公开(公告)号：US20100044100A1

公开(公告)日：2010-02-25

申请号：US12065042

申请日：2006-08-03

申请人： Masahiro Ono ,  Yosihiro Uda ,  Seiji Yamaguchi ,  Kazuhiro Shinchi ,  Satoru Tomekawa

发明人： Masahiro Ono ,  Yosihiro Uda ,  Seiji Yamaguchi ,  Kazuhiro Shinchi ,  Satoru Tomekawa

IPC分类号： H01L23/28

CPC分类号： H05K3/284 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K7/20463 ,  H05K9/0083 ,  H05K2201/09972 ,  H05K2201/10371 ,  H05K2201/2018 ,  H01L2224/0401

摘要： A substrate structure whereby a resin part for coating a plurality of electronic components by one operation is given a shielding property and the mounting strength of electronic components with respect to the substrate is secured and an electronic device including the substrate structure are provided.A substrate structure 10 includes a substrate 11, a plurality of electronic components 12 mounted along the substrate 11, and a resin part 13 coating each electronic component 12 with a resin 18 while kept in close contact with the substrate 11. The substrate structure 10 includes a frame body 15 surrounding each electronic component 12 while kept in close contact with the substrate 11 and a lid part 17 closing an opening 16 in the frame body 15, and a resin 18 is filled inside the frame body 15.

摘要翻译： 具有通过一次操作涂覆多个电子部件的树脂部件的基板结构被确定，并且确保了电子部件相对于基板的安装强度，并且提供了包括该基板结构的电子设备。 基板结构10包括基板11，沿着基板11安装的多个电子部件12以及与基板11保持紧密接触的，用树脂18涂覆各电子部件12的树脂部13。 同时保持与基板11紧密接触的每个电子部件12的框体15和封闭框体15中的开口16的盖部17，并且树脂18填充在框体15的内部。

公开(公告)号：US20100020497A1

公开(公告)日：2010-01-28

申请号：US12065177

申请日：2006-02-20

申请人： Haruo Hayakawa ,  Masahiro Ono ,  Seiji Yamaguchi ,  Yoshihiro Uda ,  Kazuhiro Shinchi ,  Satoru Tomekawa ,  Kiyoshi Nakanishi ,  Kosuke Kubota ,  Atsushi Katagiri ,  Motohisa Kotani ,  Kazuhiro Konishi ,  Eiji Nishimura ,  Takeo Matsuki

发明人： Haruo Hayakawa ,  Masahiro Ono ,  Seiji Yamaguchi ,  Yoshihiro Uda ,  Kazuhiro Shinchi ,  Satoru Tomekawa ,  Kiyoshi Nakanishi ,  Kosuke Kubota ,  Atsushi Katagiri ,  Motohisa Kotani ,  Kazuhiro Konishi ,  Eiji Nishimura ,  Takeo Matsuki

IPC分类号： H05K7/20 ,  H05K7/00

CPC分类号： H05K3/284 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/0218 ,  H05K1/0274 ,  H05K7/20463 ,  H05K9/0047 ,  H05K9/0086 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/10128 ,  H05K2201/10515 ,  H05K2201/2054 ,  H05K2203/1316 ,  H05K2203/1322 ,  H01L2224/0401

摘要： It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure 20 of the first embodiment is provided with a substrate 21, a plurality of electronic components 22 mounted along the substrate 21, and a resin part 25 that covers the electronic components 22 and is in close contact with the substrate 21. In the substrate structure 20, the resin part 25 is provided with a reinforcing heat discharge layer 26 covering the electronic components 22 and having a heat conductivity and a reinforcing property and a shield layer 27 covering the reinforcing heat discharge layer 26, and a surface o28 of the shield layer 27 is formed into a predetermined shape corresponding to a surface structure of the display device 30 adjacent to the resin part 25.

摘要翻译： 旨在提供确保共同覆盖多个电子部件并能够减小，减薄和减少部件数量的树脂部件的屏蔽性和散热性的基板结构。 第一实施例的基板结构20设置有基板21，沿着基板21安装的多个电子部件22和覆盖电子部件22并与基板21紧密接触的树脂部25。 基板结构体20中，树脂部25设置有覆盖电子部件22并具有导热性和增强性的加强放热层26和覆盖加强放热层26的屏蔽层27以及覆盖加强放热层26的表面o28 屏蔽层27形成为与显示装置30的与树脂部25相邻的表面结构对应的规定形状。

公开(公告)号：US07969741B2

公开(公告)日：2011-06-28

申请号：US12065177

申请日：2006-02-20

申请人： Haruo Hayakawa ,  Masahiro Ono ,  Seiji Yamaguchi ,  Yoshihiro Uda ,  Kazuhiro Shinchi ,  Satoru Tomekawa ,  Kiyoshi Nakanishi ,  Kosuke Kubota ,  Atsushi Katagiri ,  Motohisa Kotani ,  Kazuhiro Konishi ,  Eiji Nishimura ,  Takeo Matsuki

发明人： Haruo Hayakawa ,  Masahiro Ono ,  Seiji Yamaguchi ,  Yoshihiro Uda ,  Kazuhiro Shinchi ,  Satoru Tomekawa ,  Kiyoshi Nakanishi ,  Kosuke Kubota ,  Atsushi Katagiri ,  Motohisa Kotani ,  Kazuhiro Konishi ,  Eiji Nishimura ,  Takeo Matsuki

IPC分类号： H05K7/20

CPC分类号： H05K3/284 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/0218 ,  H05K1/0274 ,  H05K7/20463 ,  H05K9/0047 ,  H05K9/0086 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/10128 ,  H05K2201/10515 ,  H05K2201/2054 ,  H05K2203/1316 ,  H05K2203/1322 ,  H01L2224/0401

摘要： It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure 20 of the first embodiment is provided with a substrate 21, a plurality of electronic components 22 mounted along the substrate 21, and a resin part 25 that covers the electronic components 22 and is in close contact with the substrate 21. In the substrate structure 20, the resin part 25 is provided with a reinforcing heat discharge layer 26 covering the electronic components 22 and having a heat conductivity and a reinforcing property and a shield layer 27 covering the reinforcing heat discharge layer 26, and a surface o28 of the shield layer 27 is formed into a predetermined shape corresponding to a surface structure of the display device 30 adjacent to the resin part 25.

摘要翻译： 旨在提供确保共同覆盖多个电子部件并能够减小，减薄和减少部件数量的树脂部件的屏蔽性和散热性的基板结构。 第一实施例的基板结构20设置有基板21，沿着基板21安装的多个电子部件22和覆盖电子部件22并与基板21紧密接触的树脂部25。 基板结构体20中，树脂部25设置有覆盖电子部件22并具有导热性和增强性的加强放热层26和覆盖加强放热层26的屏蔽层27以及覆盖加强放热层26的表面o28 屏蔽层27形成为与显示装置30的与树脂部25相邻的表面结构对应的规定形状。