Wodnicki , Wei-Cheng Tian , Kevin Matthew Durocher , Charles Gerard Woychik , Rayette Ann Fisher , Stacey Joy Kennerly , Lowell Scott Smith , Douglas Glenn Wildes
CPC分类号： G01N29/2406 , B06B1/0292 , G01N2291/106 , H01L2224/04105 , H01L2224/24 , H01L2224/73267 , H01L2224/82
摘要： The present invention relates to a method for making an integrated sensor comprising providing a sensor array fabricated on a top surface of a bulk silicon wafer having a top surface and a bottom surface, and comprising a plurality of sensors fabricated on the top surface of the bulk silicon wafer. The method further comprises coupling an SOI wafer to the top surface of the bulk silicon wafer, thinning the back surface of the bulk silicon wafer, coupling a plurality of integrated circuit die to the back surface of the bulk silicon wafer, and removing the SOI wafer from the top surface of the bulk silicon wafer.
摘要翻译： 本发明涉及一种用于制造集成传感器的方法，其包括提供制造在具有顶表面和底表面的体硅晶片的顶表面上的传感器阵列，并且包括在本体的顶表面上制造的多个传感器 硅晶片。 该方法还包括将SOI晶片耦合到体硅晶片的顶表面，使体硅晶片的背表面变薄，将多个集成电路管芯耦合到体硅晶片的背面，以及去除SOI晶片 从体硅晶片的顶表面。
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公开(公告)号：US08475375B2
公开(公告)日：2013-07-02
申请号：US11639891
申请日：2006-12-15
申请人： Lowell Scott Smith , Robert Stephen Lewandowski , Bruno Hans Haider , Charles Edward Baumgartner , George Charles Sogoian , Christopher Stephen Yetter , Douglas Glenn Wildes , Stephen Royal Kaiser , Svein Bergstoel , Reinhold Bruestle , Tunc Icoz , Steinar Bjaerum , Chester Frank Saj
发明人： Lowell Scott Smith , Robert Stephen Lewandowski , Bruno Hans Haider , Charles Edward Baumgartner , George Charles Sogoian , Christopher Stephen Yetter , Douglas Glenn Wildes , Stephen Royal Kaiser , Svein Bergstoel , Reinhold Bruestle , Tunc Icoz , Steinar Bjaerum , Chester Frank Saj
IPC分类号： A61B8/00
CPC分类号： G01S7/52079 , G01S7/52017 , G10K11/004
摘要： An ultrasound system is provided for imaging an object. The ultrasound system includes an ultrasound probe for acquiring ultrasound data and a cooling subsystem for actively removing heat from the ultrasound probe. The cooling subsystem includes a pump disposed within a reservoir containing a coolant and configured to circulate the coolant through the ultrasound probe via a conduit.
摘要翻译： 提供用于对物体成像的超声系统。 超声波系统包括用于获取超声数据的超声波探头和用于主动地从超声波探头去除热量的冷却子系统。 冷却子系统包括设置在容纳冷却剂的储存器内的泵，并且构造成通过导管使冷却剂循环通过超声波探头。
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公开(公告)号：US20080146924A1
公开(公告)日：2008-06-19
申请号：US11639891
申请日：2006-12-15
申请人： Lowell Scott Smith , Robert Stephen Lewandowski , Bruno Hans Haider , Charles Edward Baumgartner , George Charles Sogoian , Christopher Stephen Yetter , Douglas Glenn Wildes , Stephen Royal Kaiser , Svein Bergstoel , Reinhold Bruestle , Tunc Icoz , Steinar Bjaerum , Chester Frank Saj
发明人： Lowell Scott Smith , Robert Stephen Lewandowski , Bruno Hans Haider , Charles Edward Baumgartner , George Charles Sogoian , Christopher Stephen Yetter , Douglas Glenn Wildes , Stephen Royal Kaiser , Svein Bergstoel , Reinhold Bruestle , Tunc Icoz , Steinar Bjaerum , Chester Frank Saj
CPC分类号： G01S7/52079 , G01S7/52017 , G10K11/004
摘要： An ultrasound system is provided for imaging an object. The ultrasound system includes an ultrasound probe for acquiring ultrasound data and a cooling subsystem for actively removing heat from the ultrasound probe. The cooling subsystem includes a pump disposed within a reservoir containing a coolant and configured to circulate the coolant through the ultrasound probe via a conduit.
