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公开(公告)号:US10896812B2
公开(公告)日:2021-01-19
申请号:US15877430
申请日:2018-01-23
Applicant: MATERION CORPORATION
IPC: C23C14/34 , H01J37/34 , H01J37/32 , G06K19/077
Abstract: A method for affixing an RFID tag to sputtering targets is disclosed. A cavity is formed on the back of the backing plate adjacent to the outer edge. Within the cavity, an RFID tag is secured with an encapsulant. The encapsulant is cured with the RFID tag capable of communicating with an associated reader through the encapsulant.
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公开(公告)号:US20180211825A1
公开(公告)日:2018-07-26
申请号:US15877430
申请日:2018-01-23
Applicant: MATERION CORPORATION
IPC: H01J37/34 , H01J37/32 , C23C14/34 , G06K19/077
CPC classification number: H01J37/3405 , C23C14/3407 , G06K19/07749 , G06K19/07758 , G06K19/07773 , H01J37/32935 , H01J37/3417 , H01J37/3435 , H01J37/3476 , H01J37/3491
Abstract: A method for affixing an RFID tag to sputtering targets is disclosed. A cavity is formed on the back of the backing plate adjacent to the outer edge. Within the cavity, an RFID tag is secured with an encapsulant. The encapsulant is cured with the RFID tag capable of communicating with an associated reader through the encapsulant.
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