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    Surface-treated electro-deposited copper foil and method for manufacturing the same
    1.
    发明授权
    Surface-treated electro-deposited copper foil and method for manufacturing the same 有权
    表面处理电沉积铜箔及其制造方法

    公开(公告)号：US08715836B2

    公开(公告)日：2014-05-06

    申请号：US12282231

    申请日：2007-03-09

    申请人： Makoto Dobashi ,  Mitsuyoshi Matsuda ,  Sakiko Tomonaga ,  Hisao Sakai ,  Tomohiro Sakata ,  Junshi Yoshioka ,  Jo Nishikawa ,  Takeo Taguchi

    发明人： Makoto Dobashi ,  Mitsuyoshi Matsuda ,  Sakiko Tomonaga ,  Hisao Sakai ,  Tomohiro Sakata ,  Junshi Yoshioka ,  Jo Nishikawa ,  Takeo Taguchi

    IPC分类号： H01L27/108 ,  H01L29/76 ,  H01L29/94

    CPC分类号： H05K3/384 ,  C25D1/04 ,  C25D3/38 ,  C25D5/16 ,  C25D5/18 ,  C25D5/48 ,  C25D7/06 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/1476 ,  Y10T428/12438 ,  Y10T428/12451 ,  Y10T428/12472 ,  Y10T428/12882 ,  Y10T428/12903 ,  Y10T428/12993 ,  Y10T428/24355 ,  Y10T428/24917

    摘要： It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 μm to 0.7 μm, the maximum peak to valley height (PV) to be 0.05 to 1.5 μm, and the surface roughness (Rzjis) to be 0.1 μm to 1.0 μm. The electro-deposited copper foil used for the manufacturing of this surface-treated electro-deposited copper foil is manufactured by using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine, and using a cathode having small surface roughness, under electrolysis conditions of carrying out continuous first-step electrolysis to n-th-step electrolysis at two or more different levels of electric current density.

    摘要翻译： 本发明的目的是提供一种表面处理的电沉积铜箔，其具有等于或优于传统上被供应到市场的低轮廓表面处理的电沉积铜箔的等级或优异的水平， 其中影响布线直线性能的波纹小，及其制造方法。 为了实现这个目的，在表面处理的电解铜箔中，与绝缘层构成材料接合的接合面的最大波纹高度（Wmax）为0.05μm〜0.7μm，最大峰值 谷值（PV）为0.05〜1.5μm，表面粗糙度（Rzjis）为0.1μm〜1.0μm。 用于制造该表面处理的电解铜箔的电沉积铜箔通过使用通过加入3-巯基-1-丙磺酸或双（3-磺丙基）二硫化物得到的硫酸基铜电解液制备 ，具有环状结构的季铵盐聚合物和氯，并且在电解条件下使用具有小表面粗糙度的阴极，在连续的第一步电解下进行两步或更多不同电流水平的n步电解 密度。

    SURFACE-TREATED ELECTRO-DEPOSITED COPPER FOIL AND METHOD FOR MANUFACTURING THE SAME
    2.
    发明申请
    SURFACE-TREATED ELECTRO-DEPOSITED COPPER FOIL AND METHOD FOR MANUFACTURING THE SAME 有权
    表面处理电沉积铜箔及其制造方法

    公开(公告)号：US20090047539A1

    公开(公告)日：2009-02-19

    申请号：US12282231

    申请日：2007-03-09

    申请人： Makoto Dobashi ,  Mitsuyoshi Matsuda ,  Sakiko Tomonaga ,  Hisao Sakai ,  Tomohiro Sakata ,  Junshi Yoshioka ,  Jo Nishikawa ,  Takeo Taguchi

    发明人： Makoto Dobashi ,  Mitsuyoshi Matsuda ,  Sakiko Tomonaga ,  Hisao Sakai ,  Tomohiro Sakata ,  Junshi Yoshioka ,  Jo Nishikawa ,  Takeo Taguchi

    IPC分类号： B32B3/00 ,  B21C37/02 ,  C25D5/00

    CPC分类号： H05K3/384 ,  C25D1/04 ,  C25D3/38 ,  C25D5/16 ,  C25D5/18 ,  C25D5/48 ,  C25D7/06 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/1476 ,  Y10T428/12438 ,  Y10T428/12451 ,  Y10T428/12472 ,  Y10T428/12882 ,  Y10T428/12903 ,  Y10T428/12993 ,  Y10T428/24355 ,  Y10T428/24917

    摘要： It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 μm to 0.7 μm, the maximum peak to valley height (PV) to be 0.05 to 1.5 μm, and the surface roughness (Rzjis) to be 0.1 μm to 1.0 μm. The electro-deposited copper foil used for the manufacturing of this surface-treated electro-deposited copper foil is manufactured by using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine, and using a cathode having small surface roughness, under electrolysis conditions of carrying out continuous first-step electrolysis to n-th-step electrolysis at two or more different levels of electric current density.

