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公开(公告)号：US5180976A
公开(公告)日：1993-01-19
申请号：US757006
申请日：1991-09-09
IPC分类号： G01R1/04 , G01R31/316
CPC分类号： G01R1/0425 , G01R31/316
摘要： Integrated circuit (IC) packages mounted on a loaded printed circuit board (PCB) are tested by a translator module by first placing a corresponding module over each package. Each module has rows of spring contacts for releasably contacting corresponding electrical leads adjacent opposite sides of the IC package. An upper surface of the module has an array of electrically conductive test pads internally connected to corresponding contacts on the module. The test pads match an array of spring probes in the test unit. The module can be a molded plastic housing with metal leaf spring contacts, or it can comprise a composite flex-circuit material with individual contacts comprising flexible spring-like metalized plastic fingers. Contacts on the test module can releasably engage the leads on the IC package directly, or they can contact separate conductive leads on the PCB adjacent the leads on the IC package. During testing, the spring probes contact the test pads on the test modules and circuit continuity is established via the electrical connections from the spring probes through the modules to the leads adjacent the IC packages. The modules translate dense in-line spacing of leads adjacent the IC packages to the oversized in-line spacing of test pads on the module. In another embodiment, the translator module is attached to a flex-circuit cable coupled to the test system electronics. The translator module is manually placed over each IC package during testing. In a further embodiment, an integrated circuit package contains a built-in test verifier system so that standard test probes can be used to test the package without use of a separate translator module.
摘要翻译： 安装在加载印刷电路板（PCB）上的集成电路（IC）封装由转换器模块测试，首先在每个封装上放置相应的模块。 每个模块具有一排弹簧触点，用于可释放地接触与IC封装相对侧相对应的电引线。 模块的上表面具有内部连接到模块上的相应触点的导电测试焊盘阵列。 测试垫与测试单元中的一组弹簧探针相匹配。 模块可以是具有金属板弹簧触点的模制塑料壳体，或者其可以包括具有包括柔性弹簧状金属化塑料指状物的单独触头的复合柔性电路材料。 测试模块上的触点可以直接可释放地接合IC封装上的引线，或者它们可以接触与IC封装上引线相邻的PCB上分开的导电引线。 在测试期间，弹簧探头接触测试模块上的测试焊盘，并通过从弹簧探头通过模块到邻近IC封装的引线的电气连接建立电路连续性。 这些模块将紧邻IC封装的引线的密集在线间距转换为模块上测试焊盘的过大的在线间距。 在另一个实施例中，翻译器模块连接到耦合到测试系统电子装置的柔性电路电缆。 翻译器模块在测试期间手动放置在每个IC封装上。 在另一实施例中，集成电路封装包含内置的测试验证器系统，使得可以使用标准测试探针来测试封装而不使用单独的转换器模块。
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公开(公告)号：US5444387A
公开(公告)日：1995-08-22
申请号：US196588
申请日：1994-02-10
IPC分类号： G01R1/04 , G01R31/316 , G01R31/00
CPC分类号： G01R1/0425 , G01R31/316
摘要： Integrated circuit (IC) packages mounted on a loaded printed circuit board (PCB) are tested by a translator module by first placing a corresponding module over each package. Each module has rows of spring contacts for releasably contacting corresponding electrical leads adjacent opposite sides of the IC package. An upper surface of the module has an array of electrically conductive test pads internally connected to corresponding contacts on the module. The test pads match an array of spring probes in the test unit. The module can be a molded plastic housing with metal leaf spring contacts, or it can comprise a composite flex-circuit material with individual contacts comprising flexible spring-like metalized plastic fingers. Contacts on the test module can releasably engage the leads on the IC package directly, or they can contact separate conductive leads on the PCB adjacent the leads on the IC package. During testing, the spring probes contact the test pads on the test modules and circuit continuity is established via the electrical connections from the spring probes through the modules to the leads adjacent the IC packages. The modules translate dense in-line spacing of leads adjacent the IC packages to the oversized in-line spacing of test pads on the module. In another embodiment, the translator module is attached to a flex-circuit cable coupled to the test system electronics. The translator module is manually placed over each IC package during testing. In a further embodiment, an integrated circuit package contains a built-in test verifier system so that standard test probes can be used to test the package without use of a separate translator module.
