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公开(公告)号:US12083968B2
公开(公告)日:2024-09-10
申请号:US18366047
申请日:2023-08-07
Applicant: Magna Electronics Inc.
Inventor: Brian J. Winden
IPC: B60R11/04 , B60R1/24 , B62D65/14 , H04N23/51 , H04N23/54 , H04N23/55 , B60R1/27 , B60R1/30 , B60R1/31 , B60R11/00
CPC classification number: B60R11/04 , B60R1/24 , B62D65/14 , H04N23/51 , H04N23/54 , H04N23/55 , B60R1/27 , B60R1/30 , B60R1/31 , B60R2011/0026 , B60R2300/105 , B60R2300/30 , B60R2300/607
Abstract: A vehicular camera system includes an attaching structure configured to attach at an in-cabin side of a vehicle windshield. A camera module accommodates a circuit board having circuitry disposed at both sides of the circuit board. An imager is disposed at a first side of the circuit board. The camera module includes a lens accommodated in a lens barrel. With the attaching structure attached at the in-cabin side of the vehicle windshield, and with the camera module attached at the attaching structure, the lens barrel protrudes from the casing and a portion of the lens barrel is partially disposed in a pocket defined by the stray light shield and the vehicle windshield. A coaxial connector is electrically connected to circuitry disposed at the second side of the circuit board. Image data captured by the camera module is transferred to an electronic control unit of the vehicle via the coaxial connector.
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公开(公告)号:US11108939B2
公开(公告)日:2021-08-31
申请号:US16947893
申请日:2020-08-24
Applicant: MAGNA ELECTRONICS INC.
Inventor: Brian J. Winden , Robert A. Devota , Matthew C. Sesti , Joseph A. Stemmer , Steven V. Byrne , John R. Garcia , David F. Olson
IPC: H04N5/00 , H04N5/225 , C09J163/00 , C09J5/00
Abstract: A method for assembling an imager assembly for a vehicular camera includes providing a lens barrel that accommodates a lens, providing a lens holder, and providing a PCB with an imager disposed thereat. A cylindrical portion of the lens barrel is disposed in a cylindrical passageway of the lens holder and the PCB is disposed at the lens holder. An adhesive is dispensed to hold the lens optically aligned with the imager. After the lens is optically aligned with the imager, the adhesive is initially cured to an initially-cured state in an initial curing process for an initial-cure time period. The adhesive is further cured to a further-cured state in a secondary curing process for a longer further-cure time period. As further cured, the further-cured adhesive maintains optical alignment of the lens with the imager for use of the imager assembly in a vehicular camera in a vehicle.
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公开(公告)号:US20210021742A1
公开(公告)日:2021-01-21
申请号:US16947893
申请日:2020-08-24
Applicant: Magna Electronics Inc.
Inventor: Brian J. Winden , Robert A. Devota , Matthew C. Sesti , Joseph A. Stemmer , Steven V. Byrne , John R. Garcia , David F. Olson
IPC: H04N5/225 , C09J163/00 , C09J5/00
Abstract: A method for assembling an imager assembly for a vehicular camera includes providing a lens barrel that accommodates a lens, providing a lens holder, and providing a PCB with an imager disposed thereat. A cylindrical portion of the lens barrel is disposed in a cylindrical passageway of the lens holder and the PCB is disposed at the lens holder. An adhesive is dispensed to hold the lens optically aligned with the imager. After the lens is optically aligned with the imager, the adhesive is initially cured to an initially-cured state in an initial curing process for an initial-cure time period. The adhesive is further cured to a further-cured state in a secondary curing process for a longer further-cure time period. As further cured, the further-cured adhesive maintains optical alignment of the lens with the imager for use of the imager assembly in a vehicular camera in a vehicle.
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公开(公告)号:US20200059585A1
公开(公告)日:2020-02-20
申请号:US16665062
申请日:2019-10-28
Applicant: MAGNA ELECTRONICS INC.