    摘要翻译： 本发明的目的是提供一种表面处理的电沉积铜箔，其具有等于或优于传统上被供应到市场的低轮廓表面处理的电沉积铜箔的等级或优异的水平， 其中影响布线直线性能的波纹小，及其制造方法。 为了实现这个目的，在表面处理的电解铜箔中，与绝缘层构成材料接合的接合面的最大波纹高度（Wmax）为0.05μm〜0.7μm，最大峰值 谷值（PV）为0.05〜1.5μm，表面粗糙度（Rzjis）为0.1μm〜1.0μm。 用于制造该表面处理的电解铜箔的电沉积铜箔通过使用通过加入3-巯基-1-丙磺酸或双（3-磺丙基）二硫化物得到的硫酸基铜电解液制备 ，具有环状结构的季铵盐聚合物和氯，并且在电解条件下使用具有小表面粗糙度的阴极，在连续的第一步电解下进行两步或更多不同电流水平的n步电解 密度。

    Method of preparing electrolytic copper solution acidified with sulfuric acid, sulfuric-acid-acidified electrolytic copper solution prepared by the preparation method, and electrodeposited copper film
    4.
    发明授权
    Method of preparing electrolytic copper solution acidified with sulfuric acid, sulfuric-acid-acidified electrolytic copper solution prepared by the preparation method, and electrodeposited copper film 有权
    制备用硫酸酸化的电解铜溶液，通过制备方法制备的硫酸酸化电解铜溶液和电沉积铜膜的方法

    公开(公告)号：US08419920B2

    公开(公告)日：2013-04-16

    申请号：US12444020

    申请日：2007-10-02

    申请人： Sakiko Tomonaga ,  Makoto Dobashi ,  Junshi Yoshioka ,  Ayumu Tateoka ,  Mitsuyoshi Matsuda ,  Hisao Sakai

    发明人： Sakiko Tomonaga ,  Makoto Dobashi ,  Junshi Yoshioka ,  Ayumu Tateoka ,  Mitsuyoshi Matsuda ,  Hisao Sakai

    IPC分类号： C25D3/38

    CPC分类号： C25D3/38

    摘要： An object of the present invention is to provide a method for preparing a sulfuric acid base copper electrolytic solution used for formation of an electro-deposited copper film comprising a surface excellent in smoothness and gloss when formed by using the solution just after preparation and is prepared by using mono-sulfides. To achieve the object, a sulfuric acid base copper electrolytic solution is made to contain a sulfonated active sulfur compound, the bis(3-sulfopropyl)disulfide which is recommended for formation of a glossy electro-deposited copper film. And the bis(3-sulfopropyl)disulfide contained is obtained by converting a 3-mercapto-1-propanesulfonic acid into the bis(3-sulfopropyl)disulfide in an aqueous solution of the 3-mercapto-1-propanesulfonic acid by an oxidation reaction. In the oxidation reaction, an air bubbling method is preferably used to prevent oxidative decomposition of the 3-mercapto-1-propanesulfonic acid.

    摘要翻译： 本发明的目的是提供一种制备用于形成电沉积铜膜的硫酸基铜电解液的方法，该方法包括当刚制备后使用溶液形成时制备的平滑度和光泽度优异的表面，并且被制备 通过使用单硫化物。 为了实现该目的，制备硫酸基铜电解液以含有磺化活性硫化合物，推荐用于形成光滑电沉积铜膜的双（3-磺丙基）二硫化物。 通过氧化反应在3-巯基-1-丙磺酸的水溶液中将3-巯基-1-丙磺酸转化成双（3-磺丙基）二硫化物，得到所含的双（3-磺丙基）二硫化物 。 在氧化反应中，优选使用空气鼓泡法来防止3-巯基-1-丙磺酸的氧化分解。

    METHOD OF PREPARING ELECTROLYTIC COPPER SOLUTION ACIDIFIED WITH SULFURIC ACID, SULFURIC-ACID-ACIDIFIED ELECTROLYTIC COPPER SOLUTION PREPARED BY THE PREPARATION METHOD, AND ELECTRODEPOSITED COPPER FILM
    5.
    发明申请
    METHOD OF PREPARING ELECTROLYTIC COPPER SOLUTION ACIDIFIED WITH SULFURIC ACID, SULFURIC-ACID-ACIDIFIED ELECTROLYTIC COPPER SOLUTION PREPARED BY THE PREPARATION METHOD, AND ELECTRODEPOSITED COPPER FILM 有权
    制备用硫酸制备的电解铜溶液的方法，由制备方法制备的硫酸 - 酸化电解铜溶液和电沉积铜膜

    公开(公告)号：US20100089758A1

    公开(公告)日：2010-04-15

    申请号：US12444020

    申请日：2007-10-02

    申请人： Sakiko Tomonaga ,  Makoto Dobashi ,  Junshi Yoshioka ,  Ayumu Tateoka ,  Mitsuyoshi Matsuda ,  Hisao Sakai

    发明人： Sakiko Tomonaga ,  Makoto Dobashi ,  Junshi Yoshioka ,  Ayumu Tateoka ,  Mitsuyoshi Matsuda ,  Hisao Sakai

