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公开(公告)号：US07145427B2
公开(公告)日：2006-12-05
申请号：US10894045
申请日：2004-07-20
申请人： Makoto Yoshida , Nobuyuki Okuzawa , Tomokazu Ito , Takashi Kudo , Makoto Otomo , Akira Sato
发明人： Makoto Yoshida , Nobuyuki Okuzawa , Tomokazu Ito , Takashi Kudo , Makoto Otomo , Akira Sato
IPC分类号： H01F5/00
CPC分类号： H01F17/0013 , H01F2017/0093 , H01F2017/048 , H03H2001/0085 , H03H2001/0092 , Y10T29/4902 , Y10T29/4906 , Y10T29/49062 , Y10T29/49073
摘要： There is provided a common mode choke coil whose impedance value can be easily adjusted by changing the thickness of an insulation layer for impedance value adjustment appropriately. An insulation layer for impedance value adjustment is formed throughout a principal surface of a first magnetic substrate. Coil patterns and insulation layers are alternately formed on that layer. Parts of the insulation layers other than the insulation layer for impedance value adjustment are removed in either or both of a central region surrounded by the coil patterns and a region around the coil patterns. A resin including magnetic powder is provided on the uppermost insulation layer and the regions where the insulation layers have been removed, and a second magnetic substrate is bonded through a bonding layer.
摘要翻译： 提供了一种共模扼流线圈，其阻抗值可以通过适当地改变绝缘层的厚度来进行阻抗值调节来容易地调节。 在第一磁性基板的整个主表面上形成用于阻抗值调节的绝缘层。 线圈图案和绝缘层交替地形成在该层上。 除了用于阻抗值调节的绝缘层之外的绝缘层的一部分在由线圈图案围绕的中心区域和线圈图案周围的区域中的任一个或两个中去除。 包含磁性粉末的树脂设置在最上层的绝缘层和绝缘层被去除的区域上，第二磁性基板通过接合层接合。
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公开(公告)号：US07905008B2
公开(公告)日：2011-03-15
申请号：US11585098
申请日：2006-10-24
申请人： Makoto Yoshida , Nobuyuki Okuzawa , Tomokazu Ito , Takashi Kudo , Makoto Otomo , Akira Sato
发明人： Makoto Yoshida , Nobuyuki Okuzawa , Tomokazu Ito , Takashi Kudo , Makoto Otomo , Akira Sato
CPC分类号： H01F17/0013 , H01F2017/0093 , H01F2017/048 , H03H2001/0085 , H03H2001/0092 , Y10T29/4902 , Y10T29/4906 , Y10T29/49062 , Y10T29/49073
摘要： There is provided a method of manufacturing a coil component, where a first insulation layer is formed on a first magnetic substrate, an insulation film is formed on the first insulation layer, a coil conductor is formed on the insulation film, another insulation film is formed on the coil conductor, and an open region is formed on the inner circumference side and on the outer circumference side of the coil conductor. A magnetic later is embedded, at least partially, in the open region, and a second magnetic substrate is secured on the magnetic layer. Also, a plurality of electrode terminals are formed, where one of the electrode terminals is connected to a terminal portion of the coil conductor, and the electrode terminals are provided across sides of the first and second magnetic substrates. Therefore, the first insulation layer can suitably prevent shorting failures between the electrode terminals.
摘要翻译： 提供一种制造线圈部件的方法，其中在第一磁性基板上形成第一绝缘层，在第一绝缘层上形成绝缘膜，在绝缘膜上形成线圈导体，形成另一绝缘膜 并且在线圈导体的内周侧和外周侧形成开放区域。 至少部分地在开放区域中嵌入磁性，并且将第二磁性基板固定在磁性层上。 此外，形成多个电极端子，其中一个电极端子连接到线圈导体的端子部分，并且电极端子设置在第一和第二磁性基板的两侧。 因此，第一绝缘层可以适当地防止电极端子之间的短路故障。
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公开(公告)号：US20070033798A1
公开(公告)日：2007-02-15
申请号：US11585098
申请日：2006-10-24
申请人： Makoto Yoshida , Nobuyuki Okuzawa , Tomokazu Ito , Takashi Kudo , Makoto Otomo , Akira Sato
发明人： Makoto Yoshida , Nobuyuki Okuzawa , Tomokazu Ito , Takashi Kudo , Makoto Otomo , Akira Sato
IPC分类号： H01F5/00
CPC分类号： H01F17/0013 , H01F2017/0093 , H01F2017/048 , H03H2001/0085 , H03H2001/0092 , Y10T29/4902 , Y10T29/4906 , Y10T29/49062 , Y10T29/49073
摘要： There is provided a common mode choke coil whose impedance value can be easily adjusted by changing the thickness of an insulation layer for impedance value adjustment appropriately. An insulation layer for impedance value adjustment is formed throughout a principal surface of a first magnetic substrate. Coil patterns and insulation layers are alternately formed on that layer. Parts of the insulation layers other than the insulation layer for impedance value adjustment are removed in either or both of a central region surrounded by the coil patterns and a region around the coil patterns. A resin including magnetic powder is provided on the uppermost insulation layer and the regions where the insulation layers have been removed, and a second magnetic substrate is bonded through a bonding layer.
