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公开(公告)号：US20080146924A1
公开(公告)日：2008-06-19
申请号：US11639891
申请日：2006-12-15
申请人： Lowell Scott Smith , Robert Stephen Lewandowski , Bruno Hans Haider , Charles Edward Baumgartner , George Charles Sogoian , Christopher Stephen Yetter , Douglas Glenn Wildes , Stephen Royal Kaiser , Svein Bergstoel , Reinhold Bruestle , Tunc Icoz , Steinar Bjaerum , Chester Frank Saj
发明人： Lowell Scott Smith , Robert Stephen Lewandowski , Bruno Hans Haider , Charles Edward Baumgartner , George Charles Sogoian , Christopher Stephen Yetter , Douglas Glenn Wildes , Stephen Royal Kaiser , Svein Bergstoel , Reinhold Bruestle , Tunc Icoz , Steinar Bjaerum , Chester Frank Saj
CPC分类号： G01S7/52079 , G01S7/52017 , G10K11/004
摘要： An ultrasound system is provided for imaging an object. The ultrasound system includes an ultrasound probe for acquiring ultrasound data and a cooling subsystem for actively removing heat from the ultrasound probe. The cooling subsystem includes a pump disposed within a reservoir containing a coolant and configured to circulate the coolant through the ultrasound probe via a conduit.
摘要翻译： 提供用于对物体成像的超声系统。 超声波系统包括用于获取超声数据的超声波探头和用于主动地从超声波探头去除热量的冷却子系统。 冷却子系统包括设置在容纳冷却剂的储存器内的泵，并且构造成通过导管使冷却剂循环通过超声波探头。
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公开(公告)号：US08475375B2
公开(公告)日：2013-07-02
申请号：US11639891
申请日：2006-12-15
申请人： Lowell Scott Smith , Robert Stephen Lewandowski , Bruno Hans Haider , Charles Edward Baumgartner , George Charles Sogoian , Christopher Stephen Yetter , Douglas Glenn Wildes , Stephen Royal Kaiser , Svein Bergstoel , Reinhold Bruestle , Tunc Icoz , Steinar Bjaerum , Chester Frank Saj
发明人： Lowell Scott Smith , Robert Stephen Lewandowski , Bruno Hans Haider , Charles Edward Baumgartner , George Charles Sogoian , Christopher Stephen Yetter , Douglas Glenn Wildes , Stephen Royal Kaiser , Svein Bergstoel , Reinhold Bruestle , Tunc Icoz , Steinar Bjaerum , Chester Frank Saj
IPC分类号： A61B8/00
CPC分类号： G01S7/52079 , G01S7/52017 , G10K11/004
摘要： An ultrasound system is provided for imaging an object. The ultrasound system includes an ultrasound probe for acquiring ultrasound data and a cooling subsystem for actively removing heat from the ultrasound probe. The cooling subsystem includes a pump disposed within a reservoir containing a coolant and configured to circulate the coolant through the ultrasound probe via a conduit.
摘要翻译： 提供用于对物体成像的超声系统。 超声波系统包括用于获取超声数据的超声波探头和用于主动地从超声波探头去除热量的冷却子系统。 冷却子系统包括设置在容纳冷却剂的储存器内的泵，并且构造成通过导管使冷却剂循环通过超声波探头。
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公开(公告)号：US07229292B1
公开(公告)日：2007-06-12
申请号：US11315641
申请日：2005-12-22
IPC分类号： H01R12/00
CPC分类号： H04R1/00 , B06B1/0629 , G10K11/346
摘要： An interconnect assembly is presented. The assembly includes an interconnect structure including a plurality of interconnect layers disposed in a spaced relationship, where each of the plurality of interconnect layers comprises a plurality of conductive traces disposed thereon. Furthermore, the assembly includes a redistribution layer disposed proximate the interconnect structure, where the redistribution layer is configured to facilitate coupling the interconnect structure to the one or more transducer elements on the transducer array.
摘要翻译： 提出了互连组件。 组件包括互连结构，其包括以间隔关系设置的多个互连层，其中多个互连层中的每一个包括布置在其上的多个导电迹线。 此外，组件包括邻近互连结构设置的再分配层，其中再分配层被配置为便于将互连结构耦合到换能器阵列上的一个或多个换能器元件。
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公开(公告)号：US07622848B2
公开(公告)日：2009-11-24
申请号：US11327779
申请日：2006-01-06
IPC分类号： H01L41/08
CPC分类号： G10K11/002 , A61B8/12 , A61B8/445 , B06B1/0629 , G10K11/34
摘要： A composite structure of a z-axis interconnect is presented. The composite structure includes a plurality of layers of backing material alternatingly arranged between a plurality of interconnect layers, where the plurality of interconnect layers is configured to facilitate coupling the composite structure of the z-axis interconnect to a transducer array, where the composite structure of z-axis interconnect is configured for use in an invasive probe.
