公开(公告)号：US20230225060A1

公开(公告)日：2023-07-13

申请号：US17571092

申请日：2022-01-07

Applicant: MOTOROLA SOLUTIONS, INC.

Inventor： Edwin L. Bradley ,  Anthony J. Suppelsa ,  David J. Meyer

IPC: H05K3/34 ,  H01L23/498 ,  H01L23/00 ,  H05K1/11

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L24/16 ,  H05K1/111 ,  H01L2924/15311 ,  H05K2201/10734

Abstract: A conductive solder pad for a ball grid array (BGA) includes a concave edge to accommodate a via that exits a substrate at a position at the surface of the substrate that is offset from the solder pad. The offset arrangement of the via and solder pad allow for differential thermal expansion of the substrate material and the via material with reduced risk of cracking or fracturing the solder joint. The concave edge of the solder pad provides a gap from the via to avoid unintended electrical connections while maintaining the solder-joint pitch of the BGA.