公开(公告)号：US06876264B2

公开(公告)日：2005-04-05

申请号：US10636151

申请日：2003-08-07

申请人： Masaaki Arai ,  Masakazu Nishiwaki

发明人： Masaaki Arai ,  Masakazu Nishiwaki

IPC分类号： H03B5/32 ,  H03H9/02 ,  H03H9/05 ,  H03H9/10 ,  H03B5/36

CPC分类号： H03H9/1021 ,  H03H9/0547

摘要： A surface-mount quartz crystal oscillator has a casing having a recess defined therein, a quartz crystal blank fixedly mounted on the bottom of the recess, and an IC (Integrated Circuit) chip having an integrated oscillating circuit connected to the crystal blank. The casing has a frame wall which defines the recess. The IC chip has an outer peripheral edge joined to an upper surface of the frame wall. The crystal blank is hermetically sealed in a space surrounded by the casing and the IC chip. IC connecting terminals are disposed on the upper surface of the frame wall for connection to IC terminals on the IC chip.

摘要翻译： 表面贴装石英晶体振荡器具有限定在其中的凹部的壳体，固定地安装在凹部的底部的石英晶体空白以及具有连接到晶体坯的集成振荡电路的IC（集成电路）芯片。 壳体具有限定凹部的框架壁。 IC芯片具有与框架壁的上表面接合的外周边缘。 晶体坯料被封装在由壳体和IC芯片包围的空间内气密密封。 IC连接端子设置在框架壁的上表面上，用于连接IC芯片上的IC端子。

公开(公告)号：US07049174B2

公开(公告)日：2006-05-23

申请号：US10661978

申请日：2003-09-11

申请人： Yasuo Sakaba ,  Masakazu Nishiwaki

发明人： Yasuo Sakaba ,  Masakazu Nishiwaki

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H03H9/0547 ,  G04F5/063 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16195 ,  H01L2924/00014

摘要： A method of manufacturing a mounting substrate accommodating therein an electronic component for use in a surface mount crystal oscillator and adapted to be joined to a bottom surface of a crystal unit has the steps of defining a recess with a bottom wall and a frame wall having an opening, placing the electronic component in the recess, filling the recess with a resin for protecting the electronic component, and, after the resin is cured, removing at least a portion of the frame wall. The electronic component typically comprises an IC (Integrated Circuit) chip incorporating an integrated oscillating circuit that employs a crystal unit.

摘要翻译： 一种制造安装基板的方法，其中容纳有用于表面安装晶体振荡器中并适用于结合到晶体单元的底表面的电子部件的安装基板具有以下步骤：限定具有底壁的凹部和具有 打开，将电子部件放置在凹部中，用用于保护电子部件的树脂填充凹部，并且在树脂固化之后，移除框架壁的至少一部分。 该电子部件通常包括结合采用晶体单元的集成振荡电路的IC（集成电路）芯片。

公开(公告)号：US08466753B2

公开(公告)日：2013-06-18

申请号：US13231917

申请日：2011-09-13

申请人： Hiroyuki Mitome ,  Daisuke Nishiyama ,  Masakazu Nishiwaki ,  Hiroyuki Murakoshi

发明人： Hiroyuki Mitome ,  Daisuke Nishiyama ,  Masakazu Nishiwaki ,  Hiroyuki Murakoshi

IPC分类号： H03B5/30 ,  H03B1/02

CPC分类号： H03H9/0552 ,  H03H9/02102 ,  H03H9/08

摘要： A metal base having plural protrusions at its bottom is engaged with and placed on standing metal pins in plural through holes provided in a base board, and a circuit board is fitted to an upper end of the metal pins. A crystal resonator is arranged on the circuit board via a heater element, and the metal base is covered with a metal cover, thereby obtaining a sealed structure of the crystal resonator. A two-stage counterbored portion including a first-stage and a second-stage counterbored portions is formed in the bottom of the base board, and a solder or conductive resin is filled in a gap between the first-stage counterbored portion formed around the metal pin inserted into the through hole, and the through hole and the metal pin to fix the metal pin in the though hole. Slits penetrating through the base board are formed around the metal pin.

摘要翻译： 在其底部具有多个突起的金属基座与设置在基板中的多个通孔中的立起金属销接合并放置在其中，并且电路板安装到金属销的上端。 晶体谐振器通过加热器元件布置在电路板上，并且金属基底被金属盖覆盖，从而获得晶体谐振器的密封结构。 在基板的底部形成包括第一级和第二级沉孔部分的两级沉孔部分，并且在形成在金属周围的第一级沉积部分之间的间隙中填充焊料或导电树脂 销插入通孔，通孔和金属销将金属销固定在通孔中。 穿过基板的狭缝形成在金属销周围。

公开(公告)号：US08046910B2

公开(公告)日：2011-11-01

申请号：US11823691

申请日：2007-06-28

申请人： Masakazu Nishiwaki ,  Yasuo Sakaba

发明人： Masakazu Nishiwaki ,  Yasuo Sakaba

IPC分类号： H05K3/36

CPC分类号： H03H3/02 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49208 ,  Y10T29/49794

摘要： A method of manufacturing a surface mounted (crystal) device comprising: the steps of providing an aggregated sheet material having a plurality of container main bodies lengthwise and crosswise, accommodating at least a crystal piece inside the concavities of the plurality of container main bodies formed in the aggregated sheet material, and then parting the aggregated sheet material into individual container main bodies. The method further includes: the steps of providing annular grooves on outer perimeters between the container main bodies of the aggregated sheet material; positioning an outer peripheral edge of an electrode roller having an inclined face of a seam welder inside the annular groove; abutting the inclined face against a metal cover tacked to the container main body; bonding the metal cover to an aperture end face of the container main body, by seam welding; and then parting the aggregated sheet material into individual container main bodies.

