Wafer structure
    1.
    发明授权

    公开(公告)号:US11724499B2

    公开(公告)日:2023-08-15

    申请号:US17528524

    申请日:2021-11-17

    IPC分类号: B41J2/14 B41J2/155

    摘要: A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate fabricated by a semiconductor process on a wafer of at least 12 inches. The inkjet chips include at least one first inkjet chip and at least one second inkjet chip directly formed on the chip substrate by the semiconductor process, respectively, and the plurality of inkjet chips are diced into the at least one first inkjet chip and the at least one second inkjet chip for inkjet printing. Each of the first inkjet chip and the second inkjet chip includes a plurality of ink-drop generators produced by a semiconductor process and formed on the chip substrate. Each of the ink-drop generators includes a thermal-barrier layer, a resistance heating layer, a conductive layer, a protective layer, a barrier layer, an ink-supply chamber and a nozzle.

    Gas detection device
    2.
    发明授权

    公开(公告)号:US11536644B2

    公开(公告)日:2022-12-27

    申请号:US17330769

    申请日:2021-05-26

    IPC分类号: G01N15/14 G01N27/12

    摘要: A gas detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a light-emitting element, a particle-sensing element, a gas-sensing element, a driving-chip element and an encapsulation layer. The driving-chip element controls driving operations of the microelectromechanical element, the light-emitting element, the particle-sensing element and the gas-sensing element, respectively. When the microelectromechanical element is enabled to actuate transportation of gas, the gas is introduced into the gas detection device through an inlet aperture of the substrate. Scattered light spots generated by the light beam of the light-emitting element irradiating on suspended particles contained in the gas are received by the particle-sensing element to generate a detection datum of the suspended particles. The gas-sensing element detects the gas passing through and generates a detection datum of hazardous gas contained in the gas. Finally, the gas is discharged from an outlet aperture of the encapsulation layer.

    WAFER STRUCTURE
    3.
    发明申请

    公开(公告)号:US20220134751A1

    公开(公告)日:2022-05-05

    申请号:US17116714

    申请日:2020-12-09

    IPC分类号: B41J2/14 B41J2/155 B41J2/21

    摘要: A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate which is fabricated by a semiconductor process on a wafer of at least 12 inches. The plurality of inkjet chips include at least one first inkjet chip and at least one second inkjet chip. The plurality of inkjet chips are directly formed on the chip substrate by the semiconductor process, respectively, and diced into the at least one first inkjet chip and the at least one second inkjet chip, to be implemented for inkjet printing.

    Micro-electromechanical fluid control device

    公开(公告)号:US10883487B2

    公开(公告)日:2021-01-05

    申请号:US16053195

    申请日:2018-08-02

    摘要: A micro-electromechanical fluid control device includes at least one flow guiding unit. The at least one flow guiding unit includes an inlet plate, a substrate, a resonance membrane, an actuating membrane and an outlet plate sequentially stacked. A first chamber is defined between the resonance membrane and the actuating membrane and a second chamber is defined between the actuating membrane and the outlet plate. While the piezoelectric membrane of the flow guiding unit drives the actuating membrane, a fluid is inhaled into the convergence chamber via the inlet of the inlet plate, transported into the first chamber via the central aperture of the resonance membrane, transported into the second chamber via a vacant space of the actuating membrane, and discharged out from the outlet of the outlet plate, so as to control the fluid to flow.

    MICRO-GAS PRESSURE DRIVING APPARATUS
    7.
    发明申请
    MICRO-GAS PRESSURE DRIVING APPARATUS 有权
    微气压驱动装置

    公开(公告)号:US20140377099A1

    公开(公告)日:2014-12-25

    申请号:US14272272

    申请日:2014-05-07

    IPC分类号: F04B43/04 F04B49/22

    CPC分类号: F04B43/046 F04B49/22

    摘要: A micro-gas pressure driving apparatus includes a miniature gas transportation module and a miniature valve module. The miniature gas transportation module includes a gas inlet plate, a fluid channel plate, a resonance membrane and a piezoelectric actuator. A first chamber is defined between the resonance membrane and the piezoelectric actuator. After the piezoelectric actuator is activated to feed a gas through the gas inlet plate, the gas is transferred to the first chamber through the fluid channel plate and the resonance membrane and then transferred downwardly. Consequently, a pressure gradient is generated to continuously push the gas. The miniature valve module includes a gas collecting plate, a valve membrane and a gas outlet plate. After the gas is transferred from the miniature gas transportation module to the gas-collecting chamber, the gas is transferred in one direction, so that a pressure-collecting operation or a pressure-releasing operation is selectively performed.

