公开(公告)号：US11460498B2

公开(公告)日：2022-10-04

申请号：US17034741

申请日：2020-09-28

Applicant: MPI CORPORATION

Inventor： Yang-Hung Cheng ,  Ya-Hung Lo ,  Chien-Hsun Chen ,  Chia-Nan Chou ,  Chung-Yen Huang ,  Shou-Jen Tsai ,  Fuh-Chyun Tang

IPC: G01R31/28 ,  G01R1/073

Abstract: An adjustable probe device includes fixed and movable probes, at least one of which is a signal probe having a coaxial structure. The movable probe is linearly slidable with a ground unit thereof abutted against a ground unit of the fixed probe. Another adjustable probe device includes a first movable probe for being grounded, and fixed and second movable probes both having a coaxial structure. Any of the two movable probes is selectable to be a functioning probe in a way that the contact ends of the functioning and fixed probes are located on a same plane for contacting two pads of a DUT at the same time, and the functioning probe is linearly slidable with a ground unit thereof abutted against a ground unit of the fixed probe. As a result, the probe interval is adjustable, lowering the cost of the impedance testing apparatus for circuit boards.

公开(公告)号：US11774468B2

公开(公告)日：2023-10-03

申请号：US17858424

申请日：2022-07-06

Applicant: MPI CORPORATION

Inventor： Chin-Tien Yang ,  Yang-Hung Cheng ,  Yu-Hao Chen ,  Chin-Yi Tsai ,  Hui-Pin Yang ,  Horng-Chuan Sun

IPC: G01R1/073

CPC classification number: G01R1/07314 ,  G01R1/07357

Abstract: A vertical probe head includes upper and lower die units having upper and lower through holes, and probes each including a body portion between the die units, tail and head portion installation parts in the upper and lower through holes respectively, and a head portion contact part for electrically contacting a device under test. The probes include a pair of signal probes including at least one distinctive probe, for which, the body portion is smaller in width than the head portion installation part, and a body portion center line is deviated from a head portion installation part center line toward the probe paired thereto. For the paired probes, a head portion contact part pitch is larger than a body portion pitch for matching a large-pitch high-speed differential pair of the device under test, great impedance matching effect, and consistent contact force and stable elasticity of the probes in operation.

公开(公告)号：US20240077519A1

公开(公告)日：2024-03-07

申请号：US18242586

申请日：2023-09-06

Applicant: MPI CORPORATION

Inventor： Yang-Hung Cheng ,  Yu-Hao Chen ,  Jhin-Ying Lyu ,  Hao Wei

IPC: G01R1/073 ,  G01R1/067 ,  G01R31/28

CPC classification number: G01R1/07342 ,  G01R1/06772 ,  G01R31/2886

Abstract: A probe card, a method for designing the probe card, a method for producing a tested semiconductor device, a method for testing an unpackaged semiconductor by the probe card, a device under test, and a probe system are provided. The probe card includes a wiring substrate, a connection carrier board, and a probe device. At least two probes form a differential pair electrically connected to a loopback line of the connection carrier board to form a test signal loopback path. The probe device has a probe device impedance on the test signal loopback path. The loopback line has a loopback line impedance on the test signal loopback path. A difference between the probe device impedance on the test signal loopback path and the loopback line impedance on the test signal loopback path is in an impedance range.