公开(公告)号：US08421215B2

公开(公告)日：2013-04-16

申请号：US13331253

申请日：2011-12-20

申请人： Makoto Tani ,  Takami Hirai ,  Shinsuke Yano ,  Daishi Tanabe

发明人： Makoto Tani ,  Takami Hirai ,  Shinsuke Yano ,  Daishi Tanabe

IPC分类号： H01L23/12 ,  H01L23/053 ,  H01L23/00 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H05K1/00

CPC分类号： H05K3/4629 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5283 ,  H01L2924/0002 ,  H05K1/0242 ,  H05K3/4623 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/098 ,  H05K2201/09827 ,  H01L2924/00

摘要： In the laminated and sintered ceramic circuit board according to the present invention, at least a portion of the inplane conductor is fine-lined, such that the shape of the cross-section surface of the fine-lined inplane conductor is trapezoid, and the height (a), the length (c) of the lower base and the length (d) of the upper base of the trapezoidal cross-section surfaces, and the interval (b) between the lower bases of the trapezoidal cross-section surfaces of the inplane conductors adjacent in a plane parallel to the principal surfaces of the board meet a certain relation. This provides a laminated ceramic circuit board with low open failure rate, short-circuit failure rate and high reliability against high temperature and high humidity in a downsized and short-in-height (thin) semiconductor package.

摘要翻译： 在根据本发明的层压和烧结陶瓷电路板中，面内导体的至少一部分被精细地排列，使得细衬面内导体的横截面的形状是梯形，并且高度 （a）中，梯形截面的下基部的长度（c）和上基部的长度（d）以及梯形截面的梯形截面的下基座之间的间隔（b） 在与板的主表面平行的平面中相邻的面内导体满足一定关系。 这提供了在小型化和短路（薄）半导体封装中具有低开路故障率，短路故障率和高温和高湿度的高可靠性的层压陶瓷电路板。

公开(公告)号：US20130049202A1

公开(公告)日：2013-02-28

申请号：US13331253

申请日：2011-12-20

申请人： Makoto TANI ,  Takami Hirai ,  Shinsuke Yano ,  Daishi Tanabe

发明人： Makoto TANI ,  Takami Hirai ,  Shinsuke Yano ,  Daishi Tanabe

IPC分类号： H01L23/48 ,  H05K1/09 ,  H05K1/00

CPC分类号： H05K3/4629 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5283 ,  H01L2924/0002 ,  H05K1/0242 ,  H05K3/4623 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/098 ,  H05K2201/09827 ,  H01L2924/00

摘要： In the laminated and sintered ceramic circuit board according to the present invention, at least a portion of the inplane conductor is fine-lined, such that the shape of the cross-section surface of the fine-lined inplane conductor is trapezoid, and the height (a), the length (c) of the lower base and the length (d) of the upper base of the trapezoidal cross-section surfaces, and the interval (b) between the lower bases of the trapezoidal cross-section surfaces of the inplane conductors adjacent in a plane parallel to the principal surfaces of the board meet a certain relation. This provides a laminated ceramic circuit hoard with low open failure rate, short-circuit failure rate and high reliability against high temperature and high humidity in a downsized and short-in-height (thin) semiconductor package.

摘要翻译： 在根据本发明的层压和烧结陶瓷电路板中，面内导体的至少一部分被精细地排列，使得细衬面内导体的横截面的形状是梯形，并且高度 （a）中，梯形截面的下基部的长度（c）和上基部的长度（d）以及梯形截面的梯形截面的下基座之间的间隔（b） 在与板的主表面平行的平面中相邻的面内导体满足一定关系。 这提供了在小型和短路（薄）半导体封装中具有低开路故障率，短路故障率和高温和高湿度的高可靠性的层压陶瓷电路板。