    摘要翻译: 微型气体压力驱动装置包括微型气体输送模块和微型阀模块。 微型气体输送模块包括气体入口板,流体通道板,共振膜和压电致动器。 在共振膜和压电致动器之间限定第一腔室。 在激活压电致动器以通过气体入口板供给气体之后,气体通过流体通道板和共振膜转移到第一室,然后向下传送。 因此,产生压力梯度以连续地推动气体。 微型阀模块包括气体收集板,阀膜和气体出口板。 在气体从微型气体输送模块传送到气体收集室之后,气体沿一个方向传送,从而选择性地执行压力收集操作或压力释放操作。

    Ink supply structure and fabricating method thereof
    8.
    发明授权
    Ink supply structure and fabricating method thereof 有权
    供墨结构及其制造方法

    公开(公告)号:US08651640B2

    公开(公告)日:2014-02-18

    申请号:US13668627

    申请日:2012-11-05

    IPC分类号: B41J2/175

    摘要: An ink supply structure includes at least one ink cartridge, at least one dye ink chamber, and at least one pigment ink chamber. The at least one dye ink chamber is contained in the at least one ink cartridge for storing a dye ink. The at least one pigment ink chamber is contained in the at least one ink cartridge for storing a pigment ink. One of the dye ink within the dye ink chamber and the pigment ink within the pigment ink chamber is selectively supplied from the at least one ink cartridge.

    摘要翻译: 供墨结构包括至少一个墨盒,至少一个染料墨室和至少一个颜料墨室。 至少一个染料墨水室容纳在至少一个用于存储染料墨水的墨盒中。 至少一个颜料墨水室容纳在用于储存颜料墨水的至少一个墨盒中。 染料墨水室内的染料墨水和颜料墨水室内的颜料墨液之一是从至少一个墨盒中选择性地供给的。

    INK-JET PRINTING MODULE
    9.
    发明申请
    INK-JET PRINTING MODULE 有权
    喷墨打印模块

    公开(公告)号:US20130328971A1

    公开(公告)日:2013-12-12

    申请号:US13689336

    申请日:2012-11-29

    IPC分类号: B41J2/14

    摘要: An ink-jet printing module is used for a page-width array ink-jet printer. The ink jet printing module includes a page-width array platen and a plurality of ink-jet cartridges. The page-width array platen has a plurality of receiving cavities arranged as an array. Each of the ink-jet cartridges is detachably and independently embedded into one of the receiving cavities, and includes a body for storing ink, an ink-jet chip to be driven for ejecting the ink, a plurality of nozzles disposed on the ink-jet chip, and a control node for receiving signal to drive the ink-jet chip. The ink-jet chip is disposed on a bottom of the page-width array platen and is driven to eject the ink through the nozzles onto a printing medium.

    摘要翻译: 喷墨打印模块用于页宽阵列喷墨打印机。 喷墨打印模块包括页宽阵列压板和多个喷墨盒。 页宽阵列压板具有排列成阵列的多个容纳腔。 每个喷墨盒可拆卸地且独立地嵌入到一个接收腔中,并且包括用于存储墨的主体,用于喷射墨的驱动的喷墨芯片,设置在喷墨头上的多个喷嘴 芯片和用于接收信号以驱动喷墨芯片的控制节点。 喷墨芯片设置在页宽阵列台板的底部,并被驱动以将油墨通过喷嘴喷射到打印介质上。

    WAFER STRUCTURE
    10.
    发明申请

    公开(公告)号:US20220134750A1

    公开(公告)日:2022-05-05

    申请号:US17116644

    申请日:2020-12-09

    IPC分类号: B41J2/14 B41J2/21

    摘要: A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip. The chip substrate is a silicon substrate fabricated by a semiconductor process. The inkjet chip is directly formed on the chip substrate by the semiconductor process, whereby the wafer structure is diced, and the inkjet chip is produced, to be implemented for inkjet printing. The inkjet chip includes a plurality of ink-drop generators produced by the semiconductor process and formed on the chip substrate. Each of the ink-drop generators includes a barrier layer, an ink-supply chamber and a nozzle, and the ink-supply chamber and the nozzle are integrally formed in the barrier layer.