公开(公告)号：US20170323837A1

公开(公告)日：2017-11-09

申请号：US15590144

申请日：2017-05-09

Applicant: Materion Corporation

Inventor： Richard J. Koba ,  Chee Kong Lee ,  Wei Chuan Goh ,  Sin Yee Chin

IPC: H01L23/14 ,  H01L23/36 ,  H01L23/28 ,  H01L23/373 ,  H01L23/10

CPC classification number: H01L23/14 ,  H01L23/04 ,  H01L23/047 ,  H01L23/10 ,  H01L23/28 ,  H01L23/36 ,  H01L23/3738

Abstract: An air cavity package includes a dielectric frame that is formed from an alumina ceramic, a polyimide, or a semi-crystalline thermoplastic. The dielectric frame is joined to a flange using a high temperature silicone adhesive. Leads may be bonded to the dielectric frame using a high temperature organic adhesive, a direct bond, or by brazing.

公开(公告)号：US11227806B2

公开(公告)日：2022-01-18

申请号：US15590144

申请日：2017-05-09

Applicant: Materion Corporation

Inventor： Richard J. Koba ,  Chee Kong Lee ,  Wei Chuan Goh ,  Sin Yee Chin

IPC: H01L23/14 ,  H01L23/047 ,  H01L23/04 ,  H01L23/10 ,  H01L23/28 ,  H01L23/36 ,  H01L23/373

Abstract: An air cavity package includes a dielectric frame that is formed from an alumina ceramic, a polyimide, or a semi-crystalline thermoplastic. The dielectric frame is joined to a flange using a high temperature silicone adhesive. Leads may be bonded to the dielectric frame using a high temperature organic adhesive, a direct bond, or by brazing.

公开(公告)号：US20170069560A1

公开(公告)日：2017-03-09

申请号：US14652326

申请日：2015-05-22

Applicant: MATERION CORPORATION

Inventor： Richard J. Koba ,  Chee Kong Lee ,  Wei Chuan Goh ,  Joelle Ng

IPC: H01L23/373 ,  H01L23/047 ,  H01L21/48 ,  H01L23/10

CPC classification number: H01L23/373 ,  H01L21/4807 ,  H01L21/4871 ,  H01L23/047 ,  H01L23/10 ,  H01L23/36 ,  H01L23/3731 ,  H01L23/3732 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/3738 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An air cavity package includes a dielectric frame that is formed from a polyimide or a liquid crystal polymer (LCP). The dielectric frame is joined to a flange and to electrical leads using a polyimide adhesive.

Abstract translation: 气腔封装包括由聚酰亚胺或液晶聚合物（LCP）形成的电介质框架。 使用聚酰亚胺粘合剂将电介质框架连接到凸缘和电引线。

公开(公告)号：US11046051B2

公开(公告)日：2021-06-29

申请号：US15364821

申请日：2016-11-30

Applicant: Materion Corporation

Inventor： Richard J. Koba

IPC: B32B15/08 ,  B32B7/12 ,  B32B27/28 ,  C09J179/08 ,  H05K3/38 ,  B32B37/14 ,  C04B35/645 ,  C04B37/00 ,  C04B35/626 ,  C04B37/02 ,  B32B15/04 ,  B32B15/20 ,  B32B7/02 ,  B32B15/18 ,  B32B9/00 ,  B32B9/04 ,  B32B37/12 ,  C25D5/12 ,  F28F21/04 ,  F28F21/06 ,  F28F21/08 ,  G03F7/00 ,  H01L21/48 ,  H01L23/373 ,  H05K1/03 ,  F28F13/00

Abstract: A metal-on-ceramic substrate comprises a ceramic layer, a first metal layer, and a bonding layer joining the ceramic layer to the first metal layer. The bonding layer includes thermoplastic polyimide adhesive that contains thermally conductive particles. This permits the substrate to withstand most common die attach operations, reduces residual stress in the substrate, and simplifies manufacturing processes.

