Device for machining an object by means of laser radiation
    1.
    发明授权
    Device for machining an object by means of laser radiation 有权
    用于通过激光辐射加工物体的装置

    公开(公告)号:US09498844B2

    公开(公告)日:2016-11-22

    申请号:US11632363

    申请日:2005-07-12

    摘要: The invention relates to a device for machining an object by laser radiation, in particular by using the photodisruption method. Said device comprises an observation device for imaging the object and a laser scanning device by which the laser radiation is passed over a predetermined sector of the object for scanning said sector. According to the invention, such a device includes the observation device with a first lens for imaging the object; the laser scanning device with a second lens, through which the laser radiation is guided, in which both lenses with regard to the dimension of the regions to be produced in the images and/or with regard to their focal intercept are different from each other. This invention alternately images the respective region of the object in a first operating mode by the first lens and in a second operating mode by the second lens. It is thus possible to use in both operating modes a lens adapted to the intended imaging purpose.

    摘要翻译: 本发明涉及一种用于通过激光辐射加工物体的装置,特别是通过使用光致破坏方法。 所述装置包括用于使物体成像的观察装置和激光扫描装置,通过该激光扫描装置,激光辐射通过用于扫描所述扇区的物体的预定扇区。 根据本发明,这种装置包括具有用于对物体成像的第一透镜的观察装置; 具有第二透镜的激光扫描装置,激光辐射通过该第二透镜被引导,其中关于要在图像中产生的区域的尺寸和/或关于它们的焦距截距的两个透镜彼此不同。 本发明通过第一透镜在第一操作模式下以第二操作模式交替地对物体的各个区域进行成像。 因此,可以在两种操作模式中使用适合于预期成像目的的镜片。

    Device for Machining an Object by Means of Laser Radiation
    2.
    发明申请
    Device for Machining an Object by Means of Laser Radiation 有权
    通过激光辐射加工物体的装置

    公开(公告)号:US20080058734A1

    公开(公告)日:2008-03-06

    申请号:US11632363

    申请日:2005-07-12

    摘要: The invention relates to a device for machining an object by laser radiation, in particular by using the photodisruption method. Said device comprises an observation device for imaging the object and a laser scanning device by which the laser radiation is passed over a predetermined sector of the object for scanning said sector. According to the invention, such a device includes the observation device with a first lens for imaging the object; the laser scanning device with a second lens, through which the laser radiation is guided, in which both lenses with regard to the dimension of the regions to be produced in the images and/or with regard to their focal intercept are different from each other. This invention alternately images the respective region of the object in a first operating mode by the first lens and in a second operating mode by the second lens. It is thus possible to use in both operating modes a lens adapted to the intended imaging purpose.

    摘要翻译: 本发明涉及一种用于通过激光辐射加工物体的装置,特别是通过使用光致破坏方法。 所述装置包括用于使物体成像的观察装置和激光扫描装置,通过该激光扫描装置,激光辐射通过用于扫描所述扇区的物体的预定扇区。 根据本发明,这种装置包括具有用于对物体成像的第一透镜的观察装置; 具有第二透镜的激光扫描装置,激光辐射通过该第二透镜被引导,其中关于要在图像中产生的区域的尺寸和/或关于它们的焦距截距的两个透镜彼此不同。 本发明通过第一透镜在第一操作模式下以第二操作模式交替地对物体的各个区域进行成像。 因此,可以在两种操作模式中使用适合于预期成像目的的镜片。

    Scanning Device
    3.
    发明申请
    Scanning Device 有权
    扫描设备

    公开(公告)号:US20080186551A1

    公开(公告)日:2008-08-07

    申请号:US11579791

    申请日:2006-03-09

    IPC分类号: G02B26/08

    摘要: The invention concerns a scanning device for focusing a beam of rays in defined regions of a defined volume, comprising an input optics wherein the beam of rays penetrates first, having at least one first optical element; a focusing optics for focusing the beam of rays exiting from the input optics; and a deflecting device arranged between the first optical element and the focusing optics, for deflecting the beam of rays after it has passed through the first optical element, based on a position of the focus to be adjusted in lateral direction. In order to adjust the position of the focus of the beam of rays in the direction of the beam of rays, and optical element of the input optics can be displaced relative to the deflecting device.

