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23 条记录 (耗时 0.03 秒)

    Management system for multiple cables
    1.
    发明授权
    Management system for multiple cables 失效
    多条电缆管理系统

    公开(公告)号：US06675720B2

    公开(公告)日：2004-01-13

    申请号：US09944642

    申请日：2001-08-31

    申请人： Martha G. Peterson ,  Brent A. Boudreaux ,  Patrick Wesley Clark ,  Scott Stuart Smith ,  Michael Jay Zalta ,  Lee Thomas Van Laren

    发明人： Martha G. Peterson ,  Brent A. Boudreaux ,  Patrick Wesley Clark ,  Scott Stuart Smith ,  Michael Jay Zalta ,  Lee Thomas Van Laren

    IPC分类号： B61B1210

    CPC分类号： H02G11/00

    摘要： A cable management system includes an opposed pair of articulated A-frame support assemblies that are connected by a cable support platform, such as a roller. The A-frame support assemblies may be reach between an electrical system chassis and an equipment rack in a manner that permits the elevation of the cable support platform to change concomitant with extensile and de-extensile motion of the electrical system chassis relative to the equipment rack. This change in elevation manages slack in the cable to feed cable forwardly during extensile motion of the electrical system chassis and to pull cable rearwardly with de-extensile motion.

    摘要翻译： 电缆管理系统包括相对的一对铰接的A形框架支撑组件，其通过诸如辊子的电缆支撑平台连接。 A框架支撑组件可以以允许电缆支撑平台的升高改变的方式到达电气机箱和设备机架之间，同时伴随着电气系统机架相对于设备机架的伸展和不可伸展的运动 。 这种升高的变化管理电缆松弛，以在电气系统底盘的伸展运动期间向前馈送电缆，并且以不可伸展的运动向后拉电缆。

    Power module for multi-chip printed circuit boards
    6.
    发明授权
    Power module for multi-chip printed circuit boards 失效
    多芯片印刷电路板电源模块

    公开(公告)号：US06771507B1

    公开(公告)日：2004-08-03

    申请号：US10355707

    申请日：2003-01-31

    申请人： Christian L. Belady ,  Shaun L. Harris ,  Gary Wayne Williams ,  Brent A. Boudreaux

    发明人： Christian L. Belady ,  Shaun L. Harris ,  Gary Wayne Williams ,  Brent A. Boudreaux

    IPC分类号： H05H720

    CPC分类号： H01L23/4338 ,  H01L23/4006 ,  H01L2924/0002 ,  H05K1/0204 ,  H01L2924/00

    摘要： A power module assembly for multi-chip printed circuit boards: A heat distribution plate has first and second fields of receptacles integrally formed therein. The receptacles are populated with first and second fields of thermally-conductive pins. A power module printed circuit board is mounted to the heat distribution plate and has first and second clearance holes formed therein. The first and second fields of pins protrude through the first and second clearance holes. A multi-chip printed circuit board may be mounted underneath the power module such that the thermally-conductive pins contact a surface of first and second supplied chips. The supplied chips are physically close to the power module, and thermal management for the supplied chips is provided by virtue of contact between the supplied chips and the thermally-conductive pins. Space on the multi-chip printed circuit board is conserved.

    摘要翻译： 一种用于多芯片印刷电路板的功率模块组件：散热板具有一体地形成在其中的第一和第二接地部分。 插座上装有第一和第二导热销。 功率模块印刷电路板安装在配热板上，并在其中形成有第一和第二间隙孔。 销的第一和第二领域突出穿过第一和第二间隙孔。 多芯片印刷电路板可以安装在功率模块的下方，使得导热针接触第一和第二提供芯片的表面。 提供的芯片在物理上靠近电源模块，并且借助于所提供的芯片和导热引脚之间的接触来提供所提供的芯片的热管理。 多芯片印刷电路板上的空间是保守的。

    High surface area heat sink
    9.
    发明授权
    High surface area heat sink 失效
    高表面积散热片

    公开(公告)号：US07028754B2

    公开(公告)日：2006-04-18

    申请号：US10832963

    申请日：2004-04-26

    申请人： Brent A. Boudreaux

    发明人： Brent A. Boudreaux

    IPC分类号： F28F7/02

    CPC分类号： H01L23/367 ,  F28F3/02 ,  F28F7/02 ,  F28F2255/08 ,  F28F2255/16 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat sink is built including a three dimensional array of cylindrical openings for air to flow through instead of fins. By having a larger surface area than heat sinks with fins, this high surface area heat sink results in increased heat transfer to the surrounding air than a similarly sized heat sink with fins. Heat sinks including an array of cylindrical openings may be manufactured through extrusion, stamping, and other common techniques.

    摘要翻译： 建立了散热器，其包括用于空气流过而不是翅片的三维阵列的圆柱形开口。 通过具有比具有散热片的散热片更大的表面积，这种高表面积散热器导致与具有翅片的相似尺寸的散热器相比，增加到周围空气的热传递。 包括圆柱形开口阵列的散热片可以通过挤出，冲压和其它常用技术制造。

    Adjustable pedestal thermal interface
    10.
    发明授权
    Adjustable pedestal thermal interface 失效
    可调基座热接口

    公开(公告)号：US06695042B1

    公开(公告)日：2004-02-24

    申请号：US10209981

    申请日：2002-07-31

    申请人： Brent A. Boudreaux ,  Stacy Fraker ,  Eric C. Peterson ,  Christian L. Belady

    发明人： Brent A. Boudreaux ,  Stacy Fraker ,  Eric C. Peterson ,  Christian L. Belady

    IPC分类号： F28D1500

    CPC分类号： F28F13/00 ,  F28F2013/006 ,  H01L21/4882 ,  H01L23/4338 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/49353 ,  H01L2924/00

    摘要： A heat sink is constructed including at least one thermally conductive pedestal, allowing configuration of the heat sink to make contact with a plurality of heat-generating electronic devices where the devices may not be co-planar due to tolerance stack-up. The pedestals may be raised and lowered and tilted as needed to match the heights and tilts of the electronic devices. Within the heat sink is a cavity above the pedestal that may be filled with a thermally conductive material, such as solder, or a thermally conductive liquid, during construction to create a low thermal resistance contact between the pedestal and the heat sink fins. Also, thermally conductive material, such as thermal paste or a thermal pad, may be used between the heat generating device and the pedestal to create a low thermal resistance contact.

    摘要翻译： 构造了散热器，其包括至少一个导热基座，允许散热器的配置与多个发热电子器件接触，其中由于公差叠加，器件可能不是共面的。 基座可以根据需要升高和降低并倾斜以匹配电子设备的高度和倾斜度。 在散热器内部是在基座上方的空腔，其可以在构造期间填充有导热材料，例如焊料或导热液体，以在基座和散热鳍片之间产生低热阻接触。 此外，可以在发热装置和基座之间使用导热材料，例如热膏或热垫，以产生低热阻接触。