公开(公告)号：US10896812B2

公开(公告)日：2021-01-19

申请号：US15877430

申请日：2018-01-23

Applicant: MATERION CORPORATION

Inventor： Michael V. Pasquariello ,  Thomas P. St. Vincent ,  Matthew T. Willson ,  Richard J. Koba

IPC: C23C14/34 ,  H01J37/34 ,  H01J37/32 ,  G06K19/077

Abstract: A method for affixing an RFID tag to sputtering targets is disclosed. A cavity is formed on the back of the backing plate adjacent to the outer edge. Within the cavity, an RFID tag is secured with an encapsulant. The encapsulant is cured with the RFID tag capable of communicating with an associated reader through the encapsulant.

公开(公告)号：US20180211825A1

公开(公告)日：2018-07-26

申请号：US15877430

申请日：2018-01-23

Applicant: MATERION CORPORATION

Inventor： Michael V. Pasquariello ,  Thomas P. St. Vincent ,  Matthew T. Willson ,  Richard J. Koba

IPC: H01J37/34 ,  H01J37/32 ,  C23C14/34 ,  G06K19/077

CPC classification number: H01J37/3405 ,  C23C14/3407 ,  G06K19/07749 ,  G06K19/07758 ,  G06K19/07773 ,  H01J37/32935 ,  H01J37/3417 ,  H01J37/3435 ,  H01J37/3476 ,  H01J37/3491

Abstract: A method for affixing an RFID tag to sputtering targets is disclosed. A cavity is formed on the back of the backing plate adjacent to the outer edge. Within the cavity, an RFID tag is secured with an encapsulant. The encapsulant is cured with the RFID tag capable of communicating with an associated reader through the encapsulant.

公开(公告)号：US10163743B2

公开(公告)日：2018-12-25

申请号：US15598706

申请日：2017-05-18

Applicant: Materion Corporation

Inventor： Richard J. Koba ,  Chee Kong Lee ,  Wei Chuan Goh ,  Sin Yee Chin

IPC: H01L23/10 ,  H01L21/48 ,  H01L23/047 ,  H01L21/52

Abstract: An air cavity package includes a flange and a pedestal extending upward from the flange. A dielectric frame is joined to the flange and surrounds the pedestal. The semiconductor die is placed on the pedestal, which reduces the length of the wires joining the die to the leads of the air cavity package.

公开(公告)号：US20170338161A1

公开(公告)日：2017-11-23

申请号：US15598706

申请日：2017-05-18

Applicant: Materion Corporation

Inventor： Richard J. Koba ,  Chee Kong Lee ,  Wei Chuan Goh ,  Sin Yee Chin

IPC: H01L23/10 ,  H01L21/48

CPC classification number: H01L23/10 ,  H01L21/4803 ,  H01L21/52 ,  H01L23/047

Abstract: An air cavity package includes a flange and a pedestal extending upward from the flange. A dielectric frame is joined to the flange and surrounds the pedestal. The semiconductor die is placed on the pedestal, which reduces the length of the wires joining the die to the leads of the air cavity package.

公开(公告)号：US20170151755A1

公开(公告)日：2017-06-01

申请号：US15364821

申请日：2016-11-30

Applicant: Materion Corporation

Inventor： Richard J. Koba

IPC: B32B7/12 ,  H01L21/48 ,  B32B9/04 ,  B32B9/00 ,  F28F21/06 ,  B32B37/12 ,  G03F7/00 ,  C25D5/12 ,  F28F21/04 ,  F28F21/08 ,  H01L23/373 ,  B32B15/04

CPC classification number: B32B7/12 ,  B32B7/02 ,  B32B9/005 ,  B32B9/041 ,  B32B15/04 ,  B32B15/043 ,  B32B15/18 ,  B32B15/20 ,  B32B27/281 ,  B32B37/12 ,  B32B37/144 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2307/732 ,  B32B2311/00 ,  B32B2311/04 ,  B32B2311/08 ,  B32B2311/09 ,  B32B2311/12 ,  B32B2311/22 ,  B32B2315/02 ,  B32B2379/08 ,  B32B2457/00 ,  B32B2457/14 ,  C04B35/6269 ,  C04B35/645 ,  C04B37/008 ,  C04B37/025 ,  C04B37/026 ,  C04B37/028 ,  C04B2237/08 ,  C04B2237/086 ,  C04B2237/09 ,  C04B2237/121 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/405 ,  C04B2237/406 ,  C04B2237/407 ,  C04B2237/408 ,  C04B2237/55 ,  C04B2237/56 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/72 ,  C09J179/085 ,  C25D5/12 ,  F28F21/04 ,  F28F21/067 ,  F28F21/081 ,  F28F2013/001 ,  F28F2275/025 ,  G03F7/0035 ,  H01L21/4871 ,  H01L23/3735 ,  H05K1/0306 ,  H05K3/386 ,  H05K2201/0215 ,  H05K2201/026