Inventor: Jianguo Wang , Garret Achenbach , Ove Salomonsson , Tom H. Toma , Edward R. Ahlquist, JR. , Brian J. Winden , Christopher L. Van Dan Elzen
Abstract: A vehicular camera module includes a housing that houses a lens barrel, a lens holder, a main circuit board, and an imager disposed on an imager circuit board that is electrically connected with the main circuit board. The main circuit board includes a main PCB and the imager circuit board includes an imager PCB. Circuitry disposed at the main PCB includes an image processor for processing image data captured by the imager. The main circuit board is accommodated within front and rear portions of the housing, while the imager is accommodated within the rear portion and is not accommodated within the front portion. The imager views exterior of the housing via an opening of the upper cover at the rear portion of the housing, and the lens barrel extends through the opening. The lens barrel is tilted at an acute angle upward relative to the plane of the main PCB.
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公开(公告)号:US20150124098A1
公开(公告)日:2015-05-07
申请号:US14535739
申请日:2014-11-07
Applicant: MAGNA ELECTRONICS INC.
Inventor: Brian J. Winden , Robert A. Devota , Matthew C. Sesti , Joseph A. Stemmer , Steven V. Byrne , John R. Garcia , David F. Olson
IPC: H04N5/225 , C09J163/00 , B60R1/00
CPC classification number: H04N5/2254 , C09J5/00 , C09J163/00 , C09J2463/00 , H04N5/2252 , H04N5/2253
Abstract: A vehicular camera includes a lens, a printed circuit board and an imager. The lens has a plurality of optical element and is disposed at a lens holder. The imager is disposed at the printed circuit board. The adhesive is initially curable in an initial radiation curing process that comprises exposure to UV light, and initially-cured adhesive is further curable to a further cured strength in a secondary thermal curing process. The adhesive is initially cured via the initial radiation curing process after the lens is brought into focus with the imager and is optically center-aligned therewith. The initially-cured adhesive, as cured via the initial radiation curing process, holds the lens optically center-aligned and in focus with the imager. After the initial radiation curing process, the lens holder, adhesively attached to one of the printed circuit board and the holding element, is moved to the secondary thermal curing process.
Abstract translation: 车载摄像机包括透镜,印刷电路板和成像器。 透镜具有多个光学元件并且设置在透镜保持器上。 成像器设置在印刷电路板上。 初始辐射固化过程中,粘合剂最初可固化,其包括暴露在紫外光下,并且初始固化的粘合剂在二次热固化过程中进一步固化成另外的固化强度。 在透镜与成像器聚焦之后,首先通过初始辐射固化工艺固化粘合剂,并与其光学中心对齐。 通过初始辐射固化过程固化的初始固化的粘合剂将透镜光学中心对准并与成像器聚焦。 在最初的辐射固化处理之后,粘附到印刷电路板和保持元件之一的透镜架移动到二次热固化过程。
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公开(公告)号:US12162412B2
公开(公告)日:2024-12-10
申请号:US18337486
申请日:2023-06-20
Applicant: MAGNA ELECTRONICS INC.
Inventor: Garret F. Achenbach , Brian J. Winden , Christopher L. Van Dan Elzen
IPC: H04N5/235 , B60R1/04 , B60R1/12 , B60R11/04 , H04N23/51 , H04N23/54 , H04N23/55 , H04N23/57 , B60K35/22 , B60K35/28 , B60K35/60 , B60R11/00 , H04N23/52
Abstract: A vehicular camera system includes a camera module having an imager assembly, a main circuit board and a camera housing. The imager assembly includes (i) an imager disposed on an imager circuit board and (ii) a lens holder having a lens assembly that includes a lens barrel accommodating a lens. The imager assembly includes a flexible ribbon cable that electrically connects to an electrical connector at a multilayered PCB of the main circuit board. The camera housing includes an upper cover and a lower cover and includes a forward portion and a rearward portion. The main circuit board is accommodated within the forward and rearward portions, and the imager is disposed at the rearward portion and is not disposed at the forward portion of the camera housing. The lens holder is attached at the upper cover of the camera housing.
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公开(公告)号:US11997392B2
公开(公告)日:2024-05-28
申请号:US18464354
申请日:2023-09-11
Applicant: Magna Electronics Inc.
