公开(公告)号：US20230282625A1

公开(公告)日：2023-09-07

申请号：US18107520

申请日：2023-02-09

申请人： MEDIATEK INC.

发明人： Ta-Jen Yu ,  Shih-Chin Lin ,  Tai-Yu Chen ,  Bo-Jiun Yang ,  Bing-Yeh Lin ,  Yung-Cheng Huang ,  Wen-Sung Hsu ,  Bo-Hao Ma ,  Isabella Song

IPC分类号： H01L25/10 ,  H01L23/48 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L25/105 ,  H01L23/481 ,  H01L23/49866 ,  H01L23/49816 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/48 ,  H01L2224/73204 ,  H01L2224/08112 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/183

摘要： A semiconductor package includes a bottom substrate and a top substrate space apart from the bottom substrate such that the bottom substrate and the top substrate define a gap therebetween. A logic die is mounted on a top surface of the bottom substrate. The logic die has a thickness of 125-350 micrometers. A plurality of copper cored solder balls is disposed between the bottom substrate and the top substrate around the logic die to electrically connect the bottom substrate with the top substrate. A sealing resin fills into the gap between the bottom substrate and the top substrate and sealing the logic die and the plurality of copper cored solder balls in the gap.