摘要:
A method and system for packaging a computer system is disclosed. The computer system is capable of including a plurality of blades, a first plurality of devices, and a second plurality of devices. The method and system include providing a chassis having a first cavity, a first plenum, a second plenum and a common plenum therein. The first cavity retains the blades in parallel. The chassis is configured such that air sufficient to cool the blades is drawn into the chassis and through the blades. The first plenum is configured such that a first portion of the air sufficient to cool the first plurality of devices is drawn from the blades into the first plenum, through the first plurality of devices and into the common plenum. The second plenum is configured in an analogous manner for the second plurality of devices. The common plenum is configured such that a remaining portion of the air from the blades is drawn into the common plenum, and such that the first and second portions of the air are received into the common plenum from the first and second plurality of devices, respectively.
摘要:
Apparatus and method are provided for facilitating liquid cooling one or more components of an electronic subsystem chassis disposed within an electronics rack. The apparatus includes a rack-level coolant manifold assembly and at least one movable chassis-level manifold subassembly. The rack-level coolant manifold assembly includes a rack-level inlet manifold and a rack-level outlet manifold, and each movable chassis-level manifold subassembly includes a chassis-level coolant inlet manifold coupled in fluid communication with the rack-level inlet manifold, and a chassis-level coolant outlet manifold coupled in fluid communication with the rack-level outlet manifold. The chassis-level manifold subassembly is slidably coupled to the electronics rack to facilitate access to one or more removable components of the electronic subsystem chassis. In one embodiment, the electronics subsystem chassis is a multi-blade center system having multiple removable blades, each blade being an electronics subsystem.
摘要:
A computer system includes a plurality of subsystems cooled by a cooling flow; at least one redirection device, a management module, and a blower for generating the cooling flow. The redirection device is associated with at least one subsystem and operable to redirect at least a portion of the cooling flow away from the subsystem. The subsystems, the at least one redirection device, and the blower are disposed along a common cooling flow path. The management module is configured to determine cooling requirements of the subsystems and to control the operation of the blower and the at least one redirection device to maintain a specified amount of cooling to the subsystems and to reduce acoustical noise generated by the blower.
摘要:
An embodiment of a computer rack is capable of supporting up to 48U of electronic devices, including a central rack space for up to 42U and six 1U side bays. The side bays are fully accessible from the rear of the rack, so that all of the components may be serviced without pulling the rack out from a row and removing side panels. Optional strip PDUs may be mounted at the rear. The rack complies with standard dimensions for a 19-inch rack, including standard vertical and horizontal rail dimensions, and fits on a standard 600 mm×1200 mm floor tile.
摘要:
Techniques are disclosed for managing a switch fabric. In one embodiment, a server system is provided that includes a midplane, one or more server cards, switch modules and a management controller. The midplane may include a fabric interconnect for a switch fabric. The one or more server cards and the switch modules may be operatively connected to the midplane. The switch modules may be configured to switch network traffic for the one or more server cards. The management controller may be configured to manage the switch modules via the fabric interconnect.
摘要:
An embodiment of a computer rack is capable of supporting up to 48U of electronic devices, including a central rack space for up to 42U and six 1U side bays. The side bays are fully accessible from the rear of the rack, so that all of the components may be serviced without pulling the rack out from a row and removing side panels. Optional strip PDUs may be mounted at the rear. The rack complies with standard dimensions for a 19-inch rack, including standard vertical and horizontal rail dimensions, and fits on a standard 600 mm×1200 mm floor tile.
摘要:
A design structure embodied in a machine readable storage medium for designing, manufacturing, and/or testing a memory module system and DIMM connector is provided. A DIMM connector includes a plurality of DIMM sockets for receiving a corresponding plurality of DIMMs in a radially oriented, angularly spaced orientation. The DIMM sockets are connected in parallel at a memory module junction so that socket terminals of each DIMM socket are joined to the same relative terminal of all the other DIMM sockets along electronic pathways of substantially equal length. A memory controller selectively communicates with the DIMMs via the DIMM junction. By virtue of the improved topology, impedance within the DIMM connector may be better matched to minimize reflections and improve signal quality.
摘要:
A computer system includes a plurality of blade servers, a midplane, a supplemental midplane, and a peripheral device separate from the blade servers. The midplane includes a plurality of connectors connecting the midplane to the plurality of blade servers. The supplemental midplane is separate from the midplane and includes a body, a plurality of connectors, and a peripheral connector. The plurality of connectors are attached to the body and connect the supplemental midplane to the plurality of blade servers. The peripheral connector is attached to the body and connects the supplemental midplane to the peripheral device. The plurality of connectors of the supplemental midplane communicate with the peripheral connector of the supplemental midplane. The plurality of connectors of the supplemental midplane are configured to be removably connectable to the midplane.
摘要:
A latch selectively secures a compute node enclosure into a chassis bay. The latch comprises a frame securable to a proximal end of the compute node enclosure. A handle is pivotally secured to the frame intermediate a proximal end of the handle and a distal end of the handle so that the handle can be pivoted between a closed position and an open position. A proximal end of a pawl is pivotally coupled at to the distal end of the handle, wherein the pawl includes a landing at a distal end of the pawl and a latch key intermediate proximal and distal ends of the pawl. Movement of the handle positions the pawl into engagement with a slot in chassis bay to assist installation and removal of the compute node enclosure.
摘要:
Techniques are disclosed for reducing impact of a repair action in a switch fabric. In one embodiment, a server system is provided that includes a first interposer card that operatively connects one or more server cards to a midplane. The first interposer card may include a switch module that switches network traffic for the one or more server cards. The first interposer card may be hot-swappable from the midplane, and the one or more server cards may be hot-swappable from the first interposer card.