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4 条记录 (耗时 0.019 秒)

    Laser diode module
    1.
    发明授权
    Laser diode module 失效
    激光二极管模块

    公开(公告)号：US06490303B1

    公开(公告)日：2002-12-03

    申请号：US08733628

    申请日：1996-10-17

    申请人： Manabu Komiyama ,  Shunichi Sato ,  Noboru Sonetsuji ,  Tetsuo Ishizaka ,  Saeko Yokoi

    发明人： Manabu Komiyama ,  Shunichi Sato ,  Noboru Sonetsuji ,  Tetsuo Ishizaka ,  Saeko Yokoi

    IPC分类号： G02B600

    CPC分类号： H01S5/02415 ,  H01L2224/48091 ,  H01S5/0014 ,  H01S5/005 ,  H01S5/02216 ,  H01S5/02284 ,  H01S5/02438 ,  H01S5/042 ,  H01S5/06216 ,  H01S5/0683 ,  H01L2924/00014

    摘要： Disclosed herein is a laser diode module having a thermoelectric cooling element, a laser diode, and a thermistor in a housing. The thermoelectric cooling element has a first surface and a second surface between which heat exchange is performed. The first surface is in close contact with an inner surface of the housing. A base is provided on the second surface in close contact therewith. A laser carrier and a thermistor carrier are provided on the base in close contact therewith. The laser diode and the thermistor are provided on the laser carrier and the thermistor carrier in close contact therewith, respectively. A portion of the base in the vicinity of the laser carrier is thermally connected to the housing by a metal plate, for example, thereby allowing high-precision temperature control of the laser diode.

    摘要翻译： 这里公开了一种在壳体中具有热电冷却元件，激光二极管和热敏电阻的激光二极管模块。 热电冷却元件具有第一表面和在其之间执行热交换的第二表面。 第一表面与壳体的内表面紧密接触。 基部与第二表面紧密接触地设置。 激光载体和热敏电阻载体与底座紧密接触地设置在基座上。 激光二极管和热敏电阻分别设置在激光载体和热敏电阻载体上。 激光载体附近的基部的一部分例如通过金属板热连接到壳体，从而允许激光二极管的高精度温度控制。

    Laser diode module
    2.
    发明授权
    Laser diode module 失效
    激光二极管模块

    公开(公告)号：US5703893A

    公开(公告)日：1997-12-30

    申请号：US506866

    申请日：1995-07-25

    申请人： Manabu Komiyama ,  Shunichi Sato ,  Noboru Sonetsuji ,  Tetsuo Ishizaka ,  Saeko Yokoi

    发明人： Manabu Komiyama ,  Shunichi Sato ,  Noboru Sonetsuji ,  Tetsuo Ishizaka ,  Saeko Yokoi

    IPC分类号： G02B6/42 ,  H01S5/00 ,  H01S5/022 ,  H01S5/024 ,  H01S3/043

    CPC分类号： H01S5/02415 ,  H01S5/02216 ,  H01L2224/48091 ,  H01S5/0014 ,  H01S5/005 ,  H01S5/02284 ,  H01S5/02438 ,  H01S5/042 ,  H01S5/06216 ,  H01S5/0683

    摘要： Disclosed herein is a laser diode module having a thermoelectric cooling element, a laser diode, and a thermistor in a housing. The thermoelectric cooling element has a first surface and a second surface between which heat exchange is performed. The first surface is in close contact with an inner surface of the housing. A base is provided on the second surface in close contact therewith. A laser carrier and a thermistor carrier are provided on the base in close contact therewith. The laser diode and the thermistor are provided on the laser carrier and the thermistor carrier in close contact therewith, respectively. A portion of the base in the vicinity of the laser carrier is thermally connected to the housing by a metal plate, for example, thereby allowing high-precision temperature control of the laser diode.

    摘要翻译： 这里公开了一种在壳体中具有热电冷却元件，激光二极管和热敏电阻的激光二极管模块。 热电冷却元件具有第一表面和在其之间执行热交换的第二表面。 第一表面与外壳的内表面紧密接触。 基部与第二表面紧密接触地设置。 激光载体和热敏电阻载体与底座紧密接触地设置在基座上。 激光二极管和热敏电阻分别设置在激光载体和热敏电阻载体上。 激光载体附近的基部的一部分例如通过金属板热连接到壳体，从而允许激光二极管的高精度温度控制。

    Semiconductor laser module
    3.
    发明授权
    Semiconductor laser module 失效
    半导体激光模块

    公开(公告)号：US5751877A

    公开(公告)日：1998-05-12

    申请号：US621092

    申请日：1996-03-22

    申请人： Tetsuo Ishizaka ,  Toshio Ohya ,  Shunichi Satoh ,  Noboru Sonetsuji ,  Manabu Komiyama

    发明人： Tetsuo Ishizaka ,  Toshio Ohya ,  Shunichi Satoh ,  Noboru Sonetsuji ,  Manabu Komiyama

    IPC分类号： G02B6/42 ,  G02B6/36

    CPC分类号： G02B6/4237 ,  G02B6/4204

    摘要： A semiconductor laser module includes a semiconductor laser assembly formed by containing a semiconductor laser in a package, a lens assembly fixed by welding to the package of the semiconductor laser assembly, and a fiber assembly fixed by welding to the lens assembly. The semiconductor laser assembly includes a base fixed to the package and a carrier fixed to the base. The semiconductor laser is mounted on the carrier. A lens holder of the lens assembly is spot-welded to the package at a plurality of positions set below the upper surface of the base.

    摘要翻译： 半导体激光器模块包括通过在封装中容纳半导体激光器而形成的半导体激光器组件，通过焊接固定到半导体激光器组件的封装的透镜组件，以及通过焊接固定到透镜组件的光纤组件。 半导体激光器组件包括固定到封装的基座和固定到基座的载体。 半导体激光器安装在载体上。 透镜组件的透镜保持器在设置在基座的上表面下方的多个位置处点焊到封装。