摘要翻译： 安装在加载印刷电路板（PCB）上的集成电路（IC）封装由转换器模块测试，首先在每个封装上放置相应的模块。 每个模块具有一排弹簧触点，用于可释放地接触与IC封装相对侧相对应的电引线。 模块的上表面具有内部连接到模块上的相应触点的导电测试焊盘阵列。 测试垫与测试单元中的一组弹簧探针相匹配。 模块可以是具有金属板弹簧触点的模制塑料壳体，或者其可以包括具有包括柔性弹簧状金属化塑料指状物的单独触头的复合柔性电路材料。 测试模块上的触点可以直接可释放地接合IC封装上的引线，或者它们可以接触与IC封装上引线相邻的PCB上分开的导电引线。 在测试期间，弹簧探头接触测试模块上的测试焊盘，并通过从弹簧探头通过模块到邻近IC封装的引线的电气连接建立电路连续性。 这些模块将紧邻IC封装的引线的密集在线间距转换为模块上测试焊盘的过大的在线间距。 在另一个实施例中，翻译器模块连接到耦合到测试系统电子装置的柔性电路电缆。 翻译器模块在测试期间手动放置在每个IC封装上。 在另一实施例中，集成电路封装包含内置的测试验证器系统，使得可以使用标准测试探针来测试封装而不使用单独的转换器模块。
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3.发明授权
公开(公告)号：US5247246A
公开(公告)日：1993-09-21
申请号：US698724
申请日：1991-05-10
IPC分类号： G01R1/04 , G01R31/316 , G01R31/00
CPC分类号： G01R31/316 , G01R1/0425
摘要： Integrated circuit (IC) packages mounted on a loaded printed circuit board (PCB) are tested by a translator module by first placing a corresponding module over each package. Each module has rows of spring contacts for releasably contacting corresponding electrical leads adjacent opposite sides of the IC package. An upper surface of the module has an array of electrically conductive test pads internally connected to corresponding contacts on the module. The test pads match an array of spring probes in the test unit. The module can be a molded plastic housing with metal leaf spring contacts, or it includes a composite flex-circuit material with individual contacts including flexible spring-like metalized plastic fingers. Contacts on the test module can releasably engage the leads on the IC package directly, or they contact separate conductive leads on the PCB adjacent the leads on the IC package. During testing, the spring probes contact the test pads on the test modules and circuit continuity is established via the electrical connections from the spring probes through the modules to the leads adjacent the IC packages. The modules translate dense in-line spacing of leads adjacent the IC packages to the oversized in-line spacing of test pads on the module. The translator module is attached to a flex-circuit cable coupled to the test system electronics. The translator module is manually placed over each IC package during testing.