    IPC分类号： C25D3/38 ,  C25D7/00

    CPC分类号： C25D3/38

    摘要： An object of the present invention is to provide a method for preparing a sulfuric acid base copper electrolytic solution used for formation of an electro-deposited copper film comprising a surface excellent in smoothness and gloss when formed by using the solution just after preparation and is prepared by using mono-sulfides. To achieve the object, a sulfuric acid base copper electrolytic solution is made to contain a sulfonated active sulfur compound, the bis(3-sulfopropyl)disulfide which is recommended for formation of a glossy electro-deposited copper film. And the bis(3-sulfopropyl)disulfide contained is obtained by converting a 3-mercapto-1-propanesulfonic acid into the bis(3-sulfopropyl)disulfide in an aqueous solution of the 3-mercapto-1-propanesulfonic acid by an oxidation reaction. In the oxidation reaction, an air bubbling method is preferably used to prevent oxidative decomposition of the 3-mercapto-1-propanesulfonic acid.

    摘要翻译： 本发明的目的是提供一种制备用于形成电沉积铜膜的硫酸基铜电解液的方法，该方法包括当刚制备后使用溶液形成时制备的平滑度和光泽度优异的表面，并且被制备 通过使用单硫化物。 为了实现该目的，制备硫酸基铜电解液以含有磺化活性硫化合物，推荐用于形成光滑电沉积铜膜的双（3-磺丙基）二硫化物。 通过氧化反应在3-巯基-1-丙磺酸的水溶液中将3-巯基-1-丙磺酸转化成双（3-磺丙基）二硫化物，得到所含的双（3-磺丙基）二硫化物 。 在氧化反应中，优选使用空气鼓泡法来防止3-巯基-1-丙磺酸的氧化分解。

    ELECTRO-DEPOSITED COPPER FOIL, SURFACE-TREATED COPPER FOIL USING THE ELECTRO-DEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE USING THE SURFACE-TREATED COPPER FOIL, AND A METHOD FOR MANUFACTURING THE ELECTRO-DEPOSITED COPPER FOIL
    10.
    发明申请
    ELECTRO-DEPOSITED COPPER FOIL, SURFACE-TREATED COPPER FOIL USING THE ELECTRO-DEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE USING THE SURFACE-TREATED COPPER FOIL, AND A METHOD FOR MANUFACTURING THE ELECTRO-DEPOSITED COPPER FOIL 有权
    使用电沉积铜箔的电沉积铜箔，表面处理铜箔的表面处理铜箔和使用表面处理铜箔的铜箔层压板，以及制造电沉积铜箔的方法

    公开(公告)号：US20090095515A1

    公开(公告)日：2009-04-16

    申请号：US12298068

    申请日：2007-04-26

    申请人： Hisao Sakai ,  Masaru Takahashi ,  Mitsuyoshi Matsuda ,  Makoto Dobashi

    发明人： Hisao Sakai ,  Masaru Takahashi ,  Mitsuyoshi Matsuda ,  Makoto Dobashi

    IPC分类号： C25D3/38 ,  C25D7/06 ,  H05K1/00

    CPC分类号： H05K1/09 ,  C25D1/04 ,  C25D3/38 ,  C25D7/0614 ,  H05K1/0393 ,  H05K3/4092 ,  H05K2201/0355 ,  H05K2201/0397 ,  Y10T428/12438

    摘要： An object of the present invention is to provide an electro-deposited copper foil having the equivalent low-profile surface as in a conventional low-profile electro-deposited copper foil and extremely large mechanical strength and a method for manufacturing the same. To achieve the object, the electro-deposited copper foil is formed by depositing fine copper crystal grains having a small deviation of grain-diameter that has never been obtained in the art. The electro-deposited copper foil has a low-profile and glossy surface and has extremely large mechanical strength expressed by a tensile strength as received of 70 kgf/mm2 to 100 kgf/mm2 and has a tensile strength after heating (180° C. for 60 minutes) corresponding to 85% or more of the tensile strength as received. The electro-deposited copper foil is manufactured by electrolysis using a sulfuric acid base copper electrolytic solution containing a compound composed of a benzene ring having a sulfo group bonded thereto, a sulfonate of an active sulfur compound and a polymer of a quaternary ammonium salt having a cyclic structure. The electro-deposited copper foil is suitable for manufacturing TAB substrate having a flying lead as shown in the figure.

    摘要翻译： 本发明的目的在于提供一种电镀铜箔，其具有与现有的薄型电沉积铜箔相同的低轮廓表面和极大的机械强度及其制造方法。 为了实现该目的，通过沉积本领域从未获得的具有小直径偏差的细铜晶粒形成电沉积铜箔。 电沉积铜箔具有低轮廓和光泽的表面，并且具有由70kgf / mm 2至100kgf / mm 2的拉伸强度表示的非常大的机械强度，并且具有加热后的拉伸强度（180℃，对于 60分钟），相当于收到的拉伸强度的85％以上。 电解铜箔通过使用含有由与其结合的具有磺基的苯环构成的化合物的硫酸基铜电解液，活性硫化合物的磺酸盐和季铵盐的聚合物进行电解而制造，所述季铵盐具有 循环结构。 电沉积铜箔适用于制造具有如图所示的飞铅的TAB基板。