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Patent Agency Ranking
公开(公告)号：US12099386B2
公开(公告)日：2024-09-24
申请号：US16519716
申请日：2019-07-23
Applicant: MAGIC LEAP, INC.
Inventor： Guillermo Padin Rohena , Adam Carl Wright , William Chow , Gary Quartana, Jr. , Humberto Eduardo Garcia , Jose Felix Rodriguez , Matthew Thomas Hull , Paul Daniel Lindquist
CPC classification number: G06F1/206 , G05B15/02 , G06F1/203 , H02H1/0007 , H02H5/04 , H05K7/20172 , H05K7/20209
Abstract: Various embodiments relate to a thermal management system for an electronic device, such as an augmented reality or virtual reality device. The thermal management system can comprise an active cooling mechanism in various embodiments to dynamically or actively cool components of the device, for example, by adjust fan speeds of a fan assembly. In some embodiments, a hardware shutdown mechanism can be provided to shut down the device if software-based thermal management devices are inoperable. In some embodiments, the air flow into and/or within the electronic device can be adjusted to cool various components of the device.
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公开(公告)号：US20240402773A1
公开(公告)日：2024-12-05
申请号：US18800575
申请日：2024-08-12
Applicant: MAGIC LEAP, INC.
Inventor： Guillermo Padin Rohena , Adam Carl Wright , William Chow , Gary Quartana, Jr. , Humberto Eduardo Garcia , Jose Felix Rodriguez , Matthew Thomas Hull , Paul Daniel Lindquist
Abstract: Various embodiments relate to a thermal management system for an electronic device, such as an augmented reality or virtual reality device. The thermal management system can comprise an active cooling mechanism in various embodiments to dynamically or actively cool components of the device, for example, by adjust fan speeds of a fan assembly. In some embodiments, a hardware shutdown mechanism can be provided to shut down the device if software-based thermal management devices are inoperable. In some embodiments, the air flow into and/or within the electronic device can be adjusted to cool various components of the device.
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公开(公告)号：US11797065B2
公开(公告)日：2023-10-24
申请号：US17127826
申请日：2020-12-18
Applicant: Magic Leap, Inc.
Inventor： John Aguirre , Youlin Jin , Ralph Remsburg , Guillermo Padin Rohena , Evan Francis Rynk , Carlos Julio Suate Pedroza , Gary Quartana, Jr. , Bradley Fraser , Haney Awad , William Wheeler , Shigeru Natsume
IPC: G06F1/18 , G06F1/16 , G06F1/20 , H05K7/20 , H05K7/14 , G06T19/00 , G02B27/01 , G06F3/01 , F04D29/60 , F04D25/06 , F04D29/58 , F04D29/42
CPC classification number: G06F1/188 , F04D25/0613 , F04D29/4226 , F04D29/5853 , F04D29/601 , G02B27/017 , G06F1/163 , G06F1/1613 , G06F1/1635 , G06F1/181 , G06F1/203 , G06F3/011 , G06T19/006 , H05K7/14 , H05K7/20172 , G02B2027/0178
Abstract: A fan assembly is disclosed. The fan assembly can include a first support frame. The fan assembly can comprise a shaft assembly having a first end coupled with the first support frame and a second end disposed away from the first end. A second support frame can be coupled with the first support frame and disposed at or over the second end of the shaft assembly. An impeller can have fan blades coupled with a hub, the hub being disposed over the shaft assembly for rotation between the first and second support frames about a longitudinal axis. Transverse loading on the shaft assembly can be controlled by the first and second support frames.
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公开(公告)号：US20230409093A1
公开(公告)日：2023-12-21
申请号：US18243048
申请日：2023-09-06
Applicant: Magic Leap, Inc.
Inventor： John Aguirre , Youlin Jin , Ralph Remsburg , Guillermo Padin Rohena , Evan Francis Rynk , Carlos Julio Suate Pedroza , Gary Quartana, Jr. , Bradley Fraser , Haney Awad , William Wheeler , Shigeru Natsume
IPC: G06F1/18 , H05K7/20 , H05K7/14 , G06T19/00 , G06F1/16 , G06F1/20 , G02B27/01 , F04D29/60 , G06F3/01 , F04D25/06 , F04D29/58 , F04D29/42
CPC classification number: G06F1/188 , H05K7/20172 , H05K7/14 , G06T19/006 , G06F1/163 , G06F1/203 , G02B27/017 , G06F1/1635 , G06F1/181 , G06F1/1613 , F04D29/601 , G06F3/011 , F04D25/0613 , F04D29/5853 , F04D29/4226 , G02B2027/0178
Abstract: A fan assembly is disclosed. The fan assembly can include a first support frame. The fan assembly can comprise a shaft assembly having a first end coupled with the first support frame and a second end disposed away from the first end. A second support frame can be coupled with the first support frame and disposed at or over the second end of the shaft assembly. An impeller can have fan blades coupled with a hub, the hub being disposed over the shaft assembly for rotation between the first and second support frames about a longitudinal axis. Transverse loading on the shaft assembly can be controlled by the first and second support frames.
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公开(公告)号：US12085999B2
公开(公告)日：2024-09-10
申请号：US18243048
申请日：2023-09-06
Applicant: Magic Leap, Inc.
Inventor： John Aguirre , Youlin Jin , Ralph Remsburg , Guillermo Padin Rohena , Evan Francis Rynk , Carlos Julio Suate Pedroza , Gary Quartana, Jr. , Bradley Fraser , Haney Awad , William Wheeler , Shigeru Natsume
IPC: G06F1/16 , F04D25/06 , F04D29/42 , F04D29/58 , F04D29/60 , G02B27/01 , G06F1/18 , G06F1/20 , G06F3/01 , G06T19/00 , H05K7/14 , H05K7/20
CPC classification number: G06F1/188 , F04D25/0613 , F04D29/4226 , F04D29/5853 , F04D29/601 , G02B27/017 , G06F1/1613 , G06F1/163 , G06F1/1635 , G06F1/181 , G06F1/203 , G06F3/011 , G06T19/006 , H05K7/14 , H05K7/20172 , G02B2027/0178
Abstract: A fan assembly is disclosed. The fan assembly can include a first support frame. The fan assembly can comprise a shaft assembly having a first end coupled with the first support frame and a second end disposed away from the first end. A second support frame can be coupled with the first support frame and disposed at or over the second end of the shaft assembly. An impeller can have fan blades coupled with a hub, the hub being disposed over the shaft assembly for rotation between the first and second support frames about a longitudinal axis. Transverse loading on the shaft assembly can be controlled by the first and second support frames.
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