摘要翻译： 安装在加载印刷电路板（PCB）上的集成电路（IC）封装由转换器模块测试，首先在每个封装上放置相应的模块。 每个模块具有一排弹簧触点，用于可释放地接触与IC封装相对侧相对应的电引线。 模块的上表面具有内部连接到模块上的相应触点的导电测试焊盘阵列。 测试垫与测试单元中的一组弹簧探针相匹配。 模块可以是具有金属板弹簧触点的模制塑料壳体，或者其包括具有单独触头的复合柔性电路材料，包括柔性弹簧状金属化塑料指状物。 测试模块上的触点可以直接地与IC封装上的引线相接触，或者它们接触与IC封装上引线相邻的PCB上分开的导电引线。 在测试期间，弹簧探头接触测试模块上的测试焊盘，并通过从弹簧探头通过模块到邻近IC封装的引线的电气连接建立电路连续性。 这些模块将紧邻IC封装的引线的密集在线间距转换为模块上测试焊盘的过大的在线间距。 翻译器模块连接到耦合到测试系统电子装置的柔性电路电缆。 翻译器模块在测试期间手动放置在每个IC封装上。
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公开(公告)号：US5289117A
公开(公告)日：1994-02-22
申请号：US998554
申请日：1992-12-30
IPC分类号： G01R1/04 , G01R31/316 , G01R31/00
CPC分类号： G01R1/0425 , G01R31/316
摘要： Integrated circuit (IC) packages mounted on a loaded printed circuit board (PCB) are tested by a translator module by first placing a corresponding module over each package. Each module has rows of spring contacts for releasably contacting corresponding electrical leads adjacent opposite sides of the IC package. An upper surface of the module has an array of electrically conductive test pads internally connected to corresponding contacts on the module. The test pads match an array of spring probes in the test unit. The module can be a molded plastic housing with metal leaf spring contacts, or it can comprise a composite flex-circuit material with individual contacts comprising flexible spring-like metalized plastic fingers. Contacts on the test module can releasably engage the leads on the IC package directly, or they can contact separate conductive leads on the PCB adjacent the leads on the IC package. During testing, the spring probes contact the test pads on the test modules and circuit continuity is established via the electrical connections from the spring probes through the modules to the leads adjacent the IC packages. The modules translate dense in-line spacing of leads adjacent the IC packages to the oversized in-line spacing of test pads on the module. In another embodiment, the translator module is attached to a flex-circuit cable coupled to the test system electronics. The translator module is manually placed over each IC package during testing. In a further embodiment, an integrated circuit package contains a built-in test verifier system so that standard test probes can be used to test the package without use of a separate translator module.
摘要翻译： 安装在加载印刷电路板（PCB）上的集成电路（IC）封装由转换器模块测试，首先在每个封装上放置相应的模块。 每个模块具有一排弹簧触点，用于可释放地接触与IC封装相对侧相对应的电引线。 模块的上表面具有内部连接到模块上的相应触点的导电测试焊盘阵列。 测试垫与测试单元中的一组弹簧探针相匹配。 模块可以是具有金属板弹簧触点的模制塑料壳体，或者其可以包括具有包括柔性弹簧状金属化塑料指状物的单独触头的复合柔性电路材料。 测试模块上的触点可以直接可释放地接合IC封装上的引线，或者它们可以接触与IC封装上引线相邻的PCB上分开的导电引线。 在测试期间，弹簧探头接触测试模块上的测试焊盘，并通过从弹簧探头通过模块到邻近IC封装的引线的电气连接建立电路连续性。 这些模块将紧邻IC封装的引线的密集在线间距转换为模块上测试焊盘的过大的在线间距。 在另一个实施例中，翻译器模块连接到耦合到测试系统电子装置的柔性电路电缆。 翻译器模块在测试期间手动放置在每个IC封装上。 在另一实施例中，集成电路封装包含内置的测试验证器系统，使得可以使用标准测试探针来测试封装而不使用单独的转换器模块。
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5.发明授权
公开(公告)号：US5049813A
公开(公告)日：1991-09-17
申请号：US427932
申请日：1989-10-25
IPC分类号： G01R1/04 , G01R31/316 , G01R31/00
CPC分类号： G01R1/0425 , G01R31/316
摘要： Integrated circuit (IC) packages mounted on a loaded printed circuit board (PCB) are tested by a translator module by first placing a corresponding module over each package. Each module has rows of spring contacts for releasably contacting corresponding electrical leads adjacent opposite sides of the IC package. An upper surface of the module has an array of electrically conductive test pads internally connected to corresponding contacts on the module. The test pads match an array of spring probes in the test unit. The module can be a molded plastic housing with metal leaf spring contacts, or it can comprise a composite flex-circuit material with individual contacts comprising flexible spring-like metalized plastic fingers. Contacts on the test module can releasably engage the leads on the IC package directly, or they can contact separate conductive leads on the PCB adjacent the leads on the IC package. During testing, the spring probes contact the test pads on the test modules and circuit continuity is established via the electrical connections from the spring probes through the modules to the leads adjacent the IC packages. The modules translate dense in-line spacing of leads adjacent the IC packages to the oversized in-line spacing of test pads on the module. In another embodiment, the translator module is attached to a flex-circuit cable coupled to the test system electronics. The translator module is manually placed over each IC package during testing. In a further embodiment, an integrated circuit package contains a built-in test verifier system so that standard test probes can be used to test the package without use of a separate translator module.