Abstract: A metal-on-ceramic substrate comprises a ceramic layer, a first metal layer, and a bonding layer joining the ceramic layer to the first metal layer. The bonding layer includes thermoplastic polyimide adhesive that contains thermally conductive particles. This permits the substrate to withstand most common die attach operations, reduces residual stress in the substrate, and simplifies manufacturing processes.

公开(公告)号：US20160059535A1

公开(公告)日：2016-03-03

申请号：US14839536

申请日：2015-08-28

Applicant: Materion Corporation

Inventor： Richard J. Koba ,  James Fraivillig

IPC: B32B37/14 ,  H01B1/22 ,  B29C65/00 ,  B32B7/12 ,  B32B37/16 ,  B29C65/02 ,  C09K5/14 ,  B32B7/02

CPC classification number: B32B37/144 ,  B29C65/02 ,  B29C66/45 ,  B29C66/712 ,  B29C66/73112 ,  B29C66/7392 ,  B29K2079/085 ,  B32B7/02 ,  B32B7/12 ,  B32B9/005 ,  B32B9/045 ,  B32B15/08 ,  B32B15/20 ,  B32B27/06 ,  B32B27/18 ,  B32B27/20 ,  B32B27/281 ,  B32B37/1284 ,  B32B2037/1253 ,  B32B2038/0076 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2255/205 ,  B32B2262/103 ,  B32B2262/106 ,  B32B2264/105 ,  B32B2264/108 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2309/02 ,  B32B2309/105 ,  B32B2379/08 ,  B32B2457/00 ,  B32B2457/08 ,  C08K3/04 ,  C08K3/08 ,  C08K2003/0806 ,  C08K2003/0831 ,  C08K2003/085 ,  C08K2201/001 ,  C09J7/22 ,  C09J7/28 ,  C09J7/29 ,  C09J7/35 ,  C09J9/02 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/106 ,  C09J2400/163 ,  C09J2479/08 ,  C09J2479/086 ,  C09K5/14 ,  H01B1/22 ,  H01L21/50 ,  H01L23/10 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2711 ,  H01L2224/2712 ,  H01L2224/2908 ,  H01L2224/29083 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29164 ,  H01L2224/29193 ,  H01L2224/29247 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29363 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/8346 ,  H01L2224/83487 ,  H01L2224/83856 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H05K3/0061 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0215 ,  C08L79/08 ,  H01L2924/07025 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01006 ,  H01L2924/07811 ,  H01L2924/013 ,  H01L2924/01074 ,  H01L2924/01042 ,  H01L2924/05432 ,  H01L2924/05032 ,  H01L2924/0532 ,  H01L2924/01004

Abstract: A bond film includes a thermoplastic polyimide adhesive that contains particles which are thermally conductive and electrically conductive particles. A conductive foil layer may be placed between two layers of adhesive to form the bond foil. This bond film has a low curing temperature which reduces CTE mismatch between different substrates and therefore allows direct bonding of substrates that have high coefficient of thermal expansion mismatch. The low curing temperature also allows for reduced processing costs. The conductive bond film does not degrade at high temperatures, allowing for service temperatures up to 350° C. and thermal excursions up to 450° C.

Abstract translation: 接合膜包括含有导热性和导电性粒子的粒子的热塑性聚酰亚胺粘合剂。 导电箔层可以放置在两层粘合剂之间以形成接合箔。 该粘合膜具有低的固化温度，这降低了不同基底之间的CTE失配，因此允许具有高热膨胀失配系数的基底的直接结合。 低固化温度也可以降低加工成本。 导电粘合膜在高温下不会降解，使用温度高达350℃，热偏移达450℃。