公开(公告)号：US12087664B2

公开(公告)日：2024-09-10

申请号：US18129061

申请日：2023-03-30

Applicant: MEDIATEK INC.

Inventor： Chia-Hao Hsu ,  Tai-Yu Chen ,  Sheng-Liang Kuo ,  Bo-Jiun Yang

IPC: H01L23/473 ,  H01L23/00 ,  H01L23/16

CPC classification number: H01L23/473 ,  H01L23/16 ,  H01L23/562 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2924/3511

Abstract: A semiconductor package includes a substrate; a die mounted on a top surface of the substrate in a flip-chip fashion; and a lid mounted on the die and on a perimeter of the substrate. The lid includes a cover plate and four walls formed integral with the cover plate. A liquid-cooling channel is situated between the cover plate of the lid and a rear surface of the die for circulating a coolant relative to the semiconductor package.

公开(公告)号：US20230282625A1

公开(公告)日：2023-09-07

申请号：US18107520

申请日：2023-02-09

Applicant: MEDIATEK INC.

Inventor： Ta-Jen Yu ,  Shih-Chin Lin ,  Tai-Yu Chen ,  Bo-Jiun Yang ,  Bing-Yeh Lin ,  Yung-Cheng Huang ,  Wen-Sung Hsu ,  Bo-Hao Ma ,  Isabella Song

IPC: H01L25/10 ,  H01L23/48 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L25/105 ,  H01L23/481 ,  H01L23/49866 ,  H01L23/49816 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/48 ,  H01L2224/73204 ,  H01L2224/08112 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/183

Abstract: A semiconductor package includes a bottom substrate and a top substrate space apart from the bottom substrate such that the bottom substrate and the top substrate define a gap therebetween. A logic die is mounted on a top surface of the bottom substrate. The logic die has a thickness of 125-350 micrometers. A plurality of copper cored solder balls is disposed between the bottom substrate and the top substrate around the logic die to electrically connect the bottom substrate with the top substrate. A sealing resin fills into the gap between the bottom substrate and the top substrate and sealing the logic die and the plurality of copper cored solder balls in the gap.

公开(公告)号：US12021068B2

公开(公告)日：2024-06-25

申请号：US17492693

申请日：2021-10-04

Applicant: MEDIATEK INC.

Inventor： Bo-Jiun Yang ,  Wen-Sung Hsu ,  Tai-Yu Chen ,  Shih-Chin Lin ,  Kun-Ting Hung

IPC: H01L23/02 ,  H01L25/065 ,  H01L25/10

CPC classification number: H01L25/105 ,  H01L25/0657 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094

Abstract: A semiconductor device includes a bottom package, a top package stacked on the bottom package, and an interposer disposed between the bottom package and the top package. The top package is electrically connected to the interposer through a plurality of peripheral solder balls. At least a dummy thermal feature is disposed on the interposer and surrounded by the plurality of peripheral solder balls.

公开(公告)号：US12300573B2

公开(公告)日：2025-05-13

申请号：US17700571

申请日：2022-03-22

Applicant: MEDIATEK Inc.

Inventor： Bo-Jiun Yang ,  Wen-Sung Hsu ,  Tai-Yu Chen ,  Sheng-Liang Kuo ,  Chia-Hao Hsu

IPC: H01L23/42 ,  H01L21/48 ,  H01L23/00 ,  H01L23/427 ,  H01L23/433

Abstract: A semiconductor device includes a substrate, an electronic component, a cover and a liquid metal. The electronic component is disposed on the substrate. The cover is disposed on the substrate and covers the electronic component. The liquid metal is formed between the cover and the electronic component.

公开(公告)号：US11640930B2

公开(公告)日：2023-05-02

申请号：US16989919

申请日：2020-08-11

Applicant: MEDIATEK INC.