Inventor: Jianguo Wang , Garret Achenbach , Ove Salomonsson , Tom H. Toma , Edward R. Ahlquist, Jr. , Brian J. Winden , Christopher L. Van Dan Elzen
CPC classification number: H04N23/70 , B60R11/04 , H04N7/18 , H04N7/183 , H04N23/55 , H05K999/99 , B60R2011/0026 , H04N23/51 , H04N23/57
Abstract: A vehicular camera module includes a main circuit board electrically connected with an imager circuit board having an imager disposed thereat. The vehicular camera module includes a housing having an upper cover and a lower cover that are joined together. Electronic circuitry disposed at a main printed circuit board of the main circuit board includes an image processor. The electronic circuitry disposed at the main printed circuit board of the main circuit board includes an electrical connector configured for electrical connection to a connector of a vehicular wire harness. With the imager operated to capture image data, captured image data is provided via a flexible ribbon cable to the electronic circuitry disposed at the main printed circuit board of the main circuit board. The imager is disposed within a rear portion of the housing and is not accommodated within a front portion of the housing.
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公开(公告)号:US20230421907A1
公开(公告)日:2023-12-28
申请号:US18464354
申请日:2023-09-11
Applicant: Magna Electronics Inc.
Inventor: Jianguo Wang , Garret Achenbach , Ove Salomonsson , Tom H. Toma , Edward R. Ahlquist, JR. , Brian J. Winden , Christopher L. Van Dan Elzen
CPC classification number: H04N23/70 , B60R11/04 , H04N7/18 , H04N7/183 , H04N23/55 , H05K999/99 , B60R2011/0026
Abstract: A vehicular camera module includes a main circuit board electrically connected with an imager circuit board having an imager disposed thereat. The vehicular camera module includes a housing having an upper cover and a lower cover that are joined together. Electronic circuitry disposed at a main printed circuit board of the main circuit board includes an image processor. The electronic circuitry disposed at the main printed circuit board of the main circuit board includes an electrical connector configured for electrical connection to a connector of a vehicular wire harness. With the imager operated to capture image data, captured image data is provided via a flexible ribbon cable to the electronic circuitry disposed at the main printed circuit board of the main circuit board. The imager is disposed within a rear portion of the housing and is not accommodated within a front portion of the housing.
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公开(公告)号:US20230331153A1
公开(公告)日:2023-10-19
申请号:US18337486
申请日:2023-06-20
Applicant: MAGNA ELECTRONICS INC.
Inventor: Garret F. Achenbach , Brian J. Winden , Christopher L. Van Dan Elzen
CPC classification number: B60R1/00 , H04N23/51 , H04N23/54 , H04N23/55 , H04N23/57 , B60R1/04 , B60R1/12 , B60R11/04 , Y10T29/49169 , B60K2370/21 , B60K2370/152 , B60K2370/173 , B60K2370/777 , H04N23/52
Abstract: A vehicular camera system includes a camera module having an imager assembly, a main circuit board and a camera housing. The imager assembly includes (i) an imager disposed on an imager circuit board and (ii) a lens holder having a lens assembly that includes a lens barrel accommodating a lens. The imager assembly includes a flexible ribbon cable that electrically connects to an electrical connector at a multilayered PCB of the main circuit board. The camera housing includes an upper cover and a lower cover and includes a forward portion and a rearward portion. The main circuit board is accommodated within the forward and rearward portions, and the imager is disposed at the rearward portion and is not disposed at the forward portion of the camera housing. The lens holder is attached at the upper cover of the camera housing.
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公开(公告)号:US11758274B2
公开(公告)日:2023-09-12
申请号:US17646006
申请日:2021-12-27
Applicant: MAGNA ELECTRONICS INC.
Inventor: Jianguo Wang , Garret Achenbach , Ove Salomonsson , Tom H. Toma , Edward R. Ahlquist, Jr. , Brian J. Winden , Christopher L. Van Dan Elzen
CPC classification number: H04N23/70 , B60R11/04 , H04N7/18 , H04N7/183 , H04N23/55 , H05K999/99 , B60R2011/0026 , H04N23/51 , H04N23/57
Abstract: A vehicular camera module includes a main circuit board electrically connected with an imager circuit board via a flexible ribbon cable. Electronic circuitry disposed at a main PCB of the main circuit board includes an image processor. With the imager operated to capture image data, captured image data is provided via the flexible ribbon cable to the electronic circuitry disposed at the main PCB of the main circuit board. The electronic circuitry disposed at the main PCB of the main circuit board includes an electrical connector configured for electrical connection to a connector of a vehicular wire harness. Electrical components disposed at a first side of the main PCB of the main circuit board, electrical components disposed at a second side of the main PCB of the main circuit board, and the electrical connector are electrically operatively coupled together by conductive traces and vias of the main PCB.
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