公开(公告)号：US20190256994A1

公开(公告)日：2019-08-22

申请号：US16074346

申请日：2016-02-16

Applicant: LumiShield Technologies Incorporated

Inventor： Hunaid B. NULWALA ,  John D. WATKINS ,  Xu ZHOU

IPC: C25D3/44 ,  C25D9/08 ,  C25D3/54 ,  C23C28/00 ,  C25D3/56

Abstract: The disclosure relates to a method for the electrodeposition of at least one metal onto a surface of a conductive substrate. In some embodiments, the electrodeposition is conducted at a temperature from about 10° C. to about 70° C., about 0.5 atm to about 5 atm, in an atmosphere comprising oxygen. In some embodiments, the method comprises electrodepositing the at least one metal via electrochemical reduction of a metal complex dissolved in a substantially aqueous medium.

公开(公告)号：US20220127744A1

公开(公告)日：2022-04-28

申请号：US17427345

申请日：2020-02-03

Applicant: LUMISHIELD TECHNOLOGIES INCORPORATED

Inventor： John D. WATKINS ,  Hunaid B. NULWALA

IPC: C25D9/10

Abstract: Methods and compositions for improving adhesion of an organic coating applied to a surface of a conductive substrate are provided. In aspects described, at least one reactive metal-based deposit is electrodeposited on a conductive substrate by pulse electrochemical reduction of a metal complex using a pulse scheme, wherein the metal complex is dissolved in a substantially aqueous medium.

公开(公告)号：US20180347058A1

公开(公告)日：2018-12-06

申请号：US15995220

申请日：2018-06-01

Applicant: LumiShield Technologies Incorporated

Inventor： Hunaid B. NULWALA ,  John D. WATKINS

IPC: C25D3/44 ,  C25D3/54 ,  C25D5/10

CPC classification number: C25D3/54 ,  C25D3/56 ,  C25D9/08 ,  C25D9/10 ,  C25D9/12

Abstract: Methods and compositions for electrodepositing mixed metal reactive metal layers by combining reactive metal complexes with electron withdrawing agents are provided. Modifying the ratio of one reactive metal complex to the other and varying the current density can be used to vary the morphology the metal layer on the substrate.