公开(公告)号：US20080296708A1

公开(公告)日：2008-12-04

申请号：US11809165

申请日：2007-05-31

申请人： Robert Gideon Wodnicki ,  Wei-Cheng Tian ,  Kevin Matthew Durocher ,  Charles Gerard Woychik ,  Rayette Ann Fisher ,  Stacey Joy Kennerly ,  Lowell Scott Smith ,  Douglas Glenn Wildes

发明人： Robert Gideon Wodnicki ,  Wei-Cheng Tian ,  Kevin Matthew Durocher ,  Charles Gerard Woychik ,  Rayette Ann Fisher ,  Stacey Joy Kennerly ,  Lowell Scott Smith ,  Douglas Glenn Wildes

IPC分类号： H01L21/50 ,  H01L23/00

CPC分类号： G01N29/2406 ,  B06B1/0292 ,  G01N2291/106 ,  H01L2224/04105 ,  H01L2224/24 ,  H01L2224/73267 ,  H01L2224/82

摘要： The present invention relates to a method for making an integrated sensor comprising providing a sensor array fabricated on a top surface of a bulk silicon wafer having a top surface and a bottom surface, and comprising a plurality of sensors fabricated on the top surface of the bulk silicon wafer. The method further comprises coupling an SOI wafer to the top surface of the bulk silicon wafer, thinning the back surface of the bulk silicon wafer, coupling a plurality of integrated circuit die to the back surface of the bulk silicon wafer, and removing the SOI wafer from the top surface of the bulk silicon wafer.

摘要翻译： 本发明涉及一种用于制造集成传感器的方法，其包括提供制造在具有顶表面和底表面的体硅晶片的顶表面上的传感器阵列，并且包括在本体的顶表面上制造的多个传感器 硅晶片。 该方法还包括将SOI晶片耦合到体硅晶片的顶表面，使体硅晶片的背表面变薄，将多个集成电路管芯耦合到体硅晶片的背面，以及去除SOI晶片 从体硅晶片的顶表面。

公开(公告)号：US07781238B2

公开(公告)日：2010-08-24

申请号：US11951360

申请日：2007-12-06

申请人： Robert Gideon Wodnicki ,  Stacey Joy Kennerly ,  Wei-Cheng Tian ,  Kevin Matthew Durocher ,  David Martin Mills ,  Charles Gerard Woychik ,  Lowell Scott Smith

发明人： Robert Gideon Wodnicki ,  Stacey Joy Kennerly ,  Wei-Cheng Tian ,  Kevin Matthew Durocher ,  David Martin Mills ,  Charles Gerard Woychik ,  Lowell Scott Smith

IPC分类号： H01L21/66

CPC分类号： H01L22/20 ,  H01L22/14

摘要： A method for making a testable sensor assembly is provided. The method includes forming a first sensor array on a first substrate having a first side and a second side, wherein the first sensor array is formed on the first side of the first substrate, coupling a first semiconductor wafer having a first side and a second side to the first sensor array, wherein the first side of the first semiconductor wafer is coupled to the first sensor array, thinning one of the second side of the first substrate or the second side of the first semiconductor wafer, and testing the first sensor array to identify operational and non-operational units in the testable sensor assembly before integration of the sensor assembly with interface electronics.

摘要翻译： 提供了制造可测试的传感器组件的方法。 该方法包括在具有第一侧和第二侧的第一衬底上形成第一传感器阵列，其中第一传感器阵列形成在第一衬底的第一侧上，将具有第一侧和第二侧的第一半导体晶片 到第一传感器阵列，其中第一半导体晶片的第一侧耦合到第一传感器阵列，使第一衬底的第二侧或第一半导体晶片的第二面之一变薄，并将第一传感器阵列测试为 在将传感器组件与接口电子器件集成之前，确定可测试传感器组件中的操作和非操作单元。