摘要翻译： 介绍了z轴互连的复合结构。 复合结构包括交替布置在多个互连层之间的多层背衬材料，其中多个互连层被配置为便于将z轴互连的复合结构耦合到换能器阵列，其中复合结构 z轴互连配置用于侵入性探针。
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公开(公告)号：US20050228284A1
公开(公告)日：2005-10-13
申请号：US10814830
申请日：2004-03-31
CPC分类号： G01S15/899 , A61B5/6844 , A61B5/6886 , A61B8/08 , A61B8/4444 , A61B8/546 , G01S7/52096
摘要： An ultrasound system including an ultrasound probe, which has an ultrasonic transducer and a physical sensor adapted to sense engagement with a subject to be scanned by the ultrasonic transducer. The ultrasound system also includes a control system coupled to the ultrasound probe.
摘要翻译： 一种包括超声波探头的超声波系统，其具有超声波换能器和物理传感器，该物理传感器适于感测与被超声换能器扫描的被摄体的接合。 超声系统还包括耦合到超声波探头的控制系统。
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公开(公告)号：US08659148B2
公开(公告)日：2014-02-25
申请号：US12956194
申请日：2010-11-30
申请人： John Eric Tkaczyk , Lowell Scott Smith , Charles Edward Baumgartner , Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Robert Stephen Lewandowski
发明人： John Eric Tkaczyk , Lowell Scott Smith , Charles Edward Baumgartner , Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Robert Stephen Lewandowski
IPC分类号： H01L23/34
CPC分类号： H01L27/20 , A61B8/4483 , H01L27/14634 , H01L27/14658 , H01L2224/16225 , H01L2924/01322 , H01L2924/1461 , H01L2924/00
摘要： A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side and a second side, where the sensor array includes a first plurality of contact pads disposed on the second side of the sensor array, disposing the sensor array on an interconnect layer, where the interconnect layer includes a redistribution layer having a first side and a second side, where the redistribution layer includes a second plurality of contact pads disposed on the first side, an integrated circuit having a plurality of through vias disposed therethrough, where a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, where the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array are aligned with the second plurality of contact pads on the first side of the redistribution layer, operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the redistribution layer to form a sensor stack, coupling the sensor stack to a substrate to form the detector module, and tiling a plurality of detector modules on a second substrate to form the tileable detector array.
摘要翻译： 提出了一种形成可瓦片检测器阵列的方法。 该方法包括形成检测器模块，其中形成检测器模块包括提供具有第一侧和第二侧的传感器阵列，其中传感器阵列包括设置在传感器阵列的第二侧上的第一组多个接触垫， 传感器阵列，其中所述互连层包括具有第一侧和第二侧的再分配层，其中所述再分布层包括设置在所述第一侧上的第二多个接触焊盘，具有多个通孔的集成电路 其中集成电路的第一侧可操作地耦合到再分布层的第二侧，其中传感器阵列设置在互连层上，使得传感器阵列的第二侧上的第一组多个接触焊盘是 与再分配层的第一侧上的第二多个接触焊盘对准，可操作地连接冷杉 传感器阵列的第二侧上的多个接触焊盘连接到再分配层上的第二多个接触焊盘，以形成传感器堆叠，将传感器堆叠耦合到衬底以形成检测器模块，并且平铺多个检测器模块 在第二基板上形成可瓦片检测器阵列。
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公开(公告)号：US20120133001A1
公开(公告)日：2012-05-31
申请号：US12956194
申请日：2010-11-30
申请人： John Eric Tkaczyk , Lowell Scott Smith , Charles Edward Baumgartner , Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Robert Stephen Lewandowski
发明人： John Eric Tkaczyk , Lowell Scott Smith , Charles Edward Baumgartner , Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Robert Stephen Lewandowski
CPC分类号： H01L27/20 , A61B8/4483 , H01L27/14634 , H01L27/14658 , H01L2224/16225 , H01L2924/01322 , H01L2924/1461 , H01L2924/00
摘要： A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side and a second side, where the sensor array includes a first plurality of contact pads disposed on the second side of the sensor array, disposing the sensor array on an interconnect layer, where the interconnect layer includes a redistribution layer having a first side and a second side, where the redistribution layer includes a second plurality of contact pads disposed on the first side, an integrated circuit having a plurality of through vias disposed therethrough, where a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, where the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array are aligned with the second plurality of contact pads on the first side of the redistribution layer, operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the redistribution layer to form a sensor stack, coupling the sensor stack to a substrate to form the detector module, and tiling a plurality of detector modules on a second substrate to form the tileable detector array.
