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公开(公告)号：US11374588B1
公开(公告)日：2022-06-28
申请号：US17236827
申请日：2021-04-21
发明人： Chi Mo , Donghai Wang , Quazi Ikram , Ahmad Yazdi
摘要： An analog to digital converter temperature compensation system comprising a comparator configured to compare an analog input signal to a compensated feedback signal and generate a comparator output. A SAR module processes the comparator output to generate a digital signal. A digital to analog converter, biased by a biasing signal having temperature change induced error, is configured to convert the digital signal to a feedback signal and a detector is configured to detect a signal that is proportional to temperature. A look-up table is configured to receive and convert the signal that is proportional to temperature to a compensation signal such that the compensation signal compensates for the temperature change induced error in the biasing signal. A summing node combines the feedback signal with the compensation signal to create a compensated feedback signal.
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公开(公告)号：US10347571B1
公开(公告)日：2019-07-09
申请号：US15865745
申请日：2018-01-09
发明人： Andrzej Rozbicki , Chi Mo , Cristiano Bazzani
IPC分类号： H01L23/00 , H01L23/31 , H01L23/66 , H01L23/495 , H01L23/498 , H01L23/528 , H01L23/552
CPC分类号： H01L23/49811 , H01L23/3121 , H01L23/4952 , H01L23/49568 , H01L23/528 , H01L23/552 , H01L23/66 , H01L24/46 , H01L24/49 , H01L2223/6605 , H01L2223/6644
摘要： In one example, a device having integrated package interference isolation includes a ground pad, an integrated circuit device die secured to the ground pad, a substrate secured to the ground pad, at least one a high-frequency, high-power semiconductor device secured to a top mounting surface of the substrate. For electromagnetic isolation, the integrated circuit device die includes a top metal, and the substrate includes a metal via electrically coupled to a metal trace that extends on the top mounting surface of the substrate. The device package also includes a number of ground pad bonding wires that electrically couple the redistribution layer of the integrated circuit device die and the metal trace to the ground pad. The redistribution layer of the integrated circuit device die and the metal trace and via of the substrate help to shield electromagnetic radiation between components in the device package.
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公开(公告)号：US20190103726A1
公开(公告)日：2019-04-04
申请号：US16152171
申请日：2018-10-04
发明人： Cristiano Bazzani , Chi Mo
摘要： A circuit and method provide a headroom voltage for a laser driver driving a laser diode such that the laser diode provides signals to an optical communications device. The circuit includes a headroom control circuit receiving the headroom voltage from the laser driver, the headroom control circuit generating a controlled voltage based on the headroom voltage, and a DC-DC converter receiving the controlled voltage from the headroom control circuit generating a voltage Vout based on the controlled voltage, and applying the voltage Vout as an input to the laser diode. The headroom control circuit and the DC-DC converter are connected in a feedback loop with the laser diode to continuously provide the voltage Vout to the laser diode, and the DC-DC converter modifies the voltage Vout to compensate for burn-in characteristics or temperature drift of the laser diode over time to maintain an optimized headroom voltage for the laser driver.
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公开(公告)号：US10756631B2
公开(公告)日：2020-08-25
申请号：US16355463
申请日：2019-03-15
发明人： Andrew Patterson , Brendan Foley , Michelle Dowling , Chi Mo
摘要： A multi-voltage converter is described that includes integrated temperature-protection circuitry. The converter may be used to bias radio-frequency components such as PIN diodes and gallium-nitride devices, and may include integrated bias-sequencing circuitry. Programmable output voltages as high as 30 volts and as low as −20 volts may be generated.
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公开(公告)号：US10560062B2
公开(公告)日：2020-02-11
申请号：US15356336
申请日：2016-11-18
发明人： Brendan Foley , Michelle Dowling , Chi Mo
摘要： Driving circuitry is described that includes multiple programmable bias voltages useful for biasing radio-frequency components such as PIN diodes and gallium-nitride devices. Programmable voltages as high as 30 volts and as low as −20 volts are generated. The drive circuitry can operate from a single, low-voltage power source.
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公开(公告)号：US20190214335A1
公开(公告)日：2019-07-11
申请号：US15865745
申请日：2018-01-09
发明人： Andrzej Rozbicki , Chi Mo , Cristiano Bazzani
IPC分类号： H01L23/498 , H01L23/31 , H01L23/00 , H01L23/528 , H01L23/552 , H01L23/495
摘要： In one example, a device having integrated package interference isolation includes a ground pad, an integrated circuit device die secured to the ground pad, a substrate secured to the ground pad, at least one a high-frequency, high-power semiconductor device secured to a top mounting surface of the substrate. For electromagnetic isolation, the integrated circuit device die includes a top metal, and the substrate includes a metal via electrically coupled to a metal trace that extends on the top mounting surface of the substrate. The device package also includes a number of ground pad bonding wires that electrically couple the redistribution layer of the integrated circuit device die and the metal trace to the ground pad. The redistribution layer of the integrated circuit device die and the metal trace and via of the substrate help to shield electromagnetic radiation between components in the device package.
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