Polishing apparatus having thermal energy measuring means
    2.
    发明授权
    Polishing apparatus having thermal energy measuring means 有权
    具有热能测量装置的抛光装置

    公开(公告)号:US08932106B2

    公开(公告)日:2015-01-13

    申请号:US13226800

    申请日:2011-09-07

    摘要: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a substrate holding apparatus configured to hold the substrate and to press the substrate against the polishing surface, and a controller. The substrate holding apparatus includes an elastic membrane configured to form a substrate holding surface which is brought into contact with the substrate, a carrier provided above the elastic membrane, at least one pressure chamber formed between the elastic membrane and the carrier, and an infrared light detector configured to measure thermal energy from the elastic membrane. The controller calculates an estimate value of a temperature of the elastic membrane using a measured value of the infrared light detector.

    摘要翻译: 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有抛光表面的抛光台,配置成保持基板并将基板压靠在抛光表面上的基板保持装置和控制器。 基板保持装置包括:弹性膜,其构造成形成与基板接触的基板保持面,设置在弹性膜上方的载体,形成在弹性膜与载体之间的至少一个压力室,以及红外线 检测器被配置为测量来自弹性膜的热能。 控制器使用红外光检测器的测量值来计算弹性膜的温度的估计值。

    POLISHING APPARATUS AND METHOD
    3.
    发明申请
    POLISHING APPARATUS AND METHOD 有权
    抛光装置和方法

    公开(公告)号:US20120058709A1

    公开(公告)日:2012-03-08

    申请号:US13226800

    申请日:2011-09-07

    IPC分类号: B24B49/00 B24B41/06

    摘要: A polishing is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a substrate holding apparatus configured to hold the substrate and to press the substrate against the polishing surface, and a controller. The substrate holding apparatus includes an elastic membrane configured to form a substrate holding surface which is brought into contact with the substrate, a carrier provided above the elastic membrane, at least one pressure chamber formed between the elastic membrane and the carrier, and an infrared light detector configured to measure thermal energy from the elastic membrane. The controller calculates an estimate value of a temperature of the elastic membrane using a measured value of the infrared light detector.

    摘要翻译: 抛光用于将诸如半导体晶片的基板抛光到平面镜面。 抛光装置包括具有抛光表面的抛光台,配置成保持基板并将基板压靠在抛光表面上的基板保持装置和控制器。 基板保持装置包括:弹性膜,其构造成形成与基板接触的基板保持面,设置在弹性膜上方的载体,形成在弹性膜与载体之间的至少一个压力室,以及红外线 检测器被配置为测量来自弹性膜的热能。 控制器使用红外光检测器的测量值来计算弹性膜的温度的估计值。

    Substrate holding apparatus, polishing apparatus, and polishing method
    6.
    发明授权
    Substrate holding apparatus, polishing apparatus, and polishing method 有权
    基板保持装置,抛光装置和抛光方法

    公开(公告)号:US08485866B2

    公开(公告)日:2013-07-16

    申请号:US13587371

    申请日:2012-08-16

    IPC分类号: B24B29/00 B24B47/02

    CPC分类号: B24B37/32

    摘要: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

    摘要翻译: 基板保持装置防止基板滑出并允许基板被稳定地抛光。 基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体,以及用于按压研磨面的保持环,保持环设置在顶环体的外周部。 保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件,该磁体保持抵靠第一构件。

    Substrate holding apparatus, polishing apparatus, and polishing method
    7.
    发明授权
    Substrate holding apparatus, polishing apparatus, and polishing method 有权
    基板保持装置,抛光装置和抛光方法

    公开(公告)号:US08267746B2

    公开(公告)日:2012-09-18

    申请号:US12222909

    申请日:2008-08-19

    IPC分类号: B24B47/02

    CPC分类号: B24B37/32

    摘要: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

    摘要翻译: 基板保持装置防止基板滑出并允许基板被稳定地抛光。 基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体,以及用于按压研磨面的保持环,保持环设置在顶环体的外周部。 保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件,该磁体保持抵靠第一构件。

    POLISHING APPARATUS
    8.
    发明申请
    POLISHING APPARATUS 有权
    抛光装置

    公开(公告)号:US20120071065A1

    公开(公告)日:2012-03-22

    申请号:US13304931

    申请日:2011-11-28

    IPC分类号: B24B7/10

    摘要: A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

    摘要翻译: 抛光装置具有抛光垫,用于保持半导体晶片的顶环,以及可操作以在垂直方向上移动顶环的垂直移动机构。 抛光装置还具有距离测量传感器,该距离测量传感器可操作以当顶环的下表面与抛光垫接触时检测顶环的位置,以及控制器,其可操作以计算顶环的最佳位置进行抛光 基于由距离测量传感器检测到的位置的半导体晶片。 垂直移动机构包括可操作以将顶环移动到最佳位置的滚珠丝杠机构。

    Substrate holding apparatus, polishing apparatus, and polishing method
    9.
    发明授权
    Substrate holding apparatus, polishing apparatus, and polishing method 有权
    基板保持装置,抛光装置和抛光方法

    公开(公告)号:US07967665B2

    公开(公告)日:2011-06-28

    申请号:US11730142

    申请日:2007-03-29

    IPC分类号: B24B29/00

    CPC分类号: B24B37/32

    摘要: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

    摘要翻译: 基板保持装置防止基板滑出并允许基板被稳定地抛光。 基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体,以及用于按压研磨面的保持环,保持环设置在顶环体的外周部。 保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件,该磁体保持抵靠第一构件。

    Substrate holding apparatus
    10.
    发明授权
    Substrate holding apparatus 有权
    基板保持装置

    公开(公告)号:US07850509B2

    公开(公告)日:2010-12-14

    申请号:US12285936

    申请日:2008-10-16

    IPC分类号: B24B7/22

    CPC分类号: B24B37/30 B24B41/061

    摘要: The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

    摘要翻译: 本发明涉及一种用于将基板保持并压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的顶环体,用于接触基板的弹性垫和用于支撑弹性垫的支撑构件。 基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。 接触构件具有用于接触弹性垫的弹性膜。 第一压力室限定在接触构件中,并且第二压力室限定在接触构件的外部。 基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。