    摘要翻译: 本发明涉及一种用于将光束聚焦在限定体积的限定区域中的扫描装置,包括输入光学器件,其中光束首先穿透,具有至少一个第一光学元件; 用于聚焦从输入光学器件出射的光束的聚焦光学器件; 以及设置在所述第一光学元件和所述聚焦光学器件之间的偏转装置,用于基于要在横向方向上调节的焦点的位置,使所述光束在其经过所述第一光学元件之后偏转。 为了调整光束的焦点在光束方向上的位置,并且输入光学元件的光学元件可以相对于偏转装置移位。

    Femtosecond laser scanning device
    4.
    发明授权
    Femtosecond laser scanning device 有权
    飞秒激光扫描装置

    公开(公告)号:US08702770B2

    公开(公告)日:2014-04-22

    申请号:US11579791

    申请日:2006-03-09

    IPC分类号: A61N5/06

    摘要: The invention concerns a scanning device for focusing a beam of rays in defined regions of a defined volume, comprising an input optics wherein the beam of rays penetrates first, having at least one first optical element; a focusing optics for focusing the beam of rays exiting from the input optics; and a deflecting device arranged between the first optical element and the focusing optics, for deflecting the beam of rays after it has passed through the first optical element, based on a position of the focus to be adjusted in lateral direction. In order to adjust the position of the focus of the beam of rays in the direction of the beam of rays, and optical element of the input optics can be displaced relative to the deflecting device.

    摘要翻译: 本发明涉及一种用于将光束聚焦在限定体积的限定区域中的扫描装置,包括输入光学器件,其中光束首先穿透,具有至少一个第一光学元件; 用于聚焦从输入光学器件出射的光束的聚焦光学器件; 以及设置在所述第一光学元件和所述聚焦光学器件之间的偏转装置,用于基于要在横向方向上调节的焦点的位置,使所述光束在其经过所述第一光学元件之后偏转。 为了调整光束的焦点在光束方向上的位置,并且输入光学元件的光学元件可以相对于偏转装置移位。

    Laser slit lamp with laser radiation source
    5.
    发明授权
    Laser slit lamp with laser radiation source 有权
    激光裂隙灯带激光辐射源

    公开(公告)号:US06872202B2

    公开(公告)日:2005-03-29

    申请号:US10043463

    申请日:2002-01-10

    摘要: A laser slit lamp comprising a slit lamp base, a slit lamp head and a slit lamp microscope. The laser slit lamp is connected with an applicator. It comprises a device for uniting radiation from at least two radiation sources collinearly and for directing the radiation of a treatment beam or working beam onto the location to be treated in or on the eye of a patient, a device for generating a target beam or marking beam for targeting and observing the location to be treated in or on the eye, and an adjusting device in the applicator for changing the intensity and diameter of the working beam spot used for treatment. The radiation sources are laser radiation sources arranged in the slit lamp head, in the slit lamp base or in the slit lamp microscope for generating the working beam, illumination beam and/or target beam. Devices for control, regulation and monitoring are likewise arranged in the interior of the slit lamp.

