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公开(公告)号：US20060276568A1
公开(公告)日：2006-12-07
申请号：US11505294
申请日：2006-08-17
IPC分类号： C08L63/00
CPC分类号： C08G59/5033 , C08G59/22 , C08G59/245 , C08L33/00 , C08L63/00 , C09K19/388 , C08L2666/04
摘要： This invention provides a thermosetting resin compound containing 25% or more by volume of anisotropic structure in the resin ingredient, wherein a structure constituting said anisotropic structure has a covalent bond and the maximum diameter of the structure is 400 nm or more. The resin ingredient of said thermosetting resin compound is preferably a hardened epoxy resin compound containing a mesogen-structured epoxy resin monomer and an epoxy resin hardening agent. The epoxy resin monomer in the thermosetting resin compound is preferably an epoxy resin monomer expressed by Formula (1) below E-M-S-M-E (1)(where E, M, and S respectively indicate an epoxy group, a mesogen group, and a spacer). Therefore, this invention can provide a highly thermal conductive hardened thermosetting resin compound whose thermal conductivity is increased highly.
摘要翻译： 本发明提供一种在树脂成分中含有25体积％以上的各向异性结构的热固性树脂化合物，其中构成所述各向异性结构的结构具有共价键，结构的最大直径为400nm以上。 所述热固性树脂化合物的树脂成分优选为含有介晶结构的环氧树脂单体和环氧树脂硬化剂的硬化环氧树脂化合物。 热固性树脂化合物中的环氧树脂单体优选为下述式（1）表示的环氧树脂单体<βin-line-formula description =“In-line Formulas”end =“lead”？> EMSME（1） in-line-formula description =“In-line Formulas”end =“tail”？>（其中E，M和S分别表示环氧基，介晶基和间隔基）。 因此，本发明可以提供导热性高的高导热硬化性热固性树脂化合物。
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公开(公告)号：US07109288B2
公开(公告)日：2006-09-19
申请号：US10477926
申请日：2001-05-18
CPC分类号： C08G59/5033 , C08G59/22 , C08G59/245 , C08L33/00 , C08L63/00 , C09K19/388 , C08L2666/04
摘要： This invention provides a thermosetting resin compound containing 25% or more by volume of anisotropic structure in the resin ingredient, wherein a structure constituting said anisotropic structure has a covalent bond and the maximum diameter of the structure is 400 nm or more. The resin ingredient of said thermosetting resin compound is preferably a hardened epoxy resin compound containing a mesogen-structured epoxy resin monomer and an epoxy resin hardening agent. The epoxy resin monomer in the thermosetting resin compound is preferably an epoxy resin monomer expressed by the following formula: E-M-S-M-E, wherein E, M, and S respectively indicate an epoxy group, a mesogen group, and a spacer. Therefore, this invention can provide a highly thermal conductive hardened thermosetting resin compound whose thermal conductivity is increased highly.
摘要翻译： 本发明提供一种在树脂成分中含有25体积％以上的各向异性结构的热固性树脂化合物，其中构成所述各向异性结构的结构具有共价键，结构的最大直径为400nm以上。 所述热固性树脂化合物的树脂成分优选为含有介晶结构的环氧树脂单体和环氧树脂硬化剂的硬化环氧树脂化合物。 热固性树脂化合物中的环氧树脂单体优选为由下式表示的环氧树脂单体：E-M-S-M-E，其中E，M和S分别表示环氧基，介晶基和间隔基。 因此，本发明可以提供导热性高的高导热硬化性热固性树脂化合物。
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3.发明授权Epoxy resin, epoxy resin composition, cured epoxy resin, and manufacturing method thereof 失效环氧树脂，环氧树脂组合物，固化环氧树脂及其制造方法公开(公告)号：US06765043B2
公开(公告)日：2004-07-20
申请号：US10246680
申请日：2002-09-19
IPC分类号： C08K310
CPC分类号： C08G59/02 , C09K19/3411
摘要： An epoxy resin that contains, in a molecule, two mesogens coupled by a folded chain, is provided using a method that ensures easy synthesis of such an epoxy resin, and a uniform epoxy resin composition is provided based on this epoxy resin. The epoxy resin includes a major compound having a structure expressed by the Chemical Formula (1), and a method is provided for manufacturing the epoxy resin by reaction of (A) an epoxy resin with one mesogen contained in a molecule and (B) a compound with two elements of active hydrogen contained in a molecule, with the percentage composition of (B) active hydrogen with respect to (A) epoxy group being 0.25 and over, up to and including 0.7.
