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    CHIP-TYPE LED AND METHOD FOR MANUFACTURING THE SAME
    1.
    发明申请
    CHIP-TYPE LED AND METHOD FOR MANUFACTURING THE SAME 有权
    芯片型LED及其制造方法

    公开(公告)号：US20090108282A1

    公开(公告)日：2009-04-30

    申请号：US12260742

    申请日：2008-10-29

    申请人： Makoto MATSUDA ,  Toshio Hata

    发明人： Makoto MATSUDA ,  Toshio Hata

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/508 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： In a chip-type LED according to an embodiment of the present invention, a first recess hole for mounting an LED chip and a second recess hole for connecting a fine metal wire are formed in an insulating substrate, a metal sheet serving as a first wiring pattern is formed at a portion that includes the first recess hole, a metal sheet serving as a second wiring pattern is formed at a portion that includes the second recess hole, an LED chip is mounted on the metal sheet within the first recess hole, the LED chip is electrically connected to the metal sheet within the second recess hole via a fine metal wire, the LED chip including the first recess hole and the fine metal wire including the second recess hole are encapsulated in a first transparent resin that contains a fluorescent material, a surface of the insulating substrate including the first transparent resin is encapsulated in a second transparent resin.

    摘要翻译： 在根据本发明的实施例的芯片型LED中，在绝缘基板中形成用于安装LED芯片的第一凹部孔和用于连接细金属丝的第二凹部孔，用作第一布线 在包括第一凹槽的部分形成图案，在包括第二凹槽的部分形成用作第二布线图案的金属片，在第一凹槽内的金属片上安装LED芯片， LED芯片通过细金属线电连接到第二凹槽内的金属片，包括第一凹部孔和包括第二凹部孔的细金属线的LED芯片封装在包含荧光材料的第一透明树脂中 包含第一透明树脂的绝缘基板的表面被封装在第二透明树脂中。

    CHIP-TYPE LED AND METHOD FOR MANUFACTURING THE SAME
    2.
    发明申请
    CHIP-TYPE LED AND METHOD FOR MANUFACTURING THE SAME 有权
    芯片型LED及其制造方法

    公开(公告)号：US20110244606A1

    公开(公告)日：2011-10-06

    申请号：US13162295

    申请日：2011-06-16

    申请人： Makoto MATSUDA ,  Toshio Hata

    发明人： Makoto MATSUDA ,  Toshio Hata

    IPC分类号： H01L33/52

    CPC分类号： H01L33/486 ,  H01L33/508 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： In a chip-type LED according to an embodiment of the present invention, a first recess hole for mounting an LED chip and a second recess hole for connecting a fine metal wire are formed in an insulating substrate, a metal sheet serving as a first wiring pattern is formed at a portion that includes the first recess hole, a metal sheet serving as a second wiring pattern is formed at a portion that includes the second recess hole, an LED chip is mounted on the metal sheet within the first recess hole, the LED chip is electrically connected to the metal sheet within the second recess hole via a fine metal wire, the LED chip including the first recess hole and the fine metal wire including the second recess hole are encapsulated in a first transparent resin that contains a fluorescent material, a surface of the insulating substrate including the first transparent resin is encapsulated in a second transparent resin.

    摘要翻译： 在根据本发明的实施例的芯片型LED中，在绝缘基板中形成用于安装LED芯片的第一凹部孔和用于连接细金属丝的第二凹部孔，用作第一布线 在包括第一凹槽的部分形成图案，在包括第二凹槽的部分形成用作第二布线图案的金属片，在第一凹槽内的金属片上安装LED芯片， LED芯片通过细金属线电连接到第二凹槽内的金属片，包括第一凹部孔和包括第二凹部孔的细金属线的LED芯片封装在包含荧光材料的第一透明树脂中 包含第一透明树脂的绝缘基板的表面被封装在第二透明树脂中。

    CHIP-TYPE LED AND METHOD OF MANUFACTURING THE SAME
    3.
    发明申请
    CHIP-TYPE LED AND METHOD OF MANUFACTURING THE SAME 有权
    芯片型LED及其制造方法

    公开(公告)号：US20120115263A1

    公开(公告)日：2012-05-10

    申请号：US13353014

    申请日：2012-01-18

    申请人： Makoto MATSUDA

    发明人： Makoto MATSUDA

    IPC分类号： H01L33/48

    CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K1/0203 ,  H05K1/183 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/10106 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An embodiment of the present invention has an insulating substrate in which a first concave hole for mounting an LED chip and a second concave hole for connecting a metallic small-gauge wire are formed, where a metallic sheet that serves as a first wiring pattern is formed at a portion that includes the first concave hole, a metallic sheet that serves as a second wiring pattern is formed at a portion that includes the second concave hole, an LED chip is mounted upon the metallic sheet inside the first concave hole, the LED chip is electrically connected to the metallic sheet inside the second concave hole via a metallic small-gauge wire, and the chip-type LED is sealed with a clear resin.