摘要翻译： 安装在加载印刷电路板（PCB）上的集成电路（IC）封装由转换器模块测试，首先在每个封装上放置相应的模块。 每个模块具有一排弹簧触点，用于可释放地接触与IC封装相对侧相对应的电引线。 模块的上表面具有内部连接到模块上的相应触点的导电测试焊盘阵列。 测试垫与测试单元中的一组弹簧探针相匹配。 模块可以是具有金属板弹簧触点的模制塑料壳体，或者其可以包括具有包括柔性弹簧状金属化塑料指状物的单独触头的复合柔性电路材料。 测试模块上的触点可以直接可释放地接合IC封装上的引线，或者它们可以接触与IC封装上引线相邻的PCB上分开的导电引线。 在测试期间，弹簧探头接触测试模块上的测试焊盘，并通过从弹簧探头通过模块到邻近IC封装的引线的电气连接建立电路连续性。 这些模块将紧邻IC封装的引线的密集在线间距转换为模块上测试焊盘的过大的在线间距。 在另一个实施例中，翻译器模块连接到耦合到测试系统电子装置的柔性电路电缆。 翻译器模块在测试期间手动放置在每个IC封装上。 在另一实施例中，集成电路封装包含内置的测试验证器系统，使得可以使用标准测试探针来测试封装而不使用单独的转换器模块。
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公开(公告)号：US5408189A
公开(公告)日：1995-04-18
申请号：US990573
申请日：1992-12-14
IPC分类号： G01R31/02 , G01N21/88 , G01N21/93 , G01N21/956 , G01R1/073 , G01R31/28 , H04N7/18 , G01R1/04
CPC分类号： G01R1/07314 , G01R1/07328 , G01R31/2891
摘要： A test fixture for testing circuit boards includes an array of test probes mounted to a probe plate and held in contact with test points in circuits printed on the board. The circuit array is indexed with respect to a fiducial mark on the board. The fiducial mark is sensed, and an optical reading shows the alignment or misalignment of the test points on the board relative to the probes. The top plate position is adjusted to move the board relative to the probes to correct misalignment. The optical reading indicates movement of the board to a corrected position necessary to align the test points to the probes. Board alignment can be optically sensed by a bore scope and an image enlarger and video probe that produce images of the fiducial mark and a known zero reference point on a video monitor. The zero reference is adjustable electronically during calibration. The top plate is movable by X- and Y-axis drive motors coupled to the fixture base and having separate output shafts for shifting the top plate in X, Y and Z-axis orientations. The drive motors are stopped when alignment is made and the top plate is retained in its fixed position during testing of the board.