摘要翻译： 提出了一种形成可瓦片检测器阵列的方法。 该方法包括形成检测器模块，其中形成检测器模块包括提供具有第一侧和第二侧的传感器阵列，其中传感器阵列包括设置在传感器阵列的第二侧上的第一组多个接触垫， 传感器阵列，其中所述互连层包括具有第一侧和第二侧的再分配层，其中所述再分布层包括设置在所述第一侧上的第二多个接触焊盘，具有多个通孔的集成电路 其中集成电路的第一侧可操作地耦合到再分布层的第二侧，其中传感器阵列设置在互连层上，使得传感器阵列的第二侧上的第一组多个接触焊盘是 与再分配层的第一侧上的第二多个接触焊盘对准，可操作地连接冷杉 传感器阵列的第二侧上的多个接触焊盘连接到再分配层上的第二多个接触焊盘，以形成传感器堆叠，将传感器堆叠耦合到衬底以形成检测器模块，并且平铺多个检测器模块 在第二基板上形成可瓦片检测器阵列。
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公开(公告)号：US5834880A
公开(公告)日：1998-11-10
申请号：US931338
申请日：1997-09-16
摘要： A method for fabricating "1.5D" and "2D" multilayer ultrasonic transducer arrays employs dicing saw kerfs, which provide acoustic isolation between rows. The kerfs are metallized to provide electrical connection between surface electrode layers and buried internal electrode layers. A multilayer piezoceramic transducer element for a "1.5D" or "2D" array produced by this method has higher capacitance, and accordingly provides better transducer sensitivity, in comparison to a single layer element.
摘要翻译： 用于制造“1.5D”和“2D”多层超声波换能器阵列的方法采用切割锯切割，其提供行之间的隔音。 切口被金属化以提供表面电极层和埋入的内部电极层之间的电连接。 通过该方法制造的用于“1.5D”或“2D”阵列的多层压电陶瓷换能器元件具有较高的电容，因此与单层元件相比提供更好的换能器灵敏度。
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公开(公告)号：US5951304A
公开(公告)日：1999-09-14
申请号：US861043
申请日：1997-05-21
IPC分类号： B81B7/00 , H01L23/498 , H01L23/538 , H05K1/11 , H05K1/14 , H05K3/34 , H05K3/36 , H01R9/09
CPC分类号： H05K1/111 , B81B7/0006 , H01L23/49838 , H01L23/5386 , H05K3/361 , H01L2224/4912 , H01L2224/49173 , H01L24/49 , H01L2924/00014 , H01L2924/07811 , H01L2924/14 , H05K2201/09409 , H05K2201/09418 , H05K3/3421 , Y02P70/611
摘要： For providing multiple-conductor circuit interconnections where there is a lack of precise dimensional control, as in manufacturing flexible printed circuits used to make high density electrical interconnections between ultrasonic transducer elements and the probe cable in a medical ultrasound probe, connection pads are formed in fanout arrays, with the longitudinal axes of individual pads extending along radial lines from the center of a circle. The fanout arrays are formed within generally trapezoidal areas, each having two parallel opposite sides extending along respective parallel chords to accommodate significant variation in dimensions of the respective substrates being connected. Multiple-row connection pad arrays may be provided, each with a plurality of fanout arrays of connection pads that may be parallel to each other and positioned at respectively different distances from the center of the circle, or may be arranged around, and positioned at equal distances from, the center of the circle. If the circuit substrate is anisotropic, the connection pads are on curved pad-locating lines defined by y=Ax.sup..beta., where (x,y)=(0,0) defines the circle center, A is a proportionality constant for the respective pad-locating line, and .beta. is an anisotropy factor.
摘要翻译： 为了提供缺乏精确尺寸控制的多导体电路互连，如制造用于在超声换能器元件和医用超声波探针中的探针电缆之间进行高密度电互连的柔性印刷电路，连接焊盘形成扇形 阵列，其中单个焊盘的纵向轴线沿着从圆心的径向线延伸。 扇出阵列形成在大致梯形区域内，每个具有两个平行的相对侧，每个相对平行的和弦延伸，以适应连接的各个基板的尺寸的显着变化。 可以提供多行连接焊盘阵列，每个阵列具有多个连接焊盘的扇出阵列，其可以彼此平行并且分别位于与圆的中心不同的距离处，或者可以围绕并且位于相等的位置 距离中心的距离。 如果电路基板是各向异性的，则连接焊盘位于由y = Axβ定义的弯曲焊盘定位线上，其中（x，y）=（0,0）定义圆心，A是相应焊盘的比例常数 定位线，β是各向异性因子。
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公开(公告)号：US5704105A
公开(公告)日：1998-01-06
申请号：US707678
申请日：1996-09-04
摘要： A method for fabricating "1.5D" and "2D" multilayer ultrasonic transducer arrays employs dicing saw kerfs, which provide acoustic isolation between rows. The kerfs are metallized to provide electrical connection between surface electrode layers and buried internal electrode layers. A multilayer piezoceramic transducer element for a "1.5D" or "2D" array produced by this method has higher capacitance, and accordingly provides better transducer sensitivity, in comparison to a single layer element.
摘要翻译： 用于制造“1.5D”和“2D”多层超声波换能器阵列的方法采用切割锯切割，其提供行之间的隔音。 切口被金属化以提供表面电极层和埋入的内部电极层之间的电连接。 通过该方法制造的用于“1.5D”或“2D”阵列的多层压电陶瓷换能器元件具有较高的电容，因此与单层元件相比提供更好的换能器灵敏度。
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