    摘要翻译： 本发明的实施例具有绝缘基板，其中形成用于安装LED芯片的第一凹孔和用于连接金属小规格金属丝的第二凹孔，其中形成用作第一布线图案的金属片 在包括第一凹孔的部分，在包括第二凹孔的部分处形成用作第二布线图案的金属片，将LED芯片安装在第一凹孔内的金属片上，LED芯片 通过金属小规格导线与第二凹孔内的金属片电连接，芯片型LED用透明树脂密封。

    CHIP-TYPE LED AND METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    CHIP-TYPE LED AND METHOD OF MANUFACTURING THE SAME 有权
    芯片型LED及其制造方法

    公开(公告)号：US20090014749A1

    公开(公告)日：2009-01-15

    申请号：US12171914

    申请日：2008-07-11

    申请人： Makoto MATSUDA

    发明人： Makoto MATSUDA

    IPC分类号： H01L33/00 ,  H01L21/00

    CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K1/0203 ,  H05K1/183 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/10106 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An embodiment of the present invention has an insulating substrate in which a first concave hole for mounting an LED chip and a second concave hole for connecting a metallic small-gauge wire are formed, where a metallic sheet that serves as a first wiring pattern is formed at a portion that includes the first concave hole, a metallic sheet that serves as a second wiring pattern is formed at a portion that includes the second concave hole, an LED chip is mounted upon the metallic sheet inside the first concave hole, the LED chip is electrically connected to the metallic sheet inside the second concave hole via a metallic small-gauge wire, and the chip-type LED is sealed with a clear resin.

    摘要翻译： 本发明的实施例具有绝缘基板，其中形成用于安装LED芯片的第一凹孔和用于连接金属小规格金属丝的第二凹孔，其中形成用作第一布线图案的金属片 在包括第一凹孔的部分，在包括第二凹孔的部分处形成用作第二布线图案的金属片，将LED芯片安装在第一凹孔内的金属片上，LED芯片 通过金属小规格导线与第二凹孔内的金属片电连接，芯片型LED用透明树脂密封。

    LAMINATED CERAMIC CAPACITOR
    6.
    发明申请
    LAMINATED CERAMIC CAPACITOR 有权
    层压陶瓷电容器

    公开(公告)号：US20110038097A1

    公开(公告)日：2011-02-17

    申请号：US12907207

    申请日：2010-10-19

    申请人： Makoto MATSUDA ,  Tomoyuki Nakamura

    发明人： Makoto MATSUDA ,  Tomoyuki Nakamura

    IPC分类号： H01G4/12

    CPC分类号： H01G4/1227 ,  H01G4/30

    摘要： Better high-temperature load characteristics are obtained in a laminated ceramic capacitor including a dielectric ceramic layer with a thickness of 1 μm or less. The laminated ceramic capacitor includes a plurality of stacked dielectric ceramic layers, a plurality of internal electrode layers, each disposed between dielectric ceramic layers, and external electrodes that are electrically connected to internal electrode layers. In this laminated ceramic capacitor, when the thickness of each dielectric ceramic layer is denoted by tc and the thickness of each internal electrode layer is denoted by te, tc is 1 μm or less, and tc/te is equal to or less than 1.

    摘要翻译： 在包括厚度为1μm以下的电介质陶瓷层的层叠陶瓷电容器中，可获得更好的高温负荷特性。 叠层陶瓷电容器包括多个堆叠的电介质陶瓷层，各自设置在电介质陶瓷层之间的多个内部电极层和电连接到内部电极层的外部电极。 在这种层叠陶瓷电容器中，当每个介电陶瓷层的厚度由tc表示，每个内部电极层的厚度由te表示时，tc为1μm以下，tc / te为1以下。