公开(公告)号：US20090148967A1

公开(公告)日：2009-06-11

申请号：US11951360

申请日：2007-12-06

申请人： Robert Gideon Wodnicki ,  Stacey Joy Kennerly ,  Wei-Cheng Tian ,  Kevin Matthew Durocher ,  David Martin Mills ,  Charles Gerard Woychik ,  Lowell Scott Smith

发明人： Robert Gideon Wodnicki ,  Stacey Joy Kennerly ,  Wei-Cheng Tian ,  Kevin Matthew Durocher ,  David Martin Mills ,  Charles Gerard Woychik ,  Lowell Scott Smith

IPC分类号： H01L21/66

CPC分类号： H01L22/20 ,  H01L22/14

摘要： A method for making a testable sensor assembly is provided. The method includes forming a first sensor array on a first substrate having a first side and a second side, wherein the first sensor array is formed on the first side of the first substrate, coupling a first semiconductor wafer having a first side and a second side to the first sensor array, wherein the first side of the first semiconductor wafer is coupled to the first sensor array, thinning one of the second side of the first substrate or the second side of the first semiconductor wafer, and testing the first sensor array to identify operational and non-operational units in the testable sensor assembly before integration of the sensor assembly with interface electronics.

摘要翻译： 提供了制造可测试的传感器组件的方法。 该方法包括在具有第一侧和第二侧的第一衬底上形成第一传感器阵列，其中第一传感器阵列形成在第一衬底的第一侧上，将具有第一侧和第二侧的第一半导体晶片 到第一传感器阵列，其中第一半导体晶片的第一侧耦合到第一传感器阵列，使第一衬底的第二侧或第一半导体晶片的第二面之一变薄，并将第一传感器阵列测试为 在将传感器组件与接口电子器件集成之前，确定可测试传感器组件中的操作和非操作单元。

公开(公告)号：US08659148B2

公开(公告)日：2014-02-25

申请号：US12956194

申请日：2010-11-30

申请人： John Eric Tkaczyk ,  Lowell Scott Smith ,  Charles Edward Baumgartner ,  Robert Gideon Wodnicki ,  Rayette Ann Fisher ,  Charles Gerard Woychik ,  Robert Stephen Lewandowski

发明人： John Eric Tkaczyk ,  Lowell Scott Smith ,  Charles Edward Baumgartner ,  Robert Gideon Wodnicki ,  Rayette Ann Fisher ,  Charles Gerard Woychik ,  Robert Stephen Lewandowski

IPC分类号： H01L23/34

CPC分类号： H01L27/20 ,  A61B8/4483 ,  H01L27/14634 ,  H01L27/14658 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/1461 ,  H01L2924/00

摘要： A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side and a second side, where the sensor array includes a first plurality of contact pads disposed on the second side of the sensor array, disposing the sensor array on an interconnect layer, where the interconnect layer includes a redistribution layer having a first side and a second side, where the redistribution layer includes a second plurality of contact pads disposed on the first side, an integrated circuit having a plurality of through vias disposed therethrough, where a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, where the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array are aligned with the second plurality of contact pads on the first side of the redistribution layer, operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the redistribution layer to form a sensor stack, coupling the sensor stack to a substrate to form the detector module, and tiling a plurality of detector modules on a second substrate to form the tileable detector array.

摘要翻译： 提出了一种形成可瓦片检测器阵列的方法。 该方法包括形成检测器模块，其中形成检测器模块包括提供具有第一侧和第二侧的传感器阵列，其中传感器阵列包括设置在传感器阵列的第二侧上的第一组多个接触垫， 传感器阵列，其中所述互连层包括具有第一侧和第二侧的再分配层，其中所述再分布层包括设置在所述第一侧上的第二多个接触焊盘，具有多个通孔的集成电路 其中集成电路的第一侧可操作地耦合到再分布层的第二侧，其中传感器阵列设置在互连层上，使得传感器阵列的第二侧上的第一组多个接触焊盘是 与再分配层的第一侧上的第二多个接触焊盘对准，可操作地连接冷杉 传感器阵列的第二侧上的多个接触焊盘连接到再分配层上的第二多个接触焊盘，以形成传感器堆叠，将传感器堆叠耦合到衬底以形成检测器模块，并且平铺多个检测器模块 在第二基板上形成可瓦片检测器阵列。

