Abstract:
A method, system and paint for suppressing emission of high frequency electromagnetic radiation from an electronic system, the electronic system including at least one power supply unit, at least one printed circuit board (PCB) and at least one integrated circuit are provided. The method includes providing an electrically conductive housing configured to accommodate and encase the electronic system, the housing having an inner conductive surface, and applying a layer of an electromagnetic absorbing paint to the inner conductive surface of the housing to substantially cover the inner surface by the layer, the electromagnetic absorbing paint comprises a liquid matrix and an electromagnetic absorbing material.
Abstract:
Optical apparatus connecting a Silicon Photonics (SiP) device, which comprises multiple optical waveguides to an array of collimating lenses, configured to collimate light of the multiple optical waveguides into collimated beams. The optical apparatus includes a deflection element, distinct from the SiP device, including a light deflection surface which deflects light from the waveguides by an angle greater than 30 degrees, to the array of collimating lenses.
Abstract:
An apparatus includes one or more optoelectronic transducers, driving circuitry, one or more cooling elements, and a light coupling module. The optoelectronic transducers are configured to convert between optical signals conveyed over optical fibers and respective electrical signals. The driving circuitry is configured to process the electrical signals. The cooling elements are configured to remove heat that is produced at least by the driving circuitry. The light coupling module is configured to couple the optical signals between the optical fibers and the optoelectronic transducers, and additionally serves as a baseplate for the cooling elements.
Abstract:
A system comprises a first mechanism configured to hold a first block including a plurality of lenses located on or near a first surface of the first block. The plurality of lenses are configured to receive light to generate a plurality of light spots at or near a second surface of the first block opposite the first surface. The system includes a second mechanism configured to hold a second block including a plurality of waveguides, and to move the second block to bring the plurality of waveguides in alignment with the plurality of lenses using the plurality of light spots as alignment marks.
Abstract:
A universal replaceable fan unit and method of reversing an airflow direction of a universal replaceable fan unit is provided. The universal replaceable fan unit includes a fan assembly designed to create an airflow from an intake end to an output end. The universal replaceable fan unit also includes a fan mounting that receives and secures the fan assembly in an operable position. The fan mounting includes a frame member and a securing member. The fan mounting is designed to allow the fan assembly to be moved between a first position defining a first airflow direction and a second position defining a second airflow direction. The first airflow direction is opposite the second airflow direction. The universal replaceable fan unit further includes an electrical connector removably attached to the fan assembly. The electrical connector allows electricity to be provided to the fan assembly for operation.
Abstract:
An apparatus includes a Silicon Photonics (SiP) device and a ferrule. The SiP includes multiple optical waveguides. The ferrule includes multiple optical fibers for exchanging optical signals with the respective optical waveguides of the SiP device. In some embodiments, an array of micro-lenses is configured to couple the optical signals between the optical waveguides of the SiP device and the respective optical fibers of the ferrule. In some embodiments, a polymer layer is placed between the SiP device and the ferrule, and includes multiple polymer-based Spot-Size Converters (SSCs) that are configured to couple the optical signals between the optical waveguides of the SiP device and the respective optical fibers of the ferrule.
Abstract:
An apparatus includes one or more optoelectronic transducers, driving circuitry, one or more cooling elements, and a light coupling module. The optoelectronic transducers are configured to convert between optical signals conveyed over optical fibers and respective electrical signals. The driving circuitry is configured to process the electrical signals. The cooling elements are configured to remove heat that is produced at least by the driving circuitry. The light coupling module is configured to couple the optical signals between the optical fibers and the optoelectronic transducers, and additionally serves as a baseplate for the cooling elements.
Abstract:
A method, system and paint for suppressing emission of high frequency electromagnetic radiation from an electronic system, the electronic system including at least one power supply unit, at least one printed circuit board (PCB) and at least one integrated circuit are provided. The method includes providing an electrically conductive housing configured to accommodate and encase the electronic system, the housing having an inner conductive surface, and applying a layer of an electromagnetic absorbing paint to the inner conductive surface of the housing to substantially cover the inner surface by the layer, the electromagnetic absorbing paint comprises a liquid matrix and an electromagnetic absorbing material.
Abstract:
A system comprises a first mechanism configured to hold a first block including a plurality of lenses located on or near a first surface of the first block. The plurality of lenses are configured to receive light to generate a plurality of light spots at or near a second surface of the first block opposite the first surface. The system includes a second mechanism configured to hold a second block including a plurality of waveguides, and to move the second block to bring the plurality of waveguides in alignment with the plurality of lenses using the plurality of light spots as alignment marks.
Abstract:
Embodiments are disclosed for providing a silicon photonics collimator for wafer level assembly. An example apparatus includes a silicon photonics (SiP) device and a micro-optical passive element. The SiP device comprises a set of optical waveguides. The micro-optical passive element is mounted on an edge of a cavity etched into a silicon surface of the SiP device. Furthermore, the micro-optical passive element is configured to direct optical signals between the set of optical waveguides and an external optical element.