摘要翻译： 一种制造表面安装（晶体）器件的方法，包括以下步骤：提供具有多个容器主体纵向和横向的聚集片材，至少容纳至少一个晶体片，所述晶体片形成在所述多个容器主体的凹部中 聚集的片材，然后将聚集的片材分离成单独的容器主体。 该方法还包括：在聚集的片材的容器主体之间的外周上设置环形槽的步骤; 将缝焊机的倾斜面的电极辊的外周边缘定位在环形槽内; 将倾斜面抵靠着固定在容器主体上的金属盖; 通过缝焊将金属盖接合到容器主体的孔端面; 然后将聚集的片材分离成单独的容器主体。

公开(公告)号：US20080072420A1

公开(公告)日：2008-03-27

申请号：US11823691

申请日：2007-06-28

申请人： Masakazu Nishiwaki ,  Yasuo Sakaba

发明人： Masakazu Nishiwaki ,  Yasuo Sakaba

IPC分类号： H01R9/00 ,  H01R43/20

CPC分类号： H03H3/02 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49208 ,  Y10T29/49794

摘要： The invention relates to a method of manufacturing a surface mounted (crystal) device comprising: the steps of providing an aggregated sheet material having a plurality of container main bodies lengthwise and crosswise, accommodating at least a crystal piece inside the concavities of the plurality of container main bodies formed in the aggregated sheet material, and then parting the aggregated sheet material into individual container main bodies. The method further includes: the steps of providing annular grooves on outer perimeters between the container main bodies of the aggregated sheet material; positioning an outer peripheral edge of an electrode roller having an inclined face of a seam welder inside the annular groove; abutting the inclined face against a metal cover tacked to the container main body; bonding the metal cover to an aperture end face of the container main body, by seam welding; and then parting the aggregated sheet material into individual container main bodies. The method also relates to an aggregated sheet material used for this method. As a result, positioning of the metal cover with respect to the container main body is simplified, the manufacturing processes are reduced, and a high productivity method of manufacturing surface mounted devices and an aggregated sheet material suitable for this are provided.

摘要翻译： 本发明涉及一种制造表面安装（晶体）器件的方法，包括：提供具有纵向和横向的多个容器主体的聚集片材的步骤，至少容纳多个容器的凹部内的晶体片 主体形成在聚集的片材中，然后将聚集的片材分离成单独的容器主体。 该方法还包括：在聚集的片材的容器主体之间的外周上设置环形槽的步骤; 将缝焊机的倾斜面的电极辊的外周边缘定位在环形槽内; 将倾斜面抵靠着固定在容器主体上的金属盖; 通过缝焊将金属盖接合到容器主体的孔端面; 然后将聚集的片材分离成单独的容器主体。 该方法还涉及用于该方法的聚集片材。 结果，金属盖相对于容器主体的定位变得简单，制造工艺减少，并且提供了适用于此的表面安装装置和聚集片材的高生产率方法。

公开(公告)号：US07276840B2

公开(公告)日：2007-10-02

申请号：US11147661

申请日：2005-06-08

申请人： Masakazu Nishiwaki

发明人： Masakazu Nishiwaki

IPC分类号： H01L41/053

CPC分类号： H05K1/145 ,  H05K1/144 ,  H05K3/3442 ,  H05K2201/10636 ,  Y02P70/611

摘要： The structure provided with a plurality of substrates of the present invention is provided with a plurality of substrates each provided with chip-shaped circuit devices connected by poles also used as electrical wiring. At least one pole connecting the plurality of substrates is also used as one of the circuit devices. Simultaneously, the circuit devices also used as poles are mounted on each substrate in a standing posture.

摘要翻译： 设置有本发明的多个基板的结构设置有多个基板，每个基板均设有与用作电线的极连接的芯片形电路装置。 连接多个基板的至少一个极也被用作电路装置之一。 同时，也用作极点的电路装置以立式姿势安装在每个基板上。

公开(公告)号：US20050275317A1

公开(公告)日：2005-12-15

申请号：US11147661

申请日：2005-06-08

申请人： Masakazu Nishiwaki

发明人： Masakazu Nishiwaki

IPC分类号： H01L41/04 ,  H02N2/00 ,  H05K1/14 ,  H05K3/34

CPC分类号： H05K1/145 ,  H05K1/144 ,  H05K3/3442 ,  H05K2201/10636 ,  Y02P70/611

摘要： The structure provided with a plurality of substrates of the present invention is provided with a plurality of substrates each provided with chip-shaped circuit devices connected by poles also used as electrical wiring. At least one pole connecting the plurality of substrates is also used as one of the circuit devices. Simultaneously, the circuit devices also used as poles are mounted on each substrate in a standing posture.

摘要翻译： 设置有本发明的多个基板的结构设置有多个基板，每个基板均设有与用作电线的极连接的芯片形电路装置。 连接多个基板的至少一个极也被用作电路装置之一。 同时，也用作极点的电路装置以立式姿势安装在每个基板上。