摘要翻译： 提供了一种共模扼流线圈，其阻抗值可以通过适当地改变绝缘层的厚度来进行阻抗值调节来容易地调节。 在第一磁性基板的整个主表面上形成用于阻抗值调节的绝缘层。 线圈图案和绝缘层交替地形成在该层上。 除了用于阻抗值调节的绝缘层之外的绝缘层的一部分在由线圈图案围绕的中心区域和线圈图案周围的区域中的任一个或两个中去除。 包含磁性粉末的树脂设置在最上层的绝缘层和绝缘层被去除的区域上，第二磁性基板通过接合层接合。
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公开(公告)号：US20050068148A1
公开(公告)日：2005-03-31
申请号：US10894045
申请日：2004-07-20
申请人： Makoto Yoshida , Nobuyuki Okuzawa , Tomokazu Ito , Takashi Kudo , Makoto Otomo , Akira Sato
发明人： Makoto Yoshida , Nobuyuki Okuzawa , Tomokazu Ito , Takashi Kudo , Makoto Otomo , Akira Sato
CPC分类号： H01F17/0013 , H01F2017/0093 , H01F2017/048 , H03H2001/0085 , H03H2001/0092 , Y10T29/4902 , Y10T29/4906 , Y10T29/49062 , Y10T29/49073
摘要： There is provided a common mode choke coil whose impedance value can be easily adjusted by changing the thickness of an insulation layer for impedance value adjustment appropriately. An insulation layer for impedance value adjustment is formed throughout a principal surface of a first magnetic substrate. Coil patterns and insulation layers are alternately formed on that layer. Parts of the insulation layers other than the insulation layer for impedance value adjustment are removed in either or both of a central region surrounded by the coil patterns and a region around the coil patterns. A resin including magnetic powder is provided on the uppermost insulation layer and the regions where the insulation layers have been removed, and a second magnetic substrate is bonded through a bonding layer.
摘要翻译： 提供了一种共模扼流线圈，其阻抗值可以通过适当地改变绝缘层的厚度来进行阻抗值调节来容易地调节。 在第一磁性基板的整个主表面上形成用于阻抗值调节的绝缘层。 线圈图案和绝缘层交替地形成在该层上。 除了用于阻抗值调节的绝缘层之外的绝缘层的一部分在由线圈图案围绕的中心区域和线圈图案周围的区域中的任一个或两个中去除。 包含磁性粉末的树脂设置在最上层的绝缘层和绝缘层被去除的区域上，第二磁性基板通过接合层接合。
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公开(公告)号：US07453343B2
公开(公告)日：2008-11-18
申请号：US11375260
申请日：2006-03-15
申请人： Tomokazu Ito , Takashi Kudo , Makoto Otomo
发明人： Tomokazu Ito , Takashi Kudo , Makoto Otomo
IPC分类号： H01F5/00
CPC分类号： H01F41/046 , H01F17/0013 , H01F41/042 , H01F2017/0093 , H01F2017/048 , H03H2001/0085 , H03H2001/0092
摘要： A thin-film type common-mode choke coil includes a laminated structure having a magnetic substrate; and electrically insulating layers and conductor layers laminated on the magnetic substrate in a direction of thickness, wherein said conductor layers form at least two coil conductors; at least two of the conductor layers are provided as spiral conductor patterns; and the spiral conductor patterns satisfy the expression: 5 μm≦W1≦36 μm in which W1 is the conductor width of each of the spiral conductor patters. The spiral conductor patterns may also satisfy the expression: 100 μm2≦T*W1 in which T is the conductor thickness of each of said spiral conductor patterns or satisfy the expression: W2
摘要翻译： 薄膜型共模扼流线圈包括具有磁性基板的叠层结构; 以及层叠在所述磁性基板上的厚度方向的电绝缘层和导体层，其中，所述导体层形成至少两个线圈导体; 至少两个导体层被设置为螺旋导体图案; 并且螺旋导体图案满足以下表达式：5μm<= W 1 <=36μm，其中W 1是每个螺旋导体图案的导体宽度。 螺旋导体图案也可以满足以下表达式：其中T是每个所述螺旋导体图案的导体厚度，或满足以下表达式：W 2
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公开(公告)号：US20060176138A1
公开(公告)日：2006-08-10
申请号：US11375260
申请日：2006-03-15
申请人： Tomokazu Ito , Takashi Kudo , Makoto Otomo
发明人： Tomokazu Ito , Takashi Kudo , Makoto Otomo
IPC分类号： H01F5/00
CPC分类号： H01F41/046 , H01F17/0013 , H01F41/042 , H01F2017/0093 , H01F2017/048 , H03H2001/0085 , H03H2001/0092
