公开(公告)号：US5930115A

公开(公告)日：1999-07-27

申请号：US54735

申请日：1998-04-03

申请人： Mark S. Tracy ,  Minh H Nguyen ,  Curtis L. Progl

发明人： Mark S. Tracy ,  Minh H Nguyen ,  Curtis L. Progl

IPC分类号： G06F1/20 ,  H01L23/34 ,  H01L23/40 ,  H05K7/20

CPC分类号： H05K7/20727 ,  G06F1/203 ,  G06F1/206 ,  H01L23/34 ,  H01L23/4006 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2023/4087 ,  H01L2924/0002

摘要： A thermal management structure to provide mechanical isolation and heat removal for an unpackaged semiconductor die mounted directly on a printed circuit board substrate. The thermal management structure sandwiches the unpackaged semiconductor die and substrate between two heat sink pieces which are rigidly mounted to the substrate, thereby mechanically isolating the unpackaged semiconductor die and preventing the die from being accidentally touched. The two heat sink pieces further compliantly thermally engage selected sites on the exposed face of the semiconductor die and the surface of the substrate to conductively remove heat away from the substrate. The thermal management structure may also provide electromagnetic shielding which isolates the electromagnetic fields generated by the substrate from electromagnetic fields external to the thermal management structure. The thermal management structure may also thermally engage selected thermally conductive components within an end product to spread the heat more uniformly throughout the system.

摘要翻译： 用于为直接安装在印刷电路板基板上的未封装的半导体管芯提供机械隔离和散热的热管理结构。 热管理结构将未封装的半导体管芯和衬底夹在刚性地安装到衬底的两个散热片之间，从而机械地隔离未封装的半导体管芯并防止管芯被意外触摸。 两个散热片进一步顺从地热接合半导体管芯的暴露表面上的选定部位和衬底的表面，从而导电地移除远离衬底的热量。 热管理结构还可以提供电磁屏蔽，其将由衬底产生的电磁场与热管理结构外部的电磁场隔离。 热管理结构还可以使端部产品内的选定的导热部件热接合，从而在整个系统中更均匀地散热。

公开(公告)号：US07561439B2

公开(公告)日：2009-07-14

申请号：US11261055

申请日：2005-10-28

申请人： Orville H. Orr ,  Edgar Hance ,  Ho M. Lai ,  John D. Nguyen ,  Minh H Nguyen ,  Christian H. Post ,  Karthigan Srinivasan

发明人： Orville H. Orr ,  Edgar Hance ,  Ho M. Lai ,  John D. Nguyen ,  Minh H Nguyen ,  Christian H. Post ,  Karthigan Srinivasan

IPC分类号： H05K7/02 ,  H05K7/14

CPC分类号： H05K7/1441 ,  G06F1/185

摘要： A first slot connector is mounted within a housing of an electronic system and is for connecting to a first plug-in card. A mezzanine board is installed within the housing. A second slot connector is mounted on the mezzanine board for connecting to a second plug-in card. The first and second plug-in cards align with similarly-shaped slot access panels in the electronic system.

摘要翻译： 第一插槽连接器安装在电子系统的壳体内，并用于连接到第一插入卡。 夹层板安装在外壳内。 第二插槽连接器安装在夹层板上，用于连接到第二插入卡。 第一和第二插件卡与电子系统中类似形状的插槽访问面板对齐。

公开(公告)号：US08649167B2

公开(公告)日：2014-02-11

申请号：US13320607

申请日：2009-06-19

申请人： Kapil Rao Ganta Papa Rao Bala ,  Alan B Doerr ,  Minh H Nguyen ,  Kelly K Smith

发明人： Kapil Rao Ganta Papa Rao Bala ,  Alan B Doerr ,  Minh H Nguyen ,  Kelly K Smith

IPC分类号： G06F1/16 ,  H05K5/00 ,  H05K7/00

CPC分类号： G11B33/128

摘要： Apparatus (100) is provided for mounting media drives. Top and bottom frames (102, 104) are coupled together in a pivoting relationship (106, 108). The frames (102, 104) are configured to receive top and bottom media drives, respectively. In a closed position, the top frame (102) fits substantially over the bottom frame (104). In an open position, the top frame (102) pivots away from the bottom frame (104) by a pivot angle (136) sufficient to insert the bottom media drive into or remove the bottom media drive from the bottom tray (104).

摘要翻译： 提供装置（100）用于安装介质驱动器。 顶部和底部框架（102,104）以枢转关系（106,108）耦合在一起。 框架（102,104）分别被配置为分别接收顶部和底部介质驱动器。 在关闭位置，顶部框架（102）基本上配合在底部框架（104）的上方。 在打开位置，顶部框架（102）从底部框架（104）枢转转动角度（136），足以将底部介质驱动器插入底部介质驱动器或从底部托盘（104）移除底部介质驱动器。