摘要翻译： 用于测试电路板的测试夹具包括安装到探针板并与印刷在电路板上的电路中的测试点保持接触的测试探针的阵列。 电路阵列相对于电路板上的基准标记进行索引。 感测到基准标记，并且光学读数显示板上相对于探针的测试点的对准或未对准。 调整顶板位置以使板相对于探针移动以校正未对准。 光学读数指示板的运动到校准位置，以将测试点对准探针。 可以通过孔范围以及在视频监视器上产生基准标记图像和已知零参考点的图像放大器和视频探头来光学检测板对准。 零参考在校准期间可以电子调节。 顶板可以通过联接到固定座的X轴和Y轴驱动马达来移动，并具有用于在X，Y和Z轴方向上移动顶板的单独的输出轴。 当对准时驱动电机停止，并且在板的测试期间顶板保持在其固定位置。
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公开(公告)号：US5321351A
公开(公告)日：1994-06-14
申请号：US648453
申请日：1991-01-31
CPC分类号： G01R1/07314 , G01R1/07328 , G01R31/2891
摘要： A test fixture for testing printed circuit boards includes an array of test probes held in contact with a pattern of test points in a circuit array printed on the circuit board. The circuit array is positioned on the board with respect to a fiducial mark on the board, and a tooling pin hole on the board is aligned with the circuit array. The fixture includes a tooling pin inserted in the tooling pin hole to hold the circuit array in a fixed position relative to the test probes during testing. The fiducial mark is sensed, and an optical reading shows the alignment or misalignment of the test points on the board relative to the probes. The tooling pin is adjusted on the fixture to move the board relative to the probes to correct misalignment. The optical reading indicates movement of the tooling pin and board to a corrected position necessary to align the circuits on the board to the probe field. The alignment of the board on the fixture can be optically sensed by a lens system, fiber optic image conduit, light source, an image enlarger and video probe, removable from the fixture base, that produces images of the fiducial mark and a known zero reference point on a TV monitor. The zero reference is adjustable electronically during calibration. Alignment of the fiducial mark image to the reference point image produces precise alignment of the test probes and the circuit array.
摘要翻译： 用于测试印刷电路板的测试夹具包括与印刷在电路板上的电路阵列中的测试点的图案相接触的测试探针阵列。 电路阵列相对于电路板上的基准标记位于电路板上，电路板上的工具针孔与电路阵列对准。 夹具包括插入工具销孔中的工具销，以在测试期间将电路阵列相对于测试探针固定在固定位置。 感测到基准标记，并且光学读数显示板上相对于探针的测试点的对准或未对准。 在夹具上调整模具销以相对于探头移动板，以校正未对准。 光学读数指示工具销和板移动到校准位置，将校准板上的电路对准探针场。 可以通过透镜系统，光纤图像导管，光源，可从基座移除的图像放大器和视频探头来光学地检测固定器上的板的对准，其产生基准标记的图像和已知的零参考 点在电视监视器上。 零参考在校准期间可以电子调节。 基准标记图像与参考点图像的对准产生测试探针和电路阵列的精确对准。
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公开(公告)号：US5270641A
公开(公告)日：1993-12-14
申请号：US824854
申请日：1992-01-22
CPC分类号： G01R31/2808 , G01R1/07335
摘要： A dual side access test fixture tests circuits on both sides of a printed circuit board. The fixture includes a housing, a lower probe plate in the housing, an array of lower test probes in the lower probe plate for contacting the bottom of the board, an upper probe plate on the housing for moving to a closed position above the board, and an array of upper test probes in the upper probe plate for contacting an upper surface of the board when the upper probe plate closed. A plurality of system interface pins in the housing are electrically connected to the lower test probes. An external upper interface connector mounted over the closed upper probe plate has a plurality of contacts for connection to corresponding upper test probes. Flex cables contained within the upper interface connector conduct test signals from the upper test probes directly to an external electronic circuit tester. A first set of test signals is communicated from the lower test probes through the interface pins to the circuit tester. Separately, a second set of test signals is communicated from the upper test probes through contacts in the upper interface connector to the flex cables and to the circuit tester, via direct electrical connections which circumvent electrical feed-through connections within the interior of the vacuum fixture housing.