公开(公告)号：US20120133001A1

公开(公告)日：2012-05-31

申请号：US12956194

申请日：2010-11-30

申请人： John Eric Tkaczyk ,  Lowell Scott Smith ,  Charles Edward Baumgartner ,  Robert Gideon Wodnicki ,  Rayette Ann Fisher ,  Charles Gerard Woychik ,  Robert Stephen Lewandowski

发明人： John Eric Tkaczyk ,  Lowell Scott Smith ,  Charles Edward Baumgartner ,  Robert Gideon Wodnicki ,  Rayette Ann Fisher ,  Charles Gerard Woychik ,  Robert Stephen Lewandowski

IPC分类号： H01L27/00 ,  H01L31/18 ,  H01L21/60

CPC分类号： H01L27/20 ,  A61B8/4483 ,  H01L27/14634 ,  H01L27/14658 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/1461 ,  H01L2924/00

摘要： A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side and a second side, where the sensor array includes a first plurality of contact pads disposed on the second side of the sensor array, disposing the sensor array on an interconnect layer, where the interconnect layer includes a redistribution layer having a first side and a second side, where the redistribution layer includes a second plurality of contact pads disposed on the first side, an integrated circuit having a plurality of through vias disposed therethrough, where a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, where the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array are aligned with the second plurality of contact pads on the first side of the redistribution layer, operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the redistribution layer to form a sensor stack, coupling the sensor stack to a substrate to form the detector module, and tiling a plurality of detector modules on a second substrate to form the tileable detector array.

摘要翻译： 提出了一种形成可瓦片检测器阵列的方法。 该方法包括形成检测器模块，其中形成检测器模块包括提供具有第一侧和第二侧的传感器阵列，其中传感器阵列包括设置在传感器阵列的第二侧上的第一组多个接触垫， 传感器阵列，其中所述互连层包括具有第一侧和第二侧的再分配层，其中所述再分布层包括设置在所述第一侧上的第二多个接触焊盘，具有多个通孔的集成电路 其中集成电路的第一侧可操作地耦合到再分布层的第二侧，其中传感器阵列设置在互连层上，使得传感器阵列的第二侧上的第一组多个接触焊盘是 与再分配层的第一侧上的第二多个接触焊盘对准，可操作地连接冷杉 传感器阵列的第二侧上的多个接触焊盘连接到再分配层上的第二多个接触焊盘，以形成传感器堆叠，将传感器堆叠耦合到衬底以形成检测器模块，并且平铺多个检测器模块 在第二基板上形成可瓦片检测器阵列。

公开(公告)号：US07451651B2

公开(公告)日：2008-11-18

申请号：US11636822

申请日：2006-12-11

申请人： Charles Gerard Woychik ,  Rayette Ann Fisher ,  David Martin Mills ,  Scott Cogan ,  David Richard Esler ,  Robert Gideon Wodnicki ,  Jeffrey Scott Erlbaum

发明人： Charles Gerard Woychik ,  Rayette Ann Fisher ,  David Martin Mills ,  Scott Cogan ,  David Richard Esler ,  Robert Gideon Wodnicki ,  Jeffrey Scott Erlbaum

IPC分类号： G01N29/00

CPC分类号： G01D11/245 ,  B06B1/0292 ,  B06B1/0629 ,  G01N29/2437 ,  G01N2291/106 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/73257 ,  H01L2924/00014 ,  H01L2924/01322 ,  Y10T29/49004 ,  Y10T29/49007 ,  H01L2924/00 ,  H01L2224/05099

摘要： A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology.

