摘要:
According to one embodiment, a substrate processing system includes a measuring unit, a data processing unit, and a processing unit. The measuring unit is configured to measure information relating to a thickness dimension of a substrate. The substrate includes a light emitting unit and a wavelength conversion unit. The wavelength conversion unit includes a phosphor. The data processing unit is configured to determine processing information relating to a thickness direction of the wavelength conversion unit based on the measured information relating to the thickness dimension of the substrate and based on information relating to a characteristic of light emitted from the light emitting unit. The processing unit is configured to perform processing of the wavelength conversion unit based on the determined processing information.
摘要:
According to one embodiment, a substrate processing system includes a measuring unit, a data processing unit, and a processing unit. The measuring unit is configured to measure information relating to a thickness dimension of a substrate. The substrate includes a light emitting unit and a wavelength conversion unit. The wavelength conversion unit includes a phosphor. The data processing unit is configured to determine processing information relating to a thickness direction of the wavelength conversion unit based on the measured information relating to the thickness dimension of the substrate and based on information relating to a characteristic of light emitted from the light emitting unit. The processing unit is configured to perform processing of the wavelength conversion unit based on the determined processing information.
摘要:
According to one embodiment, a semiconductor light emitting device includes a light emitting section and a wavelength conversion section. The light emitting section is configured to emit light. The wavelength conversion section is provided on one major surface side of the light emitting section. The wavelength conversion section contains a phosphor. The wavelength conversion section has a distribution of amount of the phosphor based on a distribution of wavelength of the light emitted from the light emitting section.
摘要:
According to one embodiment, a semiconductor light emitting device includes a light emitting section and a wavelength conversion section. The light emitting section is configured to emit light. The wavelength conversion section is provided on one major surface side of the light emitting section. The wavelength conversion section contains a phosphor. The wavelength conversion section has a distribution of amount of the phosphor based on a distribution of wavelength of the light emitted from the light emitting section.
摘要:
A diffraction optical element is provided to reduce harmful lights and also suppress deterioration in the optical characteristics of the element. The diffraction optical element 22 is formed with a plurality of diffraction gratings 17′, 18′, 19′ and 20′. From these diffraction gratings, there are selected the diffraction gratings 18′, 19′ and 20′ whose groove apex angles are less than a predetermined angle. The diffraction gratings 18′, 19′ and 20′ has chamfer surfaces 18c′, 19c′ and 20c′ formed on the lower side of respective slanted surfaces 18a′, 19a′ and 20a′. The chamfer surfaces 18c′, 19c′ and 20c′ are slanted to the slanted surfaces 18a′, 19a′ and 20a′, respectively.
摘要:
A diffraction optical element is provided to reduce harmful lights and also suppress deterioration in the optical characteristics of the element. The diffraction optical element 22 is formed with a plurality of diffraction gratings 17′, 18′, 19′ and 20′. From these diffraction gratings, there are selected the diffraction gratings 18′, 19′ and 20′ whose groove apex angles are less than a predetermined angle. The diffraction gratings 18′, 19′ and 20′ has chamfer surfaces 18c′, 19c′ and 20c′ formed on the lower side of respective slanted surfaces 18a′, 19a′ and 20a′. The chamfer surfaces 18c′, 19c′ and 20c′ are slanted to the slanted surfaces 18a′, 19a′ and 20a′, respectively.
摘要:
A nozzle plate includes: a flow channel opening in a first surface of the nozzle plate; a liquid chamber communicating with the flow channel; and a nozzle hole communicating with the liquid chamber and opening in a second surface of the nozzle plate. The liquid chamber has a flat portion which is substantially parallel to the second surface. The nozzle hole communicates with the liquid chamber in the flat portion. A method for producing a nozzle plate includes: forming a liquid chamber which opens in a first surface of a plate-like body; forming a flat portion in a bottom of the liquid chamber; and forming a nozzle hole which communicates with the flat portion and opens in a second surface of the plate-like body.