公开(公告)号：US5021269A

公开(公告)日：1991-06-04

申请号：US323094

申请日：1989-03-13

申请人： Masanao Kono ,  Yoshihiro Hasegawa ,  Yasutaka Nishi ,  Hisao Irie ,  Tatsuji Mizuta ,  Shinsuke Ohara

发明人： Masanao Kono ,  Yoshihiro Hasegawa ,  Yasutaka Nishi ,  Hisao Irie ,  Tatsuji Mizuta ,  Shinsuke Ohara

IPC分类号： C23C18/08 ,  H05K3/10 ,  H05K3/24 ,  H05K3/34

CPC分类号： C23C18/08 ,  H05K3/3473 ,  H05K2203/0776 ,  H05K2203/0783 ,  H05K2203/1105 ,  H05K2203/125 ,  H05K3/105 ,  H05K3/244 ,  H05K3/3494

摘要： A method for forming a metal film on the surface of a substrate metal, which comprises soaking a substrate metal or a non-metal support carrying the substrate metal thereon in a solution of a metal salt in a high boiling point solvent under heating conditions, characterized in that the metal salt is a salt of the metal to be formed on the surface of the substrate metal with an acidic substance selected from an organic carboxylic acid, a rosin and a rosin derivative. The metal is precipitated from the solution exclusively on the surface of the substrate metal without forming any solid metal particle in the solution or on the substrate metal. Thus, the method is applicable to the formation of a soldering alloy as a film on the surface of a substrate metal without leaving thereon any free metal particle which may cause short circuits in electronic circuits. The method can thus be applied advantageously to the manufacture of electronic elements having a metal film thereon and high density printed circuits, and thus is also useful in the field of electronic industry.

摘要翻译： 一种在基板金属表面上形成金属膜的方法，其特征在于，在加热条件下，将金属盐在金属盐溶解在高沸点溶剂中的步骤中浸渍载有其上的基板金属的基板金属或非金属载体， 其特征在于，所述金属盐是在所述基材金属的表面上形成的金属与选自有机羧酸，松香和松香衍生物的酸性物质的盐。 金属从溶液中仅沉积在基底金属的表面上，而不在溶液中或在基底金属上形成任何固体金属颗粒。 因此，该方法适用于在基板金属的表面上形成作为膜的焊接合金，而不会留下可能导致电子电路短路的任何自由金属颗粒。 因此，该方法可有利地应用于其上具有金属膜的电子元件的制造和高密度印刷电路，因此也可用于电子工业领域。

公开(公告)号：US5059272A

公开(公告)日：1991-10-22

申请号：US343722

申请日：1989-04-27

申请人： Masanao Kono ,  Yoshihiro Hasegawa ,  Yasutaka Nishi ,  Yasuyoshi Sanada ,  Tatsuji Mizuta ,  Ryo Inoue ,  Shinsuke Ohara

发明人： Masanao Kono ,  Yoshihiro Hasegawa ,  Yasutaka Nishi ,  Yasuyoshi Sanada ,  Tatsuji Mizuta ,  Ryo Inoue ,  Shinsuke Ohara

IPC分类号： C08K5/09 ,  C07C51/41 ,  C08K5/098 ,  C08L93/00 ,  C08L93/04 ,  C08L101/00 ,  C09J5/06 ,  C09J9/02 ,  C09J11/06 ,  C09J193/00 ,  C09J193/04 ,  C09J201/00 ,  H01B1/20 ,  H02G15/103 ,  H05K3/00 ,  H05K3/32

CPC分类号： H01B1/20 ,  C07C51/412 ,  C08K5/098 ,  H02G15/103 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2203/121 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T428/31536

摘要： A conductive high molecular composition which comprises a non-conductive polymer component incorporated with a metal salt, characterized in that the metal salt is a salt of a metal with an acid substance selected from an organic carboxylic acid, rosin and a rosin derivative. This composition has an insulating property in normal state but functions as an electroconductive material only in the event it is interposed between slightly spaced metals and heated. Thus, the composition can be used not only as an insulating binder but also for imparting conductivity only in the desired spots of electronic parts, keeping the other areas of the parts electrically insulated. The composition thus possessing a specific dual function is particularly useful in the field of electronic industry.

公开(公告)号：US4851153A

公开(公告)日：1989-07-25

申请号：US51524

申请日：1987-05-19

申请人： Masanao Kono ,  Yoshihiro Hasegawa ,  Yasutaka Nishi ,  Yasuyoshi Sanada ,  Tatsuji Mizuta ,  Ryo Inoue ,  Shinsuke Ohara

发明人： Masanao Kono ,  Yoshihiro Hasegawa ,  Yasutaka Nishi ,  Yasuyoshi Sanada ,  Tatsuji Mizuta ,  Ryo Inoue ,  Shinsuke Ohara

IPC分类号： C08K5/09 ,  C07C51/41 ,  C08K5/098 ,  C08L93/00 ,  C08L93/04 ,  C08L101/00 ,  C09J5/06 ,  C09J9/02 ,  C09J11/06 ,  C09J193/00 ,  C09J193/04 ,  C09J201/00 ,  H01B1/20 ,  H02G15/103 ,  H05K3/00 ,  H05K3/32

CPC分类号： H01B1/20 ,  C07C51/412 ,  C08K5/098 ,  H02G15/103 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2203/121 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T428/31536

摘要： A conductive high molecular composition which comprises a non-conductive polymer component incorporated with a metal salt, characterized in that the melt salt is a salt of a metal with an acid substance selected from an organic carboxylic acid, rosin and a rosin derivative. This composition has an insulating property in the normal state but functions as an electroconductive material only in the event it is interposed between slightly spaced metals and heated. Thus, the composition can be used not only as an insulating binder but also for imparting conductivity only in the desired spots of electronic parts, keeping the other areas of the parts electrically insulated. The composition thus possessing a specific dual function is particularly useful in the electronic industry field.

摘要翻译： 一种导电高分子组合物，其包含掺入金属盐的非导电聚合物组分，其特征在于所述熔融盐是金属与选自有机羧酸，松香和松香衍生物的酸性物质的盐。 该组合物在正常状态下具有绝缘性能，仅在介于稍微间隔的金属之间并加热时用作导电材料。 因此，该组合物不仅可用作绝缘粘合剂，而且可用于仅在电子部件的所需点中赋予导电性，从而保持部件的其它区域电绝缘。 因此，具有特定双重功能的组合物在电子工业领域中是特别有用的。