    摘要翻译: 一种激光裂隙灯,包括狭缝灯座,裂隙灯头和裂隙灯显微镜。 激光裂隙灯与施加器连接。 它包括用于将来自至少两个辐射源的辐射并联并用于将治疗光束或工作光束的辐射引导到患者眼中或眼睛上待处理的位置的装置,用于产生目标光束或标记 用于瞄准和观察在眼睛中或眼睛上待处理的位置的光束,以及用于改变用于治疗的作用光束斑点的强度和直径的施加器中的调节装置。 辐射源是布置在裂隙灯头,裂隙灯底座或狭缝灯显微镜中用于产生工作光束,照明光束和/或目标光束的激光辐射源。 用于控制,调节和监视的装置同样设置在裂隙灯的内部。

    Method and apparatus for precision working of material
    8.
    发明申请
    Method and apparatus for precision working of material 有权
    材料精密加工的方法和装置

    公开(公告)号:US20080147052A1

    公开(公告)日:2008-06-19

    申请号:US12012405

    申请日:2008-02-01

    IPC分类号: A61F9/008 A61B18/20

    摘要: A method for precise working of material, particularly organic tissue, comprises the step of providing laser pulses with a pulse length between 50 fs and 1 ps and with a pulse frequency from 50 kHz to 1 MHz and with a wavelength between 600 and 2000 nm for acting on the material to be worked. Apparatus, in accordance with the invention, for precise working of material, particularly organic tissue comprising a pulsed laser, wherein the laser has a pulse length between 50 fs and 1 ps and with a pulse frequency of from 50 kHz to 1 MHz is also described.

    摘要翻译: 材料,特别是有机组织的精确加工的方法包括以下步骤:提供脉冲长度在50fs和1ps之间,脉冲频率为50kHz至1MHz,波长在600和2000nm之间的激光脉冲 对待工作的材料采取行动。 还描述了根据本发明的用于精确加工材料,特别是包括脉冲激光的有机组织的装置,其中激光器具有在50fs和1ps之间的脉冲长度以及50kHz至1MHz的脉冲频率 。

    Contact element for laser machining
    9.
    发明授权
    Contact element for laser machining 有权
    激光加工接触元件

    公开(公告)号:US09265658B2

    公开(公告)日:2016-02-23

    申请号:US10590502

    申请日:2005-01-25

    摘要: An optical contact element for coupling a laser processing device to an object to be processed is described, wherein the laser processing device focuses a scanned laser beam through a surface of the object into a certain region of the object and the contact element comprises an entrance side for receiving the scanned laser radiation and an exit side imparting a defined surface curvature to the surface of the object upon contact therewith, wherein a diffractive optical element is provided on the entrance side, which element reduces the angle of incidence of the laser radiation on the surface of the object.

    摘要翻译: 描述了一种用于将激光加工装置耦合到被加工物体的光学接触元件,其中激光加工装置将扫描的激光束通过物体的表面聚焦到物体的特定区域中,并且接触元件包括入射侧 用于接收所扫描的激光辐射和出射侧,在与物体接触时向物体的表面施加限定的表面曲率,其中在入射侧设置衍射光学元件,该元件降低了激光辐射的入射角 物体的表面。

    Method and apparatus for precision working of material
    10.
    发明授权
    Method and apparatus for precision working of material 有权
    材料精密加工的方法和装置

    公开(公告)号:US08171937B2

    公开(公告)日:2012-05-08

    申请号:US12012405

    申请日:2008-02-01

    IPC分类号: A61B19/00

    摘要: A method for precise working of material, particularly organic tissue, comprises the step of providing laser pulses with a pulse length between 50 fs and 1 ps and with a pulse frequency from 50 kHz to 1 MHz and with a wavelength between 600 and 2000 nm for acting on the material to be worked. Apparatus, in accordance with the invention, for precise working of material, particularly organic tissue comprising a pulsed laser, wherein the laser has a pulse length between 50 fs and 1 ps and with a pulse frequency of from 50 kHz to 1 MHz is also described.

    摘要翻译: 材料,特别是有机组织的精确加工的方法包括以下步骤:提供脉冲长度在50fs和1ps之间,脉冲频率为50kHz至1MHz,波长在600和2000nm之间的激光脉冲 对待工作的材料采取行动。 还描述了根据本发明的用于精确加工材料,特别是包括脉冲激光的有机组织的装置,其中激光器具有在50fs和1ps之间的脉冲长度以及50kHz至1MHz的脉冲频率 。