公开(公告)号：US07892176B2

公开(公告)日：2011-02-22

申请号：US11743391

申请日：2007-05-02

申请人： Robert Gideon Wodnicki ,  David Martin Mills ,  Rayette Ann Fisher ,  Charles Gerard Woychik

发明人： Robert Gideon Wodnicki ,  David Martin Mills ,  Rayette Ann Fisher ,  Charles Gerard Woychik

IPC分类号： A61B8/14

CPC分类号： H01L27/0207 ,  A61B8/0833 ,  A61B8/4483 ,  B06B1/0629 ,  H01L27/11803 ,  H01L27/14634

摘要： An ultrasonic monitoring system is formed with a probe unit. In one example an array of transducer cells is arranged in rows and columns formed along a first plane with a first pitch along a first direction. An integrated circuit including an array of circuit cells is formed along a second plane parallel to the first plane. The circuit cells are spaced apart along the first direction at a second pitch smaller than the first pitch. A first of the transducer cells is vertically aligned, along a direction normal to one of the planes, with a first of the circuit cells and having a connection thereto. A second of the transducer cells is offset from vertical alignment with respect to the position of a second circuit cell so as to not overlie the second circuit cell. A connection subsystem is positioned between the array of transducer cells and the array of circuit cells, configured to form connection of the first transducer cell to the first circuit cell and connection of the second transducer cell with the second circuit cell.

摘要翻译： 用探针单元形成超声波监测系统。 在一个示例中，换能器单元的阵列沿着沿着第一方向以第一间距沿第一平面形成的行和列布置。 包括电路单元阵列的集成电路沿与第一平面平行的第二平面形成。 电路单元沿着第一方向以比第一间距小的第二间距分开。 换能器单元中的第一个沿着垂直于一个平面的方向与第一个电路单元垂直对齐并且具有与其的连接。 第二个换能器单元相对于第二电路单元的位置偏离垂直对准，以便不覆盖第二电路单元。 连接子系统位于换能器单元阵列和电路单元阵列之间，被配置为形成第一换能器单元与第一电路单元的连接以及第二换能器单元与第二电路单元的连接。

公开(公告)号：US20080315331A1

公开(公告)日：2008-12-25

申请号：US11767554

申请日：2007-06-25

申请人： Robert Gideon Wodnicki ,  David Martin Mills ,  Rayette Ann Fisher ,  Charles Gerard Woychik

发明人： Robert Gideon Wodnicki ,  David Martin Mills ,  Rayette Ann Fisher ,  Charles Gerard Woychik

IPC分类号： H01L21/00 ,  H01L27/14

CPC分类号： B06B1/0629 ,  G01S7/52079 ,  G01S15/8925 ,  G01S15/8927 ,  G10K11/004

摘要： An ultrasound monitoring system. In one embodiment, an array of transducer cells is formed along a first plane and an integrated circuit structure, formed along a second plane parallel to the first plane, includes an array of circuit cells. A connector provides electrical connections between the array of transducer cells and the array of circuit cells, and an interconnection structure is connected to transfer signals between the circuit cells and processing and control circuitry. The integrated circuit structure includes a semiconductor substrate and a plurality of conductive through-die vias formed through the substrate to provide Input/Output (I/O) connections between the transducer cells and the interconnection structure. The monitoring system may be configured as an imaging system and the processing and control circuitry may be external to the probe unit.