Inventor： Chia-Hao Hsu ,  Tai-Yu Chen ,  Sheng-Liang Kuo ,  Bo-Jiun Yang

IPC: H01L23/473 ,  H01L23/16 ,  H01L23/00

Abstract: A semiconductor package includes a substrate; a die mounted on a top surface of the substrate in a flip-chip fashion; and a lid mounted on the die and on a perimeter of the substrate. The lid includes a cover plate and four walls formed integral with the cover plate. A liquid-cooling channel is situated between the cover plate of the lid and a rear surface of the die for circulating a coolant relative to the semiconductor package.

公开(公告)号：US20220199593A1

公开(公告)日：2022-06-23

申请号：US17492693

申请日：2021-10-04

Applicant: MEDIATEK INC.

Inventor： Bo-Jiun Yang ,  Wen-Sung Hsu ,  Tai-Yu Chen ,  Shih-Chin Lin ,  Kun-Ting Hung

IPC: H01L25/10 ,  H01L25/065

Abstract: A semiconductor device includes a bottom package, a top package stacked on the bottom package, and an interposer disposed between the bottom package and the top package. The top package is electrically connected to the interposer through a plurality of peripheral solder balls. At least a dummy thermal feature is disposed on the interposer and surrounded by the plurality of peripheral solder balls.

公开(公告)号：US20230238302A1

公开(公告)日：2023-07-27

申请号：US18129061

申请日：2023-03-30

Applicant: MEDIATEK INC.

Inventor： Chia-Hao Hsu ,  Tai-Yu Chen ,  Sheng-Liang Kuo ,  Bo-Jiun Yang

IPC: H01L23/473 ,  H01L23/16 ,  H01L23/00

CPC classification number: H01L23/473 ,  H01L23/16 ,  H01L23/562 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2924/3511

Abstract: A semiconductor package includes a substrate; a die mounted on a top surface of the substrate in a flip-chip fashion; and a lid mounted on the die and on a perimeter of the substrate. The lid includes a cover plate and four walls formed integral with the cover plate. A liquid-cooling channel is situated between the cover plate of the lid and a rear surface of the die for circulating a coolant relative to the semiconductor package.

公开(公告)号：US20230185280A1

公开(公告)日：2023-06-15

申请号：US17993853

申请日：2022-11-23

Applicant: MEDIATEK INC.

Inventor： Chih-Fu Tsai ,  Yu-Chia Chang ,  Bo-Jiun Yang ,  Yen-Hwei Hsieh ,  Shun-Yao Yang ,  Jia-Wei Fang ,  Ta-Chang Liao ,  Tai-Yu Chen

IPC: G05B19/4155

CPC classification number: G05B19/4155 ,  G05B2219/50333

Abstract: An integrated circuit (IC) configurable to perform adaptive thermal ceiling control in a per-functional-block manner, an associated main circuit, an associated electronic device and an associated thermal control method are provided. The IC may include a plurality of hardware circuits arranged to perform operations of a first functional block, and at least one thermal control circuit. At least one temperature sensor is coupled with the first functional block to detect temperature and to generate at least one temperature sensing result of the first functional block. The thermal control circuit performs thermal control on the first functional block to prevent the first functional block from overheating and inducing abnormal function operations, by monitoring the temperature sensing result and by trying to prevent the temperature sensing result from exceeding first temperature upper-limit, wherein the first temperature upper-limit is configurable with respect to per-functional-block thermal operation capability of the first functional block.

公开(公告)号：US20210074608A1

公开(公告)日：2021-03-11

申请号：US16989919

申请日：2020-08-11

Applicant: MEDIATEK INC.

Inventor： Chia-Hao Hsu ,  Tai-Yu Chen ,  Sheng-Liang Kuo ,  Bo-Jiun Yang

IPC: H01L23/473 ,  H01L23/00 ,  H01L23/16

Abstract: A semiconductor package includes a substrate; a die mounted on a top surface of the substrate in a flip-chip fashion; and a lid mounted on the die and on a perimeter of the substrate. The lid includes a cover plate and four walls formed integral with the cover plate. A liquid-cooling channel is situated between the cover plate of the lid and a rear surface of the die for circulating a coolant relative to the semiconductor package.