公开(公告)号：US09888583B2

公开(公告)日：2018-02-06

申请号：US14815413

申请日：2015-07-31

Applicant: MINEBEA CO., LTD.

Inventor： Dohaku Inamori ,  Takashi Kashino

IPC: H05K1/00 ,  H05K3/36 ,  H05K1/14 ,  H05K1/11

CPC classification number: H05K1/118 ,  H05K1/0393 ,  H05K1/113 ,  H05K1/116 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/09036 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2203/1178

Abstract: There is provided a flexible printed circuit board. The flexible printed circuit board includes: a flexible insulation layer having a first surface and a second surface; a first land which is conductive and which is provided on the first surface of the flexible insulation layer; and a conductive member which is provided on the second surface of the flexible insulation layer. A recess is formed on the first land.