公开(公告)号：US08715836B2

公开(公告)日：2014-05-06

申请号：US12282231

申请日：2007-03-09

申请人： Makoto Dobashi ,  Mitsuyoshi Matsuda ,  Sakiko Tomonaga ,  Hisao Sakai ,  Tomohiro Sakata ,  Junshi Yoshioka ,  Jo Nishikawa ,  Takeo Taguchi

发明人： Makoto Dobashi ,  Mitsuyoshi Matsuda ,  Sakiko Tomonaga ,  Hisao Sakai ,  Tomohiro Sakata ,  Junshi Yoshioka ,  Jo Nishikawa ,  Takeo Taguchi

IPC分类号： H01L27/108 ,  H01L29/76 ,  H01L29/94

CPC分类号： H05K3/384 ,  C25D1/04 ,  C25D3/38 ,  C25D5/16 ,  C25D5/18 ,  C25D5/48 ,  C25D7/06 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/1476 ,  Y10T428/12438 ,  Y10T428/12451 ,  Y10T428/12472 ,  Y10T428/12882 ,  Y10T428/12903 ,  Y10T428/12993 ,  Y10T428/24355 ,  Y10T428/24917

摘要： It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 μm to 0.7 μm, the maximum peak to valley height (PV) to be 0.05 to 1.5 μm, and the surface roughness (Rzjis) to be 0.1 μm to 1.0 μm. The electro-deposited copper foil used for the manufacturing of this surface-treated electro-deposited copper foil is manufactured by using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine, and using a cathode having small surface roughness, under electrolysis conditions of carrying out continuous first-step electrolysis to n-th-step electrolysis at two or more different levels of electric current density.

摘要翻译： 本发明的目的是提供一种表面处理的电沉积铜箔，其具有等于或优于传统上被供应到市场的低轮廓表面处理的电沉积铜箔的等级或优异的水平， 其中影响布线直线性能的波纹小，及其制造方法。 为了实现这个目的，在表面处理的电解铜箔中，与绝缘层构成材料接合的接合面的最大波纹高度（Wmax）为0.05μm〜0.7μm，最大峰值 谷值（PV）为0.05〜1.5μm，表面粗糙度（Rzjis）为0.1μm〜1.0μm。 用于制造该表面处理的电解铜箔的电沉积铜箔通过使用通过加入3-巯基-1-丙磺酸或双（3-磺丙基）二硫化物得到的硫酸基铜电解液制备 ，具有环状结构的季铵盐聚合物和氯，并且在电解条件下使用具有小表面粗糙度的阴极，在连续的第一步电解下进行两步或更多不同电流水平的n步电解 密度。

公开(公告)号：US20090047539A1

公开(公告)日：2009-02-19

申请号：US12282231

申请日：2007-03-09

申请人： Makoto Dobashi ,  Mitsuyoshi Matsuda ,  Sakiko Tomonaga ,  Hisao Sakai ,  Tomohiro Sakata ,  Junshi Yoshioka ,  Jo Nishikawa ,  Takeo Taguchi

发明人： Makoto Dobashi ,  Mitsuyoshi Matsuda ,  Sakiko Tomonaga ,  Hisao Sakai ,  Tomohiro Sakata ,  Junshi Yoshioka ,  Jo Nishikawa ,  Takeo Taguchi

IPC分类号： B32B3/00 ,  B21C37/02 ,  C25D5/00

CPC分类号： H05K3/384 ,  C25D1/04 ,  C25D3/38 ,  C25D5/16 ,  C25D5/18 ,  C25D5/48 ,  C25D7/06 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/1476 ,  Y10T428/12438 ,  Y10T428/12451 ,  Y10T428/12472 ,  Y10T428/12882 ,  Y10T428/12903 ,  Y10T428/12993 ,  Y10T428/24355 ,  Y10T428/24917

摘要： It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 μm to 0.7 μm, the maximum peak to valley height (PV) to be 0.05 to 1.5 μm, and the surface roughness (Rzjis) to be 0.1 μm to 1.0 μm. The electro-deposited copper foil used for the manufacturing of this surface-treated electro-deposited copper foil is manufactured by using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine, and using a cathode having small surface roughness, under electrolysis conditions of carrying out continuous first-step electrolysis to n-th-step electrolysis at two or more different levels of electric current density.

摘要翻译： 本发明的目的是提供一种表面处理的电沉积铜箔，其具有等于或优于传统上被供应到市场的低轮廓表面处理的电沉积铜箔的等级或优异的水平， 其中影响布线直线性能的波纹小，及其制造方法。 为了实现这个目的，在表面处理的电解铜箔中，与绝缘层构成材料接合的接合面的最大波纹高度（Wmax）为0.05μm〜0.7μm，最大峰值 谷值（PV）为0.05〜1.5μm，表面粗糙度（Rzjis）为0.1μm〜1.0μm。 用于制造该表面处理的电解铜箔的电沉积铜箔通过使用通过加入3-巯基-1-丙磺酸或双（3-磺丙基）二硫化物得到的硫酸基铜电解液制备 ，具有环状结构的季铵盐聚合物和氯，并且在电解条件下使用具有小表面粗糙度的阴极，在连续的第一步电解下进行两步或更多不同电流水平的n步电解 密度。