Abstract:
A chip package includes a housing, one or more electrical connections coupled to an exterior of the housing, a photonic integrated circuit, and a scanning unit. Both the photonic integrated circuit and the scanning unit are disposed within the housing. The photonic integrated circuit has at least one waveguide designed to guide a beam of light. The scanning unit is designed to laterally scan the beam of light across a focal plane outside of the housing. The scanning unit is aligned with the photonic integrated circuit such that the beam of light is coupled between the photonic integrated circuit and the scanning unit.
Abstract:
A scanning device is presented having a substrate with a first surface and an opposite, parallel second surface. A region of the substrate includes the first surface and the opposite parallel second surface, and is defined via an etching process through a thickness of the substrate, where the region remains attached to the substrate via one or more hinges. A waveguide is patterned over the first surface of the region and guides a beam of radiation along a length of the waveguide. The scanning device includes a facet located on the first surface of the region. The facet is designed to reflect at least a portion of the beam of radiation through the region. An optical element is located on the second surface of the region, and is designed to receive the reflected portion of the beam of radiation.
Abstract:
A scanning device is presented having a substrate with a first surface and an opposite, parallel second surface. A region of the substrate includes the first surface and the opposite parallel second surface, and is defined via an etching process through a thickness of the substrate, where the region remains attached to the substrate via one or more hinges. A waveguide is patterned over the first surface of the region and guides a beam of radiation along a length of the waveguide. The scanning device includes a facet located on the first surface of the region. The facet is designed to reflect at least a portion of the beam of radiation through the region. An optical element is located on the second surface of the region, and is designed to receive the reflected portion of the beam of radiation.
Abstract:
A device and a method for manufacturing the device are presented. The device includes a ridge, a peninsula formation, and a conductive trace. The ridge is defined within a semiconducting material. The peninsula formation is also defined within the semiconducting material and is adjacent to the ridge such that a gap exists between an end face of the peninsula formation and a side wall of the ridge. The conductive trace bridges across the gap such that the conductive trace runs over a top surface of the peninsula and a top surface of the ridge.
Abstract:
Systems and methods are presented for modulating a beam of radiation, such that the modulated beam exhibits substantially null residual amplitude modulation (RAM). An electro-optical modulator is presented that includes a waveguide, a first region associated with the waveguide and a second region associated with the waveguide. The waveguide is designed to guide a beam of radiation. A first electric potential applied to the first region causes a first modulation to the beam of radiation while a second electric potential applied to the second region causes a second modulation to the beam of radiation. The first modulation combined with the second modulation provides substantially null residual amplitude modulation of the beam of radiation.
Abstract:
Systems and methods are presented for modulating a beam of radiation, such that the modulated beam exhibits substantially null residual amplitude modulation (RAM). An electro-optical modulator is presented that includes a waveguide, a first region associated with the waveguide and a second region associated with the waveguide. The waveguide is designed to guide a beam of radiation. A first electric potential applied to the first region causes a first modulation to the beam of radiation while a second electric potential applied to the second region causes a second modulation to the beam of radiation. The first modulation combined with the second modulation provides substantially null residual amplitude modulation of the beam of radiation.
Abstract:
A device and a method for manufacturing the device are presented. The device includes a ridge, a peninsula formation, and a conductive trace. The ridge is defined within a semiconducting material. The peninsula formation is also defined within the semiconducting material and is adjacent to the ridge such that a gap exists between an end face of the peninsula formation and a side wall of the ridge. The conductive trace bridges across the gap such that the conductive trace runs over a top surface of the peninsula and a top surface of the ridge.
Abstract:
A device and a method for manufacturing the device are presented. The device includes a ridge, a peninsula formation, and a conductive trace. The ridge is defined within a semiconducting material. The peninsula formation is also defined within the semiconducting material and is adjacent to the ridge such that a gap exists between an end face of the peninsula formation and a side wall of the ridge. The conductive trace bridges across the gap such that the conductive trace runs over a top surface of the peninsula and a top surface of the ridge.