摘要翻译： 提供用于对物体成像的超声系统。 超声波系统包括用于获取超声数据的超声波探头和用于主动地从超声波探头去除热量的冷却子系统。 冷却子系统包括设置在容纳冷却剂的储存器内的泵，并且构造成通过导管使冷却剂循环通过超声波探头。
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公开(公告)号：US06559389B1
公开(公告)日：2003-05-06
申请号：US09617941
申请日：2000-08-25
IPC分类号： H05K103
CPC分类号： H05K1/118 , H01B7/0892 , Y10T29/49124
摘要： A high-density cable of a type suitable for transmitting ultrasound signals from an ultrasonic probe to multiplexing circuitry during a medical ultrasound procedure is provided. The cable includes one or more flexible circuits arranged within a flexible sheath that surrounds and confines the flexible circuits. Each flexible circuit includes an elongate flexible substrate with oppositely-disposed surfaces and multiple conductors on at least one of these surfaces. The opposing longitudinal ends of the substrate define integral connectors for connecting with respective output connectors and/or electronic devices, such as an ultrasonic probe or multiplexing circuitry.
摘要翻译： 提供了一种适用于在医疗超声程序期间将超声波信号从超声波探头发射到复用电路的高密度电缆。 电缆包括布置在柔性护套内的柔性电路，其围绕并限制柔性电路。 每个柔性电路包括具有相对布置的表面的细长柔性基板和在这些表面中的至少一个上的多个导体。 衬底的相对的纵向端部限定了用于与相应的输出连接器和/或诸如超声波探头或多路复用电路的电子设备连接的整体连接器。
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8.发明申请ULTRASOUND CATHETER HOUSING WITH ELECTROMAGNETIC SHIELDING PROPERTIES AND METHODS OF MANUFACTURE 审中-公开具有电磁屏蔽特性的超声波导管外壳及其制造方法公开(公告)号：US20100249602A1
公开(公告)日：2010-09-30
申请号：US12410916
申请日：2009-03-25
IPC分类号： A61B8/12
CPC分类号： A61B8/4461 , A61B8/12 , A61B8/4254 , A61B8/445 , A61B2562/182 , A61L29/106 , C23C14/025 , C23C14/20
摘要： An ultrasound catheter housing with electromagnetic shielding properties and methods of manufacturing is provided. The ultrasound catheter housing comprises a an inner thin wall polymer tube extruded using an ultrasonically transparent polymer, a thin metalized layer deposited on the outer surface of the inner tube, and an outer thin wall polymer tube, which may be the same or a different ultrasonically transparent material. In another embodiment an ultrasound catheter comprising the ultrasound catheter housing is provided.
摘要翻译： 提供具有电磁屏蔽性能和制造方法的超声波导管外壳。 超声导管壳体包括使用超声波透明聚合物挤出的内部薄壁聚合物管，沉积在内管外表面上的薄金属化层和可以是相同或不同超声波的外部薄壁聚合物管 透明材料 在另一个实施例中，提供了包括超声波导管外壳的超声波导管。
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9.发明授权公开(公告)号：US07731516B2
公开(公告)日：2010-06-08
申请号：US12207271
申请日：2008-09-09
申请人： Ferdinand Puttinger , Reinhold Bruestle , Weston Blaine Griffin , Warren Lee , Douglas Glenn Wildes
发明人： Ferdinand Puttinger , Reinhold Bruestle , Weston Blaine Griffin , Warren Lee , Douglas Glenn Wildes
IPC分类号： H01R13/15
CPC分类号： H01R12/88 , A61B8/483 , A61B8/56 , H01R4/5008 , H01R12/73 , H01R24/20 , H01R2107/00 , H01R2201/12 , Y10T403/7005
摘要： An cable connector system is provided. A receptacle for the connector system includes a pair of opposing compression plates and at least one rotatable member configured to move the opposing compression plates as the rotatable member rotates. The compression plates cause contact with a portion of the plug inserted therebetween.
摘要翻译： 提供电缆连接器系统。 用于所述连接器系统的插座包括一对相对的压缩板和至少一个可旋转构件，所述至少一个可旋转构件构造成当所述可旋转构件旋转时使所述相对的压 压缩板与插入其间的插头的一部分接触。
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公开(公告)号：US07622848B2
公开(公告)日：2009-11-24
申请号：US11327779
申请日：2006-01-06
IPC分类号： H01L41/08
CPC分类号： G10K11/002 , A61B8/12 , A61B8/445 , B06B1/0629 , G10K11/34
摘要： A composite structure of a z-axis interconnect is presented. The composite structure includes a plurality of layers of backing material alternatingly arranged between a plurality of interconnect layers, where the plurality of interconnect layers is configured to facilitate coupling the composite structure of the z-axis interconnect to a transducer array, where the composite structure of z-axis interconnect is configured for use in an invasive probe.
摘要翻译： 介绍了z轴互连的复合结构。 复合结构包括交替布置在多个互连层之间的多层背衬材料，其中多个互连层被配置为便于将z轴互连的复合结构耦合到换能器阵列，其中复合结构 z轴互连配置用于侵入性探针。
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