公开(公告)号：US08629469B2

公开(公告)日：2014-01-14

申请号：US12812453

申请日：2008-12-22

申请人： Marko Schweighart

发明人： Marko Schweighart

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L2224/48464 ,  H01L2224/48998 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The invention relates to an LED assembly comprising a carrier (T, T′), at least one LED chip (2, 102) which is arranged on the carrier (T, T′), the LED chip (2, 102) being connected to at least one bonding wire (3, 103), a transparent layer (8, 108) applied over the LED chip (2, 102) and a frame (4, 104) which surrounds the at least one LED chip (2, 102). The frame (4, 104) comprises at least one web (5, 105) so as to divide the frame (4, 104) into at least a first frame region (6, 106), which comprises the at least one LED chip (2, 102), and at least a second frame region (7, 107). The first frame region (6, 106) laterally delimits the layer (8, 108) and the second frame region (7, 107) forms a protective region for the at least one bonding wire (3, 103). By means of the assembly according to the invention, an LED assembly can be achieved which is of simple construction, can be easily assembled and also effectively protects the bonding wires against mechanical influences.

摘要翻译： 本发明涉及一种包括载体（T，T'），布置在载体（T，T'）上的至少一个LED芯片（2,102）的LED组件，所述LED芯片（2,102）被连接 至少一个接合线（3,103），施加在所述LED芯片（2,102）上的透明层（8,108）和围绕所述至少一个LED芯片（2,102）的框架（4,104） ）。 框架（4,104）包括至少一个腹板（5,105），以将框架（4,104）分成至少一个第一框架区域（6,106），该第一框架区域包括至少一个LED芯片 2,102）和至少第二框架区域（7,107）。 第一框架区域（6,106）横向限定层（8,108），并且第二框架区域（7,107）形成用于至少一个接合线（3,103）的保护区域。 通过根据本发明的组件，可以实现一种简单结构的LED组件，可以容易地组装，并且还有效地保护接合线免受机械影响。

公开(公告)号：US20110186885A1

公开(公告)日：2011-08-04

申请号：US12812453

申请日：2008-12-22

申请人： Marko Schweighart

发明人： Marko Schweighart

IPC分类号： H01L33/50 ,  H01L33/62

CPC分类号： H01L33/62 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L2224/48464 ,  H01L2224/48998 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The invention relates to an LED assembly comprising a carrier (T, T′), at least one LED chip (2, 102) which is arranged on the carrier (T, T′), the LED chip (2, 102) being connected to at least one bonding wire (3, 103), a transparent layer (8, 108) applied over the LED chip (2, 102) and a frame (4, 104) which surrounds the at least one LED chip (2, 102). The frame (4, 104) comprises at least one web (5, 105) so as to divide the frame (4, 104) into at least a first frame region (6, 106), which comprises the at least one LED chip (2, 102), and at least a second frame region (7, 107). The first frame region (6, 106) laterally delimits the layer (8, 108) and the second frame region (7, 107) forms a protective region for the at least one bonding wire (3, 103). By means of the assembly according to the invention, an LED assembly can be achieved which is of simple construction, can be easily assembled and also effectively protects the bonding wires against mechanical influences.

摘要翻译： 本发明涉及一种包括载体（T，T'），布置在载体（T，T'）上的至少一个LED芯片（2,102）的LED组件，所述LED芯片（2,102）被连接 至少一个接合线（3,103），施加在所述LED芯片（2,102）上的透明层（8,108）和围绕所述至少一个LED芯片（2,102）的框架（4,104） ）。 框架（4,104）包括至少一个腹板（5,105），以将框架（4,104）分成至少一个第一框架区域（6,106），该第一框架区域包括至少一个LED芯片 2,102）和至少第二框架区域（7,107）。 第一框架区域（6,106）横向限定层（8,108），并且第二框架区域（7,107）形成用于至少一个接合线（3,103）的保护区域。 通过根据本发明的组件，可以实现一种简单结构的LED组件，可以容易地组装，并且还有效地保护接合线免受机械影响。