摘要翻译： 双面访问测试夹具测试印刷电路板两侧的电路。 所述固定装置包括壳体，所述壳体中的下探针板，所述下探针板中的用于接触所述板底部的下测试探针阵列，所述壳体上的上探针板移动到所述板上方的闭合位置， 以及上部探针板中的上部测试探针的阵列，用于当上部探针板关闭时接触板的上表面。 壳体中的多个系统接口引脚电连接到下部测试探针。 安装在闭合的上探针板上的外部上接口连接器具有用于连接到相应的上测试探针的多个触点。 上部接口连接器中包含的Flex电缆将测试信号从上部测试探头直接传递到外部电子电路测试仪。 第一组测试信号通过接口引脚从下测试探针传送到电路测试仪。 另外，第二组测试信号通过直接电气连接从上部测试探头通过上部接口连接器中的触点传送到柔性电缆和电路测试仪，这些直接电气连接避开了真空夹具内部的电气馈通连接 住房。
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公开(公告)号：US5798654A
公开(公告)日：1998-08-25
申请号：US758911
申请日：1996-12-02
申请人： David R. Van Loan , Mark A. Swart
发明人： David R. Van Loan , Mark A. Swart
CPC分类号： G01R1/07328 , G01R1/07378 , G01R1/07371 , G01R31/2805
摘要： A translator fixture for a grid-type test fixture for testing circuit boards. In regions of the circuit board where test point density exceeds the grid spacing of probes in a grid base the test points are reached by a test module that plugs into the translator fixture and includes a grid pattern of feed-through probes for contacting special tilt pins connected to certain test points in the high density region of the board. Additional test probes, located between the rows and columns of feed-through probes, support special tilt pins for translating the remaining test points in the high density region of the board to contacts on flex circuit-type cables sandwiched on the module and extending to the periphery of the fixture for coupling to contacts on the grid base to communicate with test circuits in the test analyzer. A translator module providing an interface between the bottom of the translator fixture and the grid base includes a translator board overlying the grid base and translating test signals from a high density set of contacts on one side of the board to a standard pattern of contacts on the other side aligned with the test probes on the grid base. A receiver plate overlying the translator board receives tilt pins with a high density spacing and provides compliant connections to the high density pattern of contacts on the translator board.
摘要翻译： 用于测试电路板的网格型测试夹具的翻译夹具。 在电路板的测试点密度超过网格中的探头的网格间距的区域中，测试模块通过插入转换器固定装置的测试模块达到测试点，并且包括用于接触特殊倾斜引脚的馈通探针的格栅图案 连接到板的高密度区域中的某些测试点。 位于馈通探针的行和列之间的附加测试探针支持特殊的倾斜销，用于将板的高密度区域中的剩余测试点转换为夹在模块上的柔性电路型电缆上的触点，并延伸到 固定装置的周边，用于耦合到电网基座上的触点，以与测试分析仪中的测试电路通信。 翻译器模块提供翻译器固定装置的底部和网格之间的界面，包括翻转板，覆盖网格基底，并将来自板的一侧的高密度触点组的测试信号转换成板上的标准接触模式 另一侧与网格上的测试探针对齐。 覆盖翻译板的接收器板接收具有高密度间隔的倾斜销，并提供与转换器板上的高密度接触图案的兼容连接。
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公开(公告)号：US6066957A
公开(公告)日：2000-05-23
申请号：US45232
申请日：1998-03-20
CPC分类号： G01R1/07328 , G01R1/07357 , H01L2924/0002
摘要： A test fixture for a printed circuit board having a pattern of test probes and a fixed probe plate and a top plate adapted for movement toward and away from the probe plate. The probe plate and the top plate have selected patterns of holes for passage of the test probes through the probe plate and the top plate for contacting test points on the printed circuit board which is supported at one end of the test fixture. A probe retention plate is positioned below the top plate in an area of the test probes to prevent the test probes from walking out of the probe plate. The fixture further includes a spacer plate including interface probes to convert the fixture between a wired and a wireless text fixture.
摘要翻译： 一种用于印刷电路板的测试夹具，其具有测试探针和固定探针板的图案以及适于朝向和远离探针板移动的顶板。 探针板和顶板具有用于通过探针板和顶板的孔的图案，用于接触被测试夹具一端支撑的印刷电路板上的测试点。 探针固定板位于测试探针区域的顶板下方，以防止测试探头从探针板走出。 夹具还包括间隔板，其包括用于在有线和无线文本夹具之间转换夹具的接口探针。
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