摘要翻译： 使用确保容易合成这种环氧树脂的方法，在分子中含有通过折叠链耦合的两种介晶的环氧树脂，并且基于该环氧树脂提供均匀的环氧树脂组合物。 环氧树脂包括具有由化学式（1）表示的结构的主要化合物，并且提供了通过（A）环氧树脂与分子中所含的一个介晶的反应制备环氧树脂的方法，（B） 与分子中含有的活性氢的两个元素的化合物相对于（A）环氧基的（B）活性氢的组成百分比为0.25以上，至多且包括0.7。
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公开(公告)号：US5550209A
公开(公告)日：1996-08-27
申请号：US395889
申请日：1995-02-28
申请人： Shohei Inoue , Takuzo Aida , Masaki Akatsuka
发明人： Shohei Inoue , Takuzo Aida , Masaki Akatsuka
IPC分类号： C08G63/08 , C08G63/64 , C08G63/78 , C08G63/82 , C08G63/84 , C08G64/00 , C08G64/02 , C08G64/18 , C08G64/20 , C08G64/30 , C08L101/16 , C08G63/91
CPC分类号： C08G64/305 , C08G63/64 , C08G63/823
摘要： Disclosed are a lactone polymer, a carbonate polymer, a lactone-carbonate random or block copolymer which are mono-dispersed, that is, which have a molecular weight distribution of nearly 1, or, in which purity of a polymer component having a unitary structure is very high, and processes for the preparation thereof which comprise a ring-opening addition reaction of a lactone monomer and/or a cyclic carbonate monomer with a ring-opening initiator in the presence of an organic aluminum-based Lewis acid represented by general formula (I), ##STR1## wherein R is an alkyl group having a carbon number ranging from 1 to 4, Y is independently selected from a substituted group, and p is any one of 1, 2 and 3.
摘要翻译： 公开了单分散的分子量分布接近1的内酯聚合物，碳酸酯聚合物，内酯 - 碳酸酯无规或嵌段共聚物，或其中具有单一结构的聚合物组分的纯度 其制备方法包括在通式（I）表示的有机铝基路易斯酸存在下，内酯单体和/或环状碳酸酯单体与开环引发剂的开环加成反应 （I），其中R为碳数为1至4的烷基，Y独立地选自取代基，p为1,2和3中的任一个。
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公开(公告)号：US06261481B1
公开(公告)日：2001-07-17
申请号：US09267670
申请日：1999-03-15
申请人： Masaki Akatsuka , Yoshitaka Takezawa , Yuzo Ito
发明人： Masaki Akatsuka , Yoshitaka Takezawa , Yuzo Ito
IPC分类号： H01B318
CPC分类号： H05K1/0313 , C08G59/245 , C08L79/00 , C08L79/02 , C08L101/12 , H01B3/40 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/00
摘要： An insulating material of high electrically insulating properties and high thermal conductivity is provided wherein the high thermal conductivity is attained by having a liquid crystal resin comprising a polymerization product of a resin composition containing a monomer which has a mesogen group.
摘要翻译： 提供了具有高电绝缘性和高导热性的绝缘材料，其中通过具有包含含有具有介晶基团的单体的树脂组合物的聚合产物的液晶树脂来实现高热导率。
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公开(公告)号：US4266324A
公开(公告)日：1981-05-12
申请号：US107571
申请日：1979-12-27
申请人： Junzo Hasegawa , Susumu Kawabata , Hiroshi Niimi , Yasuhiko Suzuki , Masaki Akatsuka , Takahiko Tsunekawa
发明人： Junzo Hasegawa , Susumu Kawabata , Hiroshi Niimi , Yasuhiko Suzuki , Masaki Akatsuka , Takahiko Tsunekawa
CPC分类号： D01H5/42
摘要： Sliver weight unevenness correcting apparatus of a feed-forward type has: a sliver weight measuring section for detecting the variations in weight of a bundle of slivers; a correcting draft device having front rollers disposed downstream of the sliver weight measuring section relative to the direction of advancement of slivers, the front rollers being rotated at a constant speed, and back rollers disposed between the sliver weight measuring section and the front rollers, the back rollers being rotated at a variable speed; a rotation detector for detecting the number of revolutions of the front rollers; an unevenness correcting circuit having a ratio circuit for operating a ratio (E.sub.0 /E.sub.1) between a reference sliver weight (E.sub.0) and the detected weight (E.sub.1) thereof, a delay circuit for delaying the speed control of the back rollers of the correcting draft device for a predetermined period of time, and a contrasting operational circuit for multiplying the ratio (E.sub.0 /E.sub.1) and a ratio (N.sub.F /k) between the number (N.sub.F) of revolutions of the front rollers and a reference draft value (k) and for producing a multiplied signal (E.sub.0 /E.sub.1 .multidot. N.sub.F /k); and a speed control circuit for producing a speed control signal responsive to the multiplied signal to control the speed of back rollers through a rotation transmitting mechanism. This arrangement enables accurate correction of sliver weight unevenness even short in wavelength in a drawing frame running at a high speed.
摘要翻译： 前馈式的条子重量不均匀性校正装置具有：条子重量测量部分，用于检测条束重量的变化; 校正牵伸装置，其具有相对于条子前进方向设置在条子重量测量部分的下游的前辊，前辊以恒定速度旋转，以及设置在条子重量测量部分和前辊之间的后辊， 后辊以可变速度旋转; 旋转检测器，用于检测前辊的转数; 不平坦校正电路，具有用于操作参考条子重量（E0）与检测到的重量（E1）之间的比率（E0 / E1）的比率电路，延迟电路，用于延迟校正纸张的后辊的速度控制 装置，以及用于将前轮的转数（NF）与参考吃水值（k）之比（E0 / E1）和比（NF / k）之比的对比运算电路， 并产生相乘信号（E0 / E1x NF / k）; 以及速度控制电路，用于响应于相乘的信号产生速度控制信号，以通过旋转传递机构来控制后滚筒的速度。 这种布置使得能够精确地校正在高速运行的绘图框中甚至短波长的条子重量不均匀性。
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