摘要:
A deposition rate monitor device for monitoring the deposition rate of a vapor on a substrate is provided, including: a piezoelectric crystal monitor device including a piezoelectric crystal monitor provided in a housing, wherein the housing includes a vapor inlet aperture, and at least one elongated shielding device having a first end and a second end, the first end encompassing the vapor inlet aperture.
摘要:
An arrangement for the regulation of a gas stream or the like is provided, which comprises at least one vaporizer crucible for the vaporization of a material or at least one supply container with material vapor. The vaporized material or the material vapor is conducted via a vapor conduit to a substrate. The at least one vaporizer crucible or the at least one supply container is connected via a dosing pipe with the vapor conduit. A tappet projects into the dosing pipe. By means of a regulator the position of the tappet in the dosing pipe is regulated as a function of a measured variable.
摘要:
The invention refers to an evaporation source for depositing of thin layers on substrates, the evaporation source comprising a vapor distribution system having an evaporation pipe made of inorganic non metallic material, with the evaporation pipe having at least one nozzle, wherein the nozzle is disposed in a nozzle element which is made as a separate component being arranged in a nozzle element opening of the evaporation pipe.
摘要:
A deposition system for alkali and alkaline earth metals may include a metal sputter target including cooling channels, a substrate holder configured to hold a substrate facing and parallel to the metal sputter target, and multiple power sources configured to apply energy to a plasma ignited between the substrate and the metal sputter target. The target may have a cover configured to fit over the target material, the cover may include a handle for automated removal and replacement of the cover within the deposition system, and a valve for providing access to the volume between the target material and the cover for pumping, purging or pressurizing the gas within the volume. Sputter gas may include noble gas with an atomic weight less than that of the metal target.