摘要： A thin-film type common-mode choke coil includes a laminated structure having a magnetic substrate; and electrically insulating layers and conductor layers laminated on the magnetic substrate in a direction of thickness, wherein said conductor layers form at least two coil conductors; at least two of the conductor layers are provided as spiral conductor patterns; and the spiral conductor patterns satisfy the expression: 5 μm≦W1≦36 μm in which W1 is the conductor width of each of the spiral conductor patters. The spiral conductor patterns may also satisfy the expression: 100 μm2≦T*W1 in which T is the conductor thickness of each of said spiral conductor patterns or satisfy the expression: W2
摘要翻译： 薄膜型共模扼流线圈包括具有磁性基板的叠层结构; 以及层叠在所述磁性基板上的厚度方向的电绝缘层和导体层，其中，所述导体层形成至少两个线圈导体; 至少两个导体层被设置为螺旋导体图案; 并且螺旋导体图案满足以下表达式：5μm<= W 1 <=36μm，其中W 1是每个螺旋导体图案的导体宽度。 螺旋导体图案也可以满足以下表达式：其中T是每个所述螺旋导体图案的导体厚度，或满足以下表达式：W 2
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公开(公告)号：US20050253677A1
公开(公告)日：2005-11-17
申请号：US11113092
申请日：2005-04-25
申请人： Tomokazu Ito , Takashi Kudo , Makoto Otomo
发明人： Tomokazu Ito , Takashi Kudo , Makoto Otomo
CPC分类号： H01F17/0013 , H01F27/2804
摘要： The invention relates to surface-mount coil component including a mount surface mounted on a printed circuit board or a hybrid IC (HIC), and provides a small and low-profile coil component excellent in impedance characteristic. The coil component includes coil conductors each of which includes a major wiring region having the number N of wiring lines and a minor wiring region arranged to be opposite to the major wiring region and having the number (N−1) of wiring lines, and is arranged so that a major wiring side interval as an interval between an outermost periphery of the major wiring region and one side part of the substrate opposite thereto is longer than a minor wiring side interval as an interval between an outermost periphery of the minor wiring region and the other side part of the substrate opposite thereto.
摘要翻译： 本发明涉及包括安装在印刷电路板或混合IC（HIC）上的安装表面的表面安装线圈部件，并且提供阻抗特性优异的小而薄的线圈部件。 线圈部件包括线圈导体，每个线圈导体包括布线数N的主布线区域和布置成与主布线区域相对并具有布线数量（N-1）的次布线区域，并且是 布置成使得主布线区域的最外周与其相对的基板的一个侧面之间的间隔的主布线侧间隔比次布线侧间隔长，作为次布线区域的最外周与第 基板相对的另一侧部分。
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公开(公告)号：US07696849B2
公开(公告)日：2010-04-13
申请号：US11038540
申请日：2005-01-21
申请人： Tomokazu Ito , Takashi Kudo , Makoto Otomo
发明人： Tomokazu Ito , Takashi Kudo , Makoto Otomo
IPC分类号： H01F27/29
CPC分类号： H05K3/3442 , H01F17/0013 , H01F27/027 , H01F27/292 , H01R12/57 , H05K2201/09381 , Y02P70/613
摘要： An electronic component of the surface-mounted type having a mounting surface that can be mounted on the printed circuit board, maintaining sufficient insulation among the external electrodes despite the chip size is decreased, and having a large mounting strength. In a common mode choke coil array, for example, an external electrode is constituted by electrode pads formed on the mounting surfaces of insulating substrates mounted on a PCB, and a connection electrode which electrically connects an internal electrode terminal exposed on the outer surface different from the mounting surface to the electrode pads. The connection electrodes near the internal electrode terminals have a width c′ smaller than a width b of the electrode pads as measured in the same direction.
摘要翻译： 具有可安装在印刷电路板上的安装表面的表面安装型电子部件，尽管芯片尺寸保持在外部电极之间保持足够的绝缘性，并且具有大的安装强度。 在共模扼流线圈阵列中，例如，外部电极由形成在安装在PCB上的绝缘基板的安装面上的电极焊盘构成，并且连接电极将暴露在外表面上的内部电极端子 电极垫的安装表面。 内部电极端子附近的连接电极的宽度c'小于沿相同方向测量的电极焊盘的宽度b。
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公开(公告)号：US07002446B2
公开(公告)日：2006-02-21
申请号：US11113092
申请日：2005-04-25
申请人： Tomokazu Ito , Takashi Kudo , Makoto Otomo
发明人： Tomokazu Ito , Takashi Kudo , Makoto Otomo
IPC分类号： H01F5/00
CPC分类号： H01F17/0013 , H01F27/2804
摘要： The invention relates to surface-mount coil component including a mount surface mounted on a printed circuit board or a hybrid IC (HIC), and provides a small and low-profile coil component excellent in impedance characteristic. The coil component includes coil conductors each of which includes a major wiring region having the number N of wiring lines and a minor wiring region arranged to be opposite to the major wiring region and having the number (N−1) of wiring lines, and is arranged so that a major wiring side interval as an interval between an outermost periphery of the major wiring region and one side part of the substrate opposite thereto is longer than a minor wiring side interval as an interval between an outermost periphery of the minor wiring region and the other side part of the substrate opposite thereto.
摘要翻译： 本发明涉及包括安装在印刷电路板或混合IC（HIC）上的安装表面的表面安装线圈部件，并且提供阻抗特性优异的小而薄的线圈部件。 线圈部件包括线圈导体，每个线圈导体包括布线数N的主布线区域和布置成与主布线区域相对并具有布线数量（N-1）的次布线区域，并且是 布置成使得主布线区域的最外周与其相对的基板的一个侧面之间的间隔的主布线侧间隔比次布线侧间隔长，作为次布线区域的最外周与第 基板相对的另一侧部分。
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公开(公告)号：US20050181684A1
公开(公告)日：2005-08-18
申请号：US11038540
申请日：2005-01-21
申请人： Tomokazu Ito , Takashi Kudo , Makoto Otomo
发明人： Tomokazu Ito , Takashi Kudo , Makoto Otomo
CPC分类号： H05K3/3442 , H01F17/0013 , H01F27/027 , H01F27/292 , H01R12/57 , H05K2201/09381 , Y02P70/613
摘要： An electronic component of the surface-mounted type having a mounting surface that can be mounted on the printed circuit board, maintaining sufficient insulation among the external electrodes despite the chip size is decreased, and having a large mounting strength. In a common mode choke coil array, for example, an external electrode is constituted by electrode pads formed on the mounting surfaces of insulating substrates mounted on a PCB, and a connection electrode which electrically connects an internal electrode terminal exposed on the outer surface different from the mounting surface to the electrode pads. The connection electrodes near the internal electrode terminals have a width c′ smaller than a width b of the electrode pads as measured in the same direction.
摘要翻译： 具有可安装在印刷电路板上的安装表面的表面安装型电子部件，尽管芯片尺寸保持在外部电极之间保持足够的绝缘性，并且具有大的安装强度。 在共模扼流线圈阵列中，例如，外部电极由形成在安装在PCB上的绝缘基板的安装面上的电极焊盘构成，并且连接电极将暴露在外表面上的内部电极端子 电极垫的安装表面。 内部电极端子附近的连接电极的宽度c'小于沿相同方向测量的电极焊盘的宽度b。
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