摘要翻译： 超声波监测系统。 在一个实施例中，沿着第一平面形成一组换能器单元，并且沿着平行于第一平面的第二平面形成的集成电路结构包括电路单元阵列。 连接器提供换能器阵列阵列与电路单元阵列之间的电连接，并且连接互连结构以在电路单元和处理和控制电路之间传送信号。 集成电路结构包括半导体衬底和通过衬底形成的多个导电贯通管道通孔，以在换能器单元和互连结构之间提供输入/输出（I / O）连接。 监视系统可以被配置为成像系统，并且处理和控制电路可以在探针单元的外部。

公开(公告)号：US20080273424A1

公开(公告)日：2008-11-06

申请号：US11743391

申请日：2007-05-02

申请人： Robert Gideon Wodnicki ,  David Martin Mills ,  Rayette Ann Fisher ,  Charles Gerard Woychik

发明人： Robert Gideon Wodnicki ,  David Martin Mills ,  Rayette Ann Fisher ,  Charles Gerard Woychik

IPC分类号： H02N2/00

CPC分类号： H01L27/0207 ,  A61B8/0833 ,  A61B8/4483 ,  B06B1/0629 ,  H01L27/11803 ,  H01L27/14634

摘要： An ultrasonic monitoring system is formed with a probe unit. In one example an array of transducer cells is arranged in rows and columns formed along a first plane with a first pitch along a first direction. An integrated circuit including an array of circuit cells is formed along a second plane parallel to the first plane. The circuit cells are spaced apart along the first direction at a second pitch smaller than the first pitch. A first of the transducer cells is vertically aligned, along a direction normal to one of the planes, with a first of the circuit cells and having a connection thereto. A second of the transducer cells is offset from vertical alignment with respect to the position of a second circuit cell so as to not overlie the second circuit cell. A connection subsystem is positioned between the array of transducer cells and the array of circuit cells, configured to form connection of the first transducer cell to the first circuit cell and connection of the second transducer cell with the second circuit cell.

摘要翻译： 用探针单元形成超声波监测系统。 在一个示例中，换能器单元的阵列沿着沿着第一方向以第一间距沿第一平面形成的行和列布置。 包括电路单元阵列的集成电路沿与第一平面平行的第二平面形成。 电路单元沿着第一方向以比第一间距小的第二间距分开。 换能器单元中的第一个沿着垂直于一个平面的方向与第一个电路单元垂直对齐并且具有与其的连接。 第二个换能器单元相对于第二电路单元的位置偏离垂直对准，以便不覆盖第二电路单元。 连接子系统位于换能器单元阵列和电路单元阵列之间，被配置为形成第一换能器单元与第一电路单元的连接以及第二换能器单元与第二电路单元的连接。

公开(公告)号：US20110071397A1

公开(公告)日：2011-03-24

申请号：US12714239

申请日：2010-02-26

申请人： Robert Gideon Wodnicki ,  Rayette Ann Fisher ,  Charles Gerard Woychik ,  Shubhra Bansal ,  Albert Taesung Byun

发明人： Robert Gideon Wodnicki ,  Rayette Ann Fisher ,  Charles Gerard Woychik ,  Shubhra Bansal ,  Albert Taesung Byun

IPC分类号： A61B8/00 ,  B23K31/02

CPC分类号： B23K1/0016 ,  B06B1/0629

摘要： A modular and tileable sensor array with routing in the interposer carrying the signals from the sensors to the integrated circuits. In one embodiment a large area modular sensor array assembly includes one or more tileable modules coupled together. The tileable modules have a plurality of transducer cells forming a sensor, an interposer coupled on a first side to the plurality of transducer cells by a plurality, one or more integrated circuits coupled to a second side of the interposer, wherein the interposer is configured to form the connection of at least some of the transducer cells to the integrated circuits, and one or more input/output connectors coupled to the interposer and providing an external interface.

摘要翻译： 一种模块化且可分散的传感器阵列，其具有在插入器中的路由，其将来自传感器的信号传送到集成电路。 在一个实施例中，大面积模块化传感器阵列组件包括耦合在一起的一个或多个可瓦片模块。 可拼接模块具有形成传感器的多个换能器单元，通过耦合到中介层的第二侧的多个一个或多个集成电路在第一侧耦合到多个换能器单元的插入件，其中插入件配置成 形成至少一些传感器单元与集成电路的连接，以及耦合到插入器并提供外部